Patents by Inventor Chuan Wang

Chuan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10142678
    Abstract: A video processing device capable of automatically determining an operation mode is provided. The video processing device includes a control signal processing circuit and a controller. The control signal processing circuit receives a control signal from a transmitter, and, according to at least one data access address indicated by the control signal, performs at least steps of determining whether the data access address satisfies a predetermined access address, and outputting a notification signal when the data access address satisfies the predetermined access address. The controller causes the video processing device to operate in a first mode according to the notification signal, and causes the video processing device to operate in a second mode when the notification signal is not received within a predetermined time interval.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: November 27, 2018
    Assignee: MSTAR SEMICONDUCTOR, INC.
    Inventors: Chin-Lung Lin, Te-Chuan Wang, Chi-En Peng
  • Publication number: 20180330150
    Abstract: A face identification module includes a substrate. The substrate has a first plane face. On the first place face are disposed a first lens assembly, a second lens assembly, an infrared LED assembly and an image processor, which are respectively electrically connected with the substrate. The infrared LED assembly includes a first infrared LED and a second infrared LED. The first infrared LED and the second infrared LED are adjacently disposed on left and right sides of the second lens assembly. In the face identification module, the video function and the face identification function are integrated to save arrangement space and achieve a multiplex face identification module.
    Type: Application
    Filed: May 12, 2017
    Publication date: November 15, 2018
    Inventors: Wei-Chuan Wang, Xin-Lian Cheng, Ting-Yu Lin, Chih-Liang Yeh
  • Publication number: 20180319964
    Abstract: Shrink films made from metallocene-catalyzed polyethylene polymers and processes for making the same are disclosed.
    Type: Application
    Filed: December 20, 2016
    Publication date: November 8, 2018
    Inventors: Stefan B. OHLSSON, Wen LI, Etienne R.H. LERNOUX, Jianya CHENG, Xiao-Chuan WANG
  • Publication number: 20180318619
    Abstract: An extinguisher management system includes a fire extinguisher, a management server and a maintenance server. The fire extinguisher transmits a notification signal when a measured pressure thereof is beyond a predetermined pressure range. The management server includes a wireless receiver for receiving the notification signal from the fire extinguisher, and a database storing an apparatus data set corresponding to the fire extinguisher. The management server outputs an apparatus information in the apparatus data set in response to receipt of the notification signal. The maintenance server is configured to update a to-be-maintained list according to the apparatus information received from the management server.
    Type: Application
    Filed: May 5, 2017
    Publication date: November 8, 2018
    Inventors: Kuo-Chi CHANG, Hsiao-Chuan WANG, Kai-Chun CHU, Tsui-Lien HSU
  • Patent number: 10122332
    Abstract: A wireless communication device includes a first low-noise amplifier (LNA). The wireless communication device also includes a first LNA load circuit coupled to an output of the LNA. The wireless communication device further includes a power splitter switchably coupled to the first LNA load circuit. The power splitter includes a negatively coupled transformer and is switchably coupled to multiple outputs.
    Type: Grant
    Filed: May 26, 2017
    Date of Patent: November 6, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Serkan Sayilir, Chuan Wang, Kevin Hsi Huai Wang
  • Patent number: 10123044
    Abstract: A partial decoding circuit with inverse second transform has a transpose buffer, a first-direction inverse residual transform circuit, and a second-direction inverse residual transform circuit. The transpose buffer stores an intermediate inverse residual transform result. The first-direction inverse residual transform circuit processes an inverse quantization output to generate the intermediate inverse residual transform result to the transpose buffer. The second-direction inverse residual transform circuit accesses the transpose buffer to retrieve the intermediate inverse residual transform result, and processes the intermediate inverse residual transform result to generate a final inverse residual transform result, where the final inverse residual transform result of the inverse second transform is further processed by an inverse transform circuit.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: November 6, 2018
    Assignee: MEDIATEK INC.
    Inventors: Min-Hao Chiu, Yu-Chuan Wang, Yung-Chang Chang
  • Publication number: 20180315712
    Abstract: Provided is an embedded substrate package structure, including, from top to bottom, a fourth dielectric layer, a second substrate, a chip with a fifth dielectric layer, a third dielectric layer, a second dielectric layer, a first substrate and a first dielectric layer; wherein the substrates are disposed respectively with wire layers and through holes, and each of dielectric layers is disposed with openings, conductive bumps or conductive pads, wire layers, through holes, and chip to collectively form electrical connection. The chip is electrically connected to the substrate in a flip-chip manner, and the back of the chip interfaces a dielectric layer. Compared to the prior art which chip bonding is in face-up mode, the packaging structure with the face-down chip of the present invention can simplify the manufacturing process by the flip-chip method.
    Type: Application
    Filed: November 20, 2017
    Publication date: November 1, 2018
    Inventors: Sung-Lien He, Chun-Yuan Hou, Tung-Chuan Wang, Hsi-Ying Yuan, Feng-Yi Chang
  • Patent number: 10114274
    Abstract: A heat dissipation module includes a heat dissipation fin set. The heat dissipation fin set includes a plurality of heat dissipation fins, wherein these heat dissipation fins are stacked on each other, and each of the heat dissipation fins has a front side, a rear side opposite to the front side and at least one turbulent structure set. The turbulent structure set is located between the front side and the rear side and includes a plurality of first turbulent structures. The first turbulent structures are arranged from the front side to the rear side in sequence. A heat dissipation airflow flows from the front side toward the turbulent structure set along a flowing direction, and passes through the turbulent structure set to flow toward the rear side. An extending direction of each of the first turbulent structures is tilted relative to the flowing direction.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: October 30, 2018
    Assignee: Coretronic Corporation
    Inventors: Chi-Chuan Wang, Po-Sheng Huang, Shang-Hsuang Wu, Tsung-Ching Lin, Wen-Yen Chung, Jhih-Hao Chen
  • Patent number: 10115673
    Abstract: Provided is an embedded substrate package structure, including, from top to bottom, a fourth dielectric layer, a second substrate, a chip with a fifth dielectric layer, a third dielectric layer, a second dielectric layer, a first substrate and a first dielectric layer; wherein the substrates are disposed respectively with wire layers and through holes, and each of dielectric layers is disposed with openings, conductive bumps or conductive pads, wire layers, through holes, and chip to collectively form electrical connection. The chip is electrically connected to the substrate in a flip-chip manner, and the back of the chip interfaces a dielectric layer. Compared to the prior art which chip bonding is in face-up mode, the packaging structure with the face-down chip of the present invention can simplify the manufacturing process by the flip-chip method.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: October 30, 2018
    Inventors: Sung-Lien He, Chun-Yuan Hou, Tung-Chuan Wang, Hsi-Ying Yuan, Feng-Yi Chang
  • Publication number: 20180307898
    Abstract: A face identification camera module includes a circuit board, a camera device, at least one infrared LED light-emitting unit, an image processor and a connector. The respective units are disposed on a first side of the circuit board and electrically connected with the circuit board. The infrared LED light-emitting unit is disposed on left and right sides of the camera device. The infrared LED light-emitting unit serves to enhance the brightness, uniformity and contrast of the image so that a higher identification ratio can be achieved and a higher-definition face feature identification effect can be obtained by the camera device.
    Type: Application
    Filed: April 24, 2017
    Publication date: October 25, 2018
    Inventors: Wei-Chuan Wang, Xin-Lian Cheng, Ting-Yu Lin, Chih-Liang Yeh
  • Publication number: 20180273903
    Abstract: Provided herein are genetically modified (GM) natural killer (NK) cells and methods of producing populations of GM NK cells. Further provided herein are methods of using the GM NK cells described herein, to, e.g., suppress the proliferation of tumor cells, or to inhibit pathogen infection, e.g., viral infection. In certain alternatives, GM NK cells provided herein lack expression of CBLB, NKG2A and/or TGFBR2 and/or function or show reduced expression and/or function of CBLB, NKG2A and/or TGFBR2. In certain alternatives, GM NK cells provided herein comprise modified CD16.
    Type: Application
    Filed: December 28, 2017
    Publication date: September 27, 2018
    Applicant: Celularity, Inc.
    Inventors: Xiaokui Zhang, Qian Ye, Tianjian Li, Chuan Wang, Mini Bharathan, Uri Herzberg
  • Patent number: 10082349
    Abstract: A heat conducting module includes a main body. The main body includes a first surface and a second surface. The first surface is thermally connected to a heat absorbing body. The second surface is opposite to the first surface and is fluidly connected to a channel. The second surface has a plurality of grooves disposed along a direction. The channel allows a fluid to flow a long the direction. Each of the grooves includes a first sub-groove and at least one second sub-groove. The first sub-groove at least has a third surface close to the first surface. The first sub-groove at least partially communicates with the second sub-groove, and the second sub-groove is at least partially fluidly connected with the third surface.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: September 25, 2018
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Chi-Chuan Wang, Kuo-Wei Lin
  • Publication number: 20180265657
    Abstract: Provided are films such as high-stalk films made from polyethylene polymers, and methods for making these films. Such films preferably have at least one of the following properties: (a) MD 1% Secant Modulus of less than 400 MPa, (b) Elmendorf Tear MD of at least 100 g/mil, (c) Dart drop of at least 200 g/mil, (d) puncture resistance break energy of at least 120 mJ/?m, (e) TD shrink at 150° C. of at least 40% or at least 30% at 120° C.; and (f) haze value of less than 40%.
    Type: Application
    Filed: December 20, 2016
    Publication date: September 20, 2018
    Inventors: Wen Li, Xiao-Chuan Wang
  • Publication number: 20180266724
    Abstract: A dehumidification device with enhanced dehumidification effect includes a gas cooler receiving a first air gas and condensing the first air gas into a first condensing gas and a first condensing liquid. A heat exchanger has an inlet and an outlet. The first condensing gas flows from the gas cooler to a periphery of the heat exchanger to cool the heat exchanger. The inlet receives a second air gas from outside. The second air gas is condensed into a second condensing gas and a second condensing liquid using the cooled heat exchanger, and the second condensing gas and the second condensing liquid are expelled from the outlet. A gas heater receives the first condensing gas flowing through the periphery of the heat exchanger and the second condensing gas expelled from the outlet, and heats and turns them into dry air, and the gas heater expels the dry air.
    Type: Application
    Filed: March 15, 2018
    Publication date: September 20, 2018
    Inventors: CHI-CHUAN WANG, CHUANG-HUI CHIU
  • Publication number: 20180262682
    Abstract: A panoramic camera device includes: a first substrate having a first surface and an opposite second surface, a first camera module being disposed on the first surface, a first connection port being disposed on the second surface; and a second substrate having a third surface and a fourth surface opposite to the third surface. The fourth surface faces the second surface. A second camera module and a signal output port are disposed on the third surface. A second connection port is disposed on the fourth surface. The first connection port is connected with the second connection port. The first camera module on the first surface and the second camera module on the third surface are back-to-back arranged. The first and second camera modules are positioned in the same optical axis. The signal output port serves to output the image signals generated by the first and second camera modules.
    Type: Application
    Filed: March 9, 2017
    Publication date: September 13, 2018
    Inventors: Wei-Chuan Wang, Jing-Xia Pei, Huan Deng
  • Publication number: 20180252900
    Abstract: A zoom lens includes a first lens group with a negative refractive power, a second lens group with a positive refractive power, and an aperture stop disposed in and movable with the second lens group. Each of the first lens group and the second lens group moves individually. The zoom lens further includes a doublet lens disposed on a first side of the aperture stop and between the first lens group and the aperture stop, and at most two lenses including at least one aspheric lens are disposed on a second side of the aperture stop.
    Type: Application
    Filed: March 2, 2018
    Publication date: September 6, 2018
    Inventors: Hung-You CHENG, Kuo-Chuan WANG, Yu-Hung CHOU
  • Patent number: 10037742
    Abstract: The present disclosure relates to a method and an apparatus for displaying health data collected by a wearable device. The method may include acts performed by the wearable device: collecting health data of a user; establishing a wireless connection with a home media playing device; and sending the health data to the home media playing device through the wireless connection for display. The wearable device includes: a data collection module, a connection establishing module and a data sending module. By collecting health data of a user, establishing a wireless connection with a home media playing device, sending the health data to the home media playing device through the wireless connection, and displaying the health data by the home media playing device, the user operation is simplified, and the utilization efficiency is improved.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: July 31, 2018
    Assignee: XIAOMI INC.
    Inventors: Chuan Wang, Yongfeng Xia, Pengfei Zhang, Heng Qu
  • Publication number: 20180213129
    Abstract: A camera module includes a circuit board, a camera device and an image processing chip. An image sensation chip of the camera device is directly integrated with the circuit board by means of chip-on-board (COB) manufacturing process to minify the total volume of the camera module, whereby the camera module can be disposed in a narrow space.
    Type: Application
    Filed: January 26, 2017
    Publication date: July 26, 2018
    Inventors: Wei-Chuan Wang, Xin-Lian Cheng, Ting-Yu Lin, Chun-Mei Zhang, Chin-Lian Yeh
  • Publication number: 20180205883
    Abstract: A camera module includes a first and a second photographing member, and a circuit substrate. The circuit substrate has a first lateral side and an opposite second lateral side, and a plurality of circuits. The first and the second photographing member is provided on the first and the second lateral side of the circuit substrate respectively and electrically connected to the circuit substrate. With these arrangements, the camera module can have overall reduced volume and is able to photographing a 360-degree panoramic image and lower the manufacturing cost.
    Type: Application
    Filed: January 15, 2017
    Publication date: July 19, 2018
    Inventors: Wei-Chuan Wang, Jing-Xia Pei, Huan Deng
  • Patent number: D823271
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: July 17, 2018
    Assignee: XIAOMI INC.
    Inventors: Xijie Shen, Zhaopeng Cheng, Weihao Wang, Jie Yu, Jiankun Jiang, Chuan Wang