Abstract: A semiconductor memory device includes a memory cell array and a test circuit. The test circuit reads data stream from the memory cell array, configured to, on comparing bits of each first unit in the data stream, compares corresponding bits in the first units as each second unit and outputs a fail information signal including pass/fail information on the data stream and additional information on the data stream, in a test mode of the semiconductor memory device.

Abstract: A memory device performing an internal copy operation is provided. The memory device may receive a source address, a destination address, and page size information together with an internal copy command, compares the source address with the destination address, and performs an internal copy operation. The internal copy operation may be an internal block copy operation, an inter-bank copy operation, or an internal bank copy operation. The internal copy operation may be performed with respect to one-page data, half-page data, or quarter-page data, based on the page size information. The memory device may output as a flag signal a copy-done signal indicating that the internal copy operation has been completed.

Abstract: A memory system includes a memory device and a memory controller. The memory device includes a plurality of memory cells. The memory controller is configured to continuously perform a plurality of write commands on the memory device between an active command and a precharge command. In the memory system, when after a first write operation having a last write command of the plurality of write commands is performed and then the precharge command is issued, the last write command is issued for a second write operation after the precharge command. The first write operation and the second write operation write a same data to memory cells of plurality of memory cells having a same address.

Abstract: An inductor device is provided. The inductor device includes a coil unit that includes a pair of first and second coils disposed adjacent to each other and coupled to each other, a core unit that surrounds inner and outer spaces of the coil unit, and an induction unit that is disposed in the coil unit and is induced by a magnetic field generated between the first and second coils.

Abstract: A memory core of a resistive type memory device includes at least a first resistive type memory cell coupled to a bit-line, a first resistance to voltage converter and a bit-line sense amplifier. The first resistance to voltage converter is coupled to the bit-line at a first node. The first resistance to voltage converter converts a resistance of the first resistive type memory cell to a corresponding voltage based on a read column selection signal. The bit-line sense amplifier is coupled to the bit-line at the first node and is coupled to a complementary bit-line at a second node. The bit-line sense amplifier senses and amplifies a voltage difference of the bit-line and the complementary bit-line in response to a sensing control signal.

Abstract: In one example embodiment, a memory system includes a memory module and a memory controller. The memory module is configured generate density information of the memory module based on a number of the bad pages of the memory module, the bad pages being pages that have a fault. The memory controller is configured to map a continuous physical address to a dynamic random access memory (dram) address of the memory module based on the density information received from the memory module.

Abstract: A memory module may include m memory devices. Each of the m memory devices may be divided into n regions each region including a plurality of rows corresponding to row addresses, where m and n are integers equal to or greater than 2. An address detector included in each of the m memory devices, wherein for each of the address detectors, the address detector may be configured to count a number of accesses to a particular row address included in one region of each of the m memory devices during a predetermined time period, and be configured to output a detect signal when the number of the counted accesses reaches a reference value. Each of the max-count address generators may be configured to count a number of accesses for a set of row addresses different from the sets of row addresses for which the other max-count address generators count accesses.

Abstract: A use time managing method of a semiconductor device may include (1) measuring an amount of accumulated operation time of the semiconductor device and when the amount is reached to a predetermined value, generating a unit storage activation signal; (2) repeating step (1) to generate one or more additional unit storage activation signals, thereby generating a plurality of unit storage activation signals, wherein the predetermined values are different for each repeating step; (3) storing data indicating each occurrence of generating the unit storage activation signals; and (4) detecting use time of the semiconductor device based on the cumulatively stored data.

Abstract: Provided is a profiling unit and method for profiling a number of times that an input/output address of a semiconductor device is accessed. The profiling unit includes a hash unit configured to produce at least one hash value by perform a hash operation on the input/output address, and a profiling circuit configured to profile the number of times that the input/output address is accessed by using the at least one hash value.

Abstract: The memory device includes a memory array, control logic and a recovery circuit. The memory array has a first region configured to store data, a second region configured to store a portion of fail cell information, and a third region configured to store recovery information. The fail cell information identifies failed cells in the first region, and the recovery information is for recovering data stored in the identified failed cells. The control logic is configured to store the fail cell information, to transfer the portion of the fail cell information to the second region of the memory array, and to determine whether to perform a recovery operation based on address information in an access request and the portion of the fail cell information stored in the second region. The access request is a request to access the first region. The recovery circuit is configured to perform the recovery operation.

Abstract: A semiconductor memory device includes a memory cell array, sub word-line drivers and power selection switches. The memory cell array includes memory cell rows coupled to word lines. The sub word line drivers are coupled to the word lines. The power selection switches are coupled to the sub word-line drivers. Each power selection switch controls a deactivation voltage level of a first word-line activated from the word-lines and an off-voltage level of a second word line adjacent to the first word line so that the deactivation voltage level and the off-voltage level have at least one of a ground voltage, a first negative voltage and a second negative voltage. The ground voltage, the first negative voltage and the second negative voltage have different voltage levels from each other.

Abstract: A memory device having an error notification function includes an error correction code (ECC) engine detecting and correcting an error bit by performing an ECC operation on data of the plurality of memory cells, and an error notifying circuit configured to output an error signal according to the ECC operation. The ECC engine outputs error information corresponding to the error bit corresponding to a particular address corrected by the ECC operation. The error notifying circuit may output the error signal when the particular address is not the same as any one of existing one or more failed addresses.

Abstract: The present invention provides a locally invasive surgical apparatus including a manipulator for scratching the bone at a fracture site, a drive arm on which the manipulator is mounted, and a controller for controlling the manipulator and the drive arm. Therefore, it is possible to carry out minimally invasive surgery during bone fracture surgery, thereby enabling simple and quick bone fracture surgery for a speedy recovery.

Abstract: A method of operating a volatile memory device includes storing address information of weak cell rows. According to some examples, after writing to a weak cell row, a refresh operation is performed on the weak cell row within a predetermined time. According to some examples, the writing operation to a weak cell row may be performed with a longer write recovery time than a write recovery time to normal cell rows.

Abstract: An error correction apparatus includes an error correction circuit configured to selectively perform error correction on a portion of data that is at least one of written to and read from a plurality of memory cells of a memory device. The portion of data is at least one of written to and read from a subset of the plurality of memory cells, and the subset includes only fail cells among the plurality of memory cells. The error correction apparatus further includes a fail address storage circuit configured to store address information for the fail cells.

Abstract: A memory core of a resistive type memory device includes at least a first resistive type memory cell coupled to a bit-line, a first resistance to voltage converter and a bit-line sense amplifier. The first resistance to voltage converter is coupled to the bit-line at a first node. The first resistance to voltage converter converts a resistance of the first resistive type memory cell to a corresponding voltage based on a read column selection signal. The bit-line sense amplifier is coupled to the bit-line at the first node and is coupled to a complementary bit-line at a second node. The bit-line sense amplifier senses and amplifies a voltage difference of the bit-line and the complementary bit-line in response to a sensing control signal.

Abstract: Provided are a storage medium, which has a security function, for storing media content and an output apparatus for outputting data stored in the storage medium. The storage medium includes a controller for converting at least one of a position of pins of a connector and a storage position of media content in a memory unit in order to control transmission of the media content in the memory unit to the output apparatus.

Abstract: A semiconductor memory device includes a cell array including one or more bank groups, where each of the one or more bank groups includes a plurality of banks and each of the plurality of banks includes a plurality of spin transfer torque magneto resistive random access memory (STT-MRAM) cells. The semiconductor memory device further includes a source voltage generating unit for applying a voltage to a source line connected to the each of the plurality of STT-MRAM cells, and a command decoder for decoding a command from an external source in order to perform read and write operations on the plurality of STT-MRAM cells. The command includes a combination of at least one signal of a row address strobe (RAS), a column address strobe (CAS), a chip selecting signal (CS), a write enable signal (WE), and a clock enable signal (CKE).

Abstract: A semiconductor memory device includes a control logic and a memory cell array in which a plurality of memory cells are arranged. The memory cell array includes a plurality of bank arrays, and each of the plurality of bank arrays includes a plurality of sub-arrays. The control logic controls an access to the memory cell array based on a command and an address signal. The control logic dynamically sets a keep-away zone that includes a plurality of memory cell rows which are deactivated based on a first word-line when the first word-line is enabled. The first word-line is coupled to a first memory cell row of a first sub-array of the plurality of sub-arrays. Therefore, increased timing parameters may be compensated, and parallelism may be increased.

Abstract: Provided is a memory device having a first switch configured to receive a first CSL signal to input or output data. A second switch is configured to receive a second CSL signal. A sensing and latch circuit (SLC) is coupled between the first and second switches. And at least one memory cell is coupled to the second switch. The second switch is configured to control timing of read or write operations of the at least one memory cell in response to the second CSL signal, e.g., where a read operation can be performed in not more than about 5 ns. The SLC operates as a latch in a write mode and as an amplifier in a read mode. The memory device may comprise part of a memory system or other apparatus including such memory device or system. Methods of performing read and write operations using such memory device are also provided.