Patents by Inventor Chuan Yu

Chuan Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7782418
    Abstract: A backlight module includes a frame, an optical element, a bottom plate, a holder, and a light source. The optical elements are located on the frame and a space between the sidewall of the frame and the optical elements. The bottom plate located under the optical elements. The light source is on the holder inserted into the space, The holder is inserted into the space along the direction toward the bottom surface of the bottom plate, and is removed from the space along the opposing direction.
    Type: Grant
    Filed: March 5, 2008
    Date of Patent: August 24, 2010
    Assignee: AU Optronics Corporation
    Inventors: Therm-Hoo Ke, Ying-Feng Hsu, Chi-Chun Yang, Li-Chuan Yu, Tzu-Yi Liu, Tung-Liang Shao, Tung-I Yen, Shih-Chang Chang
  • Publication number: 20100195223
    Abstract: A miniature magnetic-levitated lens driving device includes a lid, a casing, a lens module, a plate spring, and a magnetic-levitated module. The lid has a hollow structure and is coupled to the casing. The casing is formed therein with a receiving space. The lens module is provided in the receiving space. The plate spring is fixed between the lid and the casing and configured to resiliently confine the lens module to the receiving space. The magnetic-levitated module is provided in the receiving space and corresponds in position to the lens module. A magnetic repulsive force is produced by and between the magnetic-levitated module and the lens module, and in consequence the lens module is magnetically suspended in the receiving space formed by the lid and the casing, so as to save power, and minimize friction and microparticles.
    Type: Application
    Filed: January 22, 2010
    Publication date: August 5, 2010
    Inventors: Chi Lone Chang, Chuan Yu Hsu, Wen Tsai Hsu, Chi Tai Meng
  • Patent number: 7759461
    Abstract: Expression system for enhancing solubility and immunogenicity of recombinant proteins. The expression system includes a protein expression vector that contains a chimeric gene encoding a chimeric protein comprising: (a) a first polypeptidyl fragment at the N-terminal end of the chimeric protein, containing a protein transduction domain (PTD), or a fragment thereof, having HIV Tat PTD activity; (b) a second polypeptidyl fragment at the C-terminal end of the first polypeptidyl fragment, containing a J-domain, or a fragment thereof, having heat shock protein 70 (Hsp70)-interacting activity; and (c) a third polypeptidyl fragment at the C-terminal end of the second polypeptidyl fragment, containing a target protein or polypeptide.
    Type: Grant
    Filed: March 18, 2009
    Date of Patent: July 20, 2010
    Assignees: Stresspro Biomedicine Incorporation, Animal Technology Institute Taiwan
    Inventors: Ming-Yu Chen, Chin-Kai Chuang, Yu-Hsyu Su, Chiu-Ting Fan, Jung-Chuan Yu, Wen-Chuan Lee
  • Publication number: 20100154871
    Abstract: A substrate for counter electrode of dye-sensitized solar cell is made of a composite material, which is prepared by: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein 0.01-10 wt % of an electrically conductive filler, based on the weight of the vinyl ester resin, is optionally added during the compounding; b) molding the BMC material from step a) to form a substrate for the counter electrode having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: October 14, 2009
    Publication date: June 24, 2010
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Chuan-Yu Yen, Shu-Hang Liao, Ming-Yu Yen, Min-Chien Hsiao
  • Publication number: 20100147565
    Abstract: A window ball grid array substrate and its package structure includes a package substrate with a long slot arranged thereon, wherein the improvement is characterized by the long slot penetrating an end of the package substrate making the package substrate appear to be U-shaped.
    Type: Application
    Filed: December 12, 2008
    Publication date: June 17, 2010
    Inventors: Wen-Jeng Fan, Ching-Wei Hung, Tsai-Chuan Yu
  • Patent number: 7732921
    Abstract: A window-type BGA semiconductor package is revealed, primarily comprising a substrate with a wire-bonding slot, a chip disposed on a top surface of the substrate, and a plurality of bonding wires passing through the wire-bonding slot. A plurality of plating line stubs are formed on a bottom surface of the substrate, connect the bonding fingers on the substrate and extend to the wire-bonding slot. The bonding wires electrically connect the bonding pads of the chip to the corresponding bonding fingers of the substrate. The plating line stubs are compliant to the wire-bonding paths of the bonding wires correspondingly connected at the bonding fingers, such as parallel to the overlapped arrangement, to avoid electrical short between the plating line stubs and the bonding wires with no corresponding relationship of electrical connections.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: June 8, 2010
    Assignee: Powertech Technology Inc.
    Inventors: Wen-Jeng Fan, Yi-Ling Liu, Shin-Hui Huang, Tsai-Chuan Yu
  • Publication number: 20100127428
    Abstract: A composite bipolar plate for a polymer electrolyte membrane membrane fuel cell (PEMFC) is prepared as follows: a) melt compounding a polypropylene resin and graphite powder at 100-250° C. and 30-150 rpm to form a melt compounding material, the graphite powder content ranging from 50 wt % to 95 wt % based on the total weight of the graphite powder and the polypropylene resin, and the polypropylene resin being a homopolymer of propylene or a copolymer of propylene and ethylene, wherein 0.05-20 wt % carbon nanotubes, based on the weight of the polypropylene resin, are added during the melt compounding; and b) molding the melt compounding material from step a) to form a bipolar plate having a desired shaped at 100-250° C. and 500-4000 psi.
    Type: Application
    Filed: July 20, 2009
    Publication date: May 27, 2010
    Applicant: YUAN ZE UNIVERSITY
    Inventors: Chen-Chi M. Ma, Shu-Hang Liao, Chuan-Yu Yen, Cheng-Chih Weng, Ching-Hung Yang, Ming-Yu Yen, Min-Chien Hsiao, Shuo-Jen Lee, Yi-Hsiu Hsiao
  • Publication number: 20100087094
    Abstract: A connector and circuit board suitable for multiple transmission interfaces, which can be applied to storage devices or computer devices is disclosed. The connector device includes a connector case, and two transmission interfaces respectively disposed on upper and lower sides of the connector case. One end connector case serves to electrically connect with the circuit board, and another end serves as the transmission interfaces complying with at least two different specifications. Thus, the users may select suitable transmission interface according to actual needs.
    Type: Application
    Filed: October 4, 2008
    Publication date: April 8, 2010
    Applicant: T-CONN PRECISION CORPORATION
    Inventors: Shou-Yi Chen, Mei-Chuan Yu, Tien-Fu Cheng
  • Publication number: 20100087093
    Abstract: A connector adaptor suitable for various transmission protocols is disclosed. The connector includes a hollow case, two positioning sets, two terminal sets. The two positioning sets are formed on the upper side and a lower side of said hollow case. The two terminal sets are connected to the positioning sets respectively, and said terminal sets are respectively connected to a flat face of said positioning set for an electrical connection. The hollow case is made in a plastic injection process.
    Type: Application
    Filed: October 4, 2008
    Publication date: April 8, 2010
    Applicant: T-CONN PRECISION CORPORATION
    Inventors: Mei-Chuan Yu, Tien-Fu Cheng, Shou-Yi Chen
  • Publication number: 20100059718
    Abstract: A composite bipolar plate for a polymer electrolyte membrane fuel cell (PEMFC) is prepared as follows: a) compounding vinyl ester and graphite powder to form bulk molding compound (BMC) material, the graphite powder content ranging from 60 wt % to 95 wt % based on the total weight of the graphite powder and vinyl ester, wherein carbon nanotubes together with a polyether amine dispersant or modified carbon nanotubes 0.05-10 wt %, based on the weight of the vinyl ester resin, are added during the compounding; b) molding the BMC material from step a) to form a bipolar plates having a desired shaped at 80-200° C. and 500-4000 psi.
    Type: Application
    Filed: October 20, 2008
    Publication date: March 11, 2010
    Applicant: National Tsing Hua University
    Inventors: Chen-Chi Martin Ma, Chih-Hung Hung, Shu-Hang Liao, Chuan-Yu Yen, Jeng-Chih Weng, Yu-Feng Lin
  • Publication number: 20090308576
    Abstract: A heat pipe with a dual capillary structure includes a metal tube, a first capillary, a second capillary and a working fluid. The metal tube forms a chamber and a heat-absorption part. The first capillary is formed by sintering a metal powder, and its corresponding heat-absorption part is disposed in the chamber and the second capillary is contained in the chamber and connected to an end of the first capillary. The second capillary includes an internal tube, a capillary tissue installed between inner walls of the internal tube and the metal tube, and a working fluid filled into the chamber. The invention further provides a method of manufacturing the heat pipe with a dual capillary structure.
    Type: Application
    Filed: June 17, 2008
    Publication date: December 17, 2009
    Inventors: Cheng-Tu WANG, Pang-Hung Liao, Kuo-Feng Tseng, Chuan-Yu Lee
  • Publication number: 20090243099
    Abstract: A window-type BGA semiconductor package is revealed, primarily comprising a substrate with a wire-bonding slot, a chip disposed on a top surface of the substrate, and a plurality of bonding wires passing through the wire-bonding slot. A plurality of plating line stubs are formed on a bottom surface of the substrate, connect the bonding fingers on the substrate and extend to the wire-bonding slot. The bonding wires electrically connect the bonding pads of the chip to the corresponding bonding fingers of the substrate. The plating line stubs are compliant to the wire-bonding paths of the bonding wires correspondingly connected at the bonding fingers, such as parallel to the overlapped arrangement, to avoid electrical short between the plating line stubs and the bonding wires with no corresponding relationship of electrical connections.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Inventors: Wen-Jeng FAN, Yi-Ling Liu, Shin-Hui Huang, Tsai-Chuan Yu
  • Patent number: 7595981
    Abstract: A notebook computer includes a housing, a CPU, a memory, a display, a storage device, a detachable battery pack and a keyboard module. The notebook computer is characterized in that the housing includes a predefined space and a connection interface disposed in the predefined space. The connection interface is electrically connected to the CPU. The notebook computer includes a plurality of electronic device modules. Each electronic device module includes a casing portion and a main body portion, and the main body portion includes a transmission interface. The size of each electronic device module may correspond to the size of the predefined space. Each electronic device module may be secured in the predefined space for combination with the housing, and the transmission interface is electrically connected to the connection interface for power or data transmission. The plurality of electronic device modules are capable of combining individually with the housing for replacing different functions.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: September 29, 2009
    Assignee: First International Computer Inc.
    Inventors: Wen-Hsiang Chen, Chuan-Yu Hsu, Ming-Wang Lin, Wen-Hsing Chen, Hung-Wen Hsu, Lin-Hsiang Hsieh, Wei-Te Huang
  • Publication number: 20090233591
    Abstract: The present invention relates to a method of data uplink synchronization between a mobile terminal and a server. The server modifies the stored address book data one item by one item. The present invention also relates to a method of data downlink synchronization between a mobile terminal and a server. Before the server sends address book data to the mobile terminal requesting the downlink synchronization, it performs item-by-item adaptation of the address book data according to the item's attribute and parameter supported by the mobile terminal. The present invention relates to another method of data downlink synchronization between a mobile terminal and a server. The mobile terminal, according to the received address book data, modifies the stored address book one item by one item.
    Type: Application
    Filed: January 22, 2007
    Publication date: September 17, 2009
    Applicant: China Mobile Communications Corporation
    Inventors: Chunmei Zhu, Wei Wu, Chuan Yu
  • Publication number: 20090223435
    Abstract: A substrate panel is revealed, comprising a plurality of substrate strips where each substrate strip has a plurality of substrate units and a plurality of appropriative ID marks. Each ID mark is corresponding to and formed on each substrate unit. All of the ID marks are different in a manner to simultaneously recognize both the relative locations of the substrate units to the substrate strips and the relative locations of the substrate strips to the substrate panel. In a preferred embodiment, the ID marks are disposed on exposed surfaces of the substrate units so that it is still visible after semiconductor packaging. Therefore, during or after semiconductor packaging processes, any defect found can be traced back by the ID marks on the substrate units to recognize the locations of the substrate units in the substrate panel for failure analysis to improve PCB manufacturing processes or semiconductor packaging processes for better production yields.
    Type: Application
    Filed: March 4, 2008
    Publication date: September 10, 2009
    Inventors: Wen-Jeng FAN, Tsai-Chuan Yu, Ching-Wei Hung
  • Publication number: 20090187004
    Abstract: Expression system for enhancing solubility and immunogenicity of recombinant proteins. The expression system includes a protein expression vector that contains a chimeric gene encoding a chimeric protein comprising: (a) a first polypeptidyl fragment at the N-terminal end of the chimeric protein, containing a protein transduction domain (PTD), or a fragment thereof, having HIV Tat PTD activity; (b) a second polypeptidyl fragment at the C-terminal end of the first polypeptidyl fragment, containing a J-domain, or a fragment thereof, having heat shock protein 70 (Hsp70)-interacting activity; and (c) a third polypeptidyl fragment at the C-terminal end of the second polypeptidyl fragment, containing a target protein or polypeptide.
    Type: Application
    Filed: March 18, 2009
    Publication date: July 23, 2009
    Applicants: STRESSPRO BIOMEDICINE INCORPORATION, ANIMAL TECHNOLOGY INSTITUTE TAIWAN
    Inventors: MING-YU CHEN, Chin-Kai Chuang, Yu-Hsyu Su, Chiu-Ting Fan, Jung-Chuan Yu, Wen-Chuan Lee
  • Publication number: 20090181578
    Abstract: A connector assembly and an adaptor for various transmission protocols are disclosed. The connector assembly comprises a hollow casing including terminal sets connected at the upper and lower inner part thereof. The hollow casing is connected to a housing with the fool-proof protrusion positioned respectively at the right and the left side thereof. The housing surrounds the hollow casing. The upper and the lower end of the housing have the elastic plate respectively. The adaptor has a hollow casing with a slot, and the slot has a positioning set. The hollow casing is surrounded by a housing. The positioning set respectively includes the terminal set at the upper and the lower side thereof. Thus one single connector assembly and the adaptor can be applied in various transmission protocols.
    Type: Application
    Filed: January 13, 2008
    Publication date: July 16, 2009
    Applicant: T-CONN PRECISION CORP.
    Inventors: SHOU-YI CHEN, Cheng-Ting Hsieh, Yu-Kai Huang, Mei-Chuan Yu
  • Publication number: 20090171130
    Abstract: A method for producing 1,4-bis(bromodifluoromethyl)tetrafluorobenzene (BFTFB) is disclosed. The target compound is predicted as a very potent monomer for low dielectric constant material. This method comprises the following steps: (a) mixing 1,4-bis(bromodifluoromethyl)tetrafluorobenzene (DFMTFB), a bromination agent, and a solvent (with or without) to form a mixture; (b) heating the mixture under UV radiation; and (c) purifying the resultant to obtain 1,4-bis(bromodifluoromethyl)tetrafluorobenzene (BFTFB) with high purity.
    Type: Application
    Filed: July 29, 2008
    Publication date: July 2, 2009
    Applicants: Chung-shan Institute of Science and Technology. Armaments Bureau. M.N.D., Yuan-Shin Materials Technology Corp.
    Inventors: Chuan-Yu Chou, Po-Chen Chang, Chun-Hsu Lin, Shieh-Jun Wang
  • Publication number: 20090171132
    Abstract: A method for producing 1,4-bis(difluoromethyl)tetrafluorobenzene is disclosed, which has the following steps: (a) mixing 1,4-bis(dichloromethyl)tetrafluorobenzene, a catalyst, an aprotic polar solvent, and an alkali metal fluoride to form a reaction mixture; (b) heating the reaction mixture; and (c) purifying the resultant to obtain 1,4-bis(difluoromethyl)tetrafluorobenzene.
    Type: Application
    Filed: July 29, 2008
    Publication date: July 2, 2009
    Applicants: Yuan-Shin Materials Technology Corp., Chung-shan Institute of Science and Technology. Armaments Bureau. M.N.D.
    Inventors: Chun-Hsu Lin, Chac-Chou Tu, Chan-Yuan Ho, Chuan-Yu Chou, Wei-Hsiung Ou, Shieh-Jun Wang
  • Patent number: RE40945
    Abstract: A method of increasing the scanning resolution of a scanner through controlling its driving system. By suitably adjusting the timing relationship between motor pulses and exposure pulses, a low-resolution driving system can produce a high-resolution image with no additional production cost incurred.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: October 27, 2009
    Inventors: Chuan-Yu Hsu, Chen-Hsiang Shih