Abstract: A display device includes a stacked structure and an outer frame fixedly receiving the stacked structure therein. The stacked structure includes an intelligence light adjustment layer, a display module, and a light-transmitting reflective layer interposed between the display module and the intelligence light adjustment layer. The intelligence light adjustment layer is configured to present one of a first state or a second state, which are different from each other, based on whether electrical power is applied to the intelligence light adjustment layer. The display module projects display images through the intelligence light adjustment layer in the first state. When the intelligence light adjustment layer is in the second state, the color of the outer frame is the same as the color of the intelligence light adjustment layer.

Abstract: The total silicon area used by a plurality of high voltage transistors in an array of NAND cells is reduced by modifying the silicon area layout such that the size of the source and drain of each of the plurality of high voltage transistors is dependent on the maximum voltage to be applied to each of the source and drain for the respective one of the plurality of high voltage transistors.

Abstract: An Anti-lock Braking System and control method are disclosed. The control method is performed after a control module intervenes a vehicle's braking system and comprises: receiving a wheel speed signal of a wheel and a vehicle acceleration signal; computing a tire-slip feedback value according to the wheel speed signal of the wheels and the vehicle acceleration signal; generating a feedback control voltage according to a tire-slip difference between a tire-slip target value and the tire-slip feedback value; generating a tire-slip compensation value by performing a differential compensation to the tire-slip feedback value; obtaining a feedforward voltage according to the tire-slip compensation value via a look-up table approach; generating a braking control voltage by adding the feedback control voltage to the feedforward voltage; and outputting the braking control voltage to a proportioning-valve brake, such that the proportioning-valve brake adjusts a braking pressure according to the braking control voltage.

Abstract: A gas turbine component includes a substrate and a corrosion resistant layer coupled to the substrate. The corrosion resistant layer includes zirconium silicate and is configured to protect the substrate from exposure to a vanadium corrodent.

Abstract: An electronic device includes a substrate, at least one electronic element and a heat dissipating electromagnetic shielding structure. The heat dissipating electromagnetic shielding structure is disposed on the substrate and covers the at least one electronic element, wherein the heat dissipating electromagnetic shielding structure includes a shielding frame and a heatsink. The shielding frame includes a plurality of spring members. The spring members are bent toward the substrate and partially abut against the heatsink. When the heatsink and the shielding frame are correspondingly arranged, a shielding space is defined, the electronic element is disposed in the shielding space, and a heat generated by the at least one electronic element is conducted out of the shielding space via the heatsink.

Abstract: A multi-chip package structure includes outer leads, a first chip and a second chip. The outer leads are disposed on a side of a chip bonding area of a package carrier thereof. The first chip is fixed on the chip bonding area and includes a core and a seal ring. Input/output units, and first bonding pads are disposed, in an outward order, on at a side of the core. Each first bonding pad is electrically connected to a corresponding outer lead through a first wire. Dummy pads are disposed between the input/output units and adjacent first bonding pads on the side of the core. The second chip is stacked on the core and includes second bonding pads connected to the corresponding outer leads through second wires and dummy pads, so as to prevent from short circuit caused by soldering overlap and contact between the wires.

Abstract: A sterilization device with dose function is provided. The sterilization device includes a sterilization container, an ultraviolet sterilization module, an ozone sensing module, a sterilization time counter, a dose controller and an ozone removal module. The ultraviolet sterilization module is disposed in the sterilization container to sterilize an article by emitting an ultraviolet light. The ozone sensing module is used to sense an ozone concentration of the sterilization container. The sterilization time counter is used to calculate a sterilization time. The dose controller is used to receive a sensing signal of the ozone concentration and a counting signal of the sterilization time to obtain an ozone dose. The ozone removal module is disposed in the sterilization container to remove or purify the ozone and reduce the ozone concentration in the sterilization container.

Abstract: A multi-chip package structure includes outer leads, a first chip and a second chip. The outer leads are disposed on four sides of a chip bonding area of a package carrier thereof, respectively. The first chip is fixed on the chip bonding area and includes a core and a seal ring. Input/output units, and first bonding pads are disposed, in an outward order, on the sides of the core. Each first bonding pad is electrically connected to a corresponding outer lead through a first wire. Dummy pads are disposed between the input/output units and the at least one side of the core. The second chip is stacked on the core and includes second bonding pads connected to the corresponding outer leads through second wires and dummy pads, so as to prevent from short circuit caused by soldering overlap and contact between the wires.

Abstract: Multichip package manufacturing process is disclosed to form external pins at one side or each side of die-bonding area of package carrier board and to bond first IC and second IC to die-bonding area in stack. First IC and second IC each comprise transistor layer with core circuits, plurality of metal layers, plurality of VIA layers and solder pad layer. During production of first IC, design of at least one metal layer, VIA layer and dummy pads can be modified according to change of design of second IC. After chip probing, die sawing and bonding, wire bonding, packaging and final test are performed to package the package carrier board, first IC and second IC into automotive multichip package, achieving purpose of first IC only need to modify at least one layer or more than one layer to cooperate with second IC design change to carry out multichip packaging process.

Abstract: The present disclosure is related to a touch technology field and provides a backlight module and a touch display device using the backlight module. The backlight module includes a substrate, plural driving electrode lines, plural receiving electrode lines, and plural light sources. The driving electrode lines are disposed on the substrate. The receiving electrode lines are disposed on the substrate, in which the receiving electrode lines and the driving electrode lines define plural light source regions on the substrate. The lights sources are disposed in the light source regions, in which each of the light source regions includes at least one of the light sources. The touch display device includes the backlight module and a display panel. The backlight module is configured to provide backlight light. The display panel is disposed on the backlight module to use the backlight light to display images.

Abstract: A touch display module has plural sensors and includes an integrated frame, a backlight module, a thin film transistor substrate, a color filter, and a polarizer. The integrated frame has a bottom plate portion and a side plate portion, and the side plate portion stands on the bottom plate portion. The backlight module is disposed on the bottom plate portion. The thin film transistor substrate is disposed on the backlight module. The color filter is disposed on the thin film transistor substrate. The polarizer is disposed on the color filter. One surface of the polarizer is an outer surface of the touch display module. The thin film transistor substrate and/or the color filter is connected to the side plate portion of the integrated frame. Therefore, by using the integrated frame to integrate required components into one mechanical part, the touch display module has thinner thickness and lighter weight.

Abstract: A system and a method for compensating uniformity of brightness are provided. The system includes an edge-type backlight assembly, a display panel, a brightness sensor, a compensating calculator, and a local dimming controller. The display panel is disposed above the edge-type backlight assembly. The display panel includes plural regions for local dimming. The brightness sensor is configured to measure whether the brightness distribution of the display panel is uniform. When the brightness distribution of the display panel is not uniform, the compensating calculator calculates a brightness compensation value corresponding to each of the regions of the display panel. The local dimming controller is configured to drive the edge-type backlight assembly according to the brightness compensation value corresponding to each of the regions of the display panel.

Abstract: A composite connector for optical power meter is provided, which includes a fixation base and an active connection base. The fixation base is installed on an optical power meter; the fixation base includes a left hole, a right hole and a central hole. The active connection base includes a bottom plate, an active pin, a first fiber socket and a second fiber socket. The first fiber socket and the second fiber socket are disposed on the bottom plate. The active pin penetrates through the bottom plate and is inserted into the left hole, whereby a first circle, whose center is at the active pin and circumference passes through the first fiber socket as well as the second fiber socket, overlaps a second circle, whose center is at the left hole and circumference passes through the central hole, in the normal direction of the active connection base.

Abstract: A method of preparing polyester elastomer meltblown nonwoven fabric membrane with porous and high bonding strength includes the following steps of: (a) Adding a reaction solvent to a reaction solvent to thermoplastic polyester elastomer (TPEE) powder or granules to prepare a solvent mixture. (b) Adding a modifier to the solvent mixture, and mixing uniformly to prepare a first mixture, the modifier includes at least one of o-xylylenediamine, m-xylylenediamine, alpha, alpha?-diamino-p-xylene, 2,3,5,6-Tetrachloro-p-xylene-alpha,alpha?-diamine, and 1,3,5,7-Tetraazatricyclodecane. (c) Adding an initiator to the first mixture, and mixing uniformly to prepare a second mixture. (d) Drying the second mixture to form a masterbatch, and (e) preparing the polyester elastomer meltblown nonwoven fabric membrane by passing the masterbatch through a meltblown process.

Abstract: A method of preparing thermoplastic polyester elastomer membrane with high binding strength includes the following steps: (a) Adding a reaction solvent to TPEE powder or granules to prepare a solvent mixture, (b) Adding a modifier to the solvent mixture, and mixing uniformly to prepare a first mixture, the modifier including at least one of o-xylylenediamine, m-xylylenediamine, alpha,alpha?-diamino-p-xylene, 2,3,5,6-Tetrachloro-p-xylene-alpha,alpha?-diamine, and 1,3,5,7-Tetraazatricyclodecane. (c) Adding an initiator to the first mixture, and mixing uniformly to prepare a second mixture, (d) Obtaining a finished product by passing the second mixture through an injection laminating process.

Abstract: A method of preparing self-adhesive polyester elastomer composite membrane includes the following steps. Adding methyl formate or ethyl acetate to thermoplastic polyester elastomer (TPEE) powder or granules and mix well. Adding a modifier and adding a photo initiator or a thermal initiator, and then mixing uniformly to prepare a mixture. Drying the mixture to prepare a polyester elastomer membrane through an injection laminating process. Preparing pressure sensitive adhesive. Pasting the pressure sensitive adhesive on one side of the polyester elastomer membrane.

Abstract: An electronic package is provided and has a packaging substrate including a ground pad and a power pad. The power pad surrounds at least three directions of the ground pad so as to increase the footprint of the power pad on the packaging substrate, thereby avoiding cracking of an electronic element disposed on the packaging substrate and effectively reducing the voltage drop.

Abstract: A method of preparing a thermoplastic polyurethane membrane with high adhesion and high elasticity includes the following steps: (a) preparing a modifying solution, wherein the modifying solution is one or a mixture of at least two of diethylenetriamine, diethylaminopropylamine, and diaminodiphenylmethane; (b) preparing a semi-finished product by applying the modifying solution on at least one surface of a thermoplastic polyurethane membrane; and (c) subjecting the semi-finished product to a temperature of 50° C.˜180° C. in order for the semi-finished product to undergo a reaction and thus form the thermoplastic polyurethane membrane with high adhesion and high elasticity.

Abstract: A data writing method, a memory control circuit unit, and a memory storage apparatus are provided. The method includes: receiving a write command from a host system; and determining whether to write a data corresponding to the write command into a first area or a second area according to a write amplification factor of the first area, where if it is determined to write the data into the second area, copying the written data to the first area after writing the data.

Abstract: An electronic device is disclosed. The electronic device includes a display unit, a light sensor, and a processor. The display unit has a brightness value. The light sensor senses an ambient light to generate a light intensity signal. The processor is coupled to the display unit and the light sensor and accesses a program instruction from a memory to perform the following steps: continuously receiving the light intensity signal from the light sensor; smoothing a plurality of light intensity signals to generate a plurality of smoothing signals; and maintaining the brightness value of the display unit for a preset time period and then determining whether to adjust the brightness value when a difference generated by subtracting a previous smoothing signal of a target smoothing signal of the smoothing signals from the target smoothing signal is less than the first threshold or greater than the second threshold.