Patents by Inventor Chun-An Hsieh

Chun-An Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200117277
    Abstract: A keyswitch with adjustable tactile feedback is adjusted by an adjusting method. The keyswitch includes a baseplate, an upper housing, an upper bushing component, a lower bushing component, a keycap and a recovering component. The baseplate has an electrode module, the upper housing is disposed on the baseplate, the upper bushing component is movably disposed on the upper housing, the lower bushing component is movably located between the baseplate and the upper housing, and the keycap is connected to a connecting portion of the upper bushing component. The lower bushing component can rotate relative to the baseplate to switch between a first position and a second position. The lower bushing component has a first lateral surface and a second lateral surface with different shapes. The recovering component is disposed between the baseplate and the lower bushing component to upwardly push the lower bushing component.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 16, 2020
    Inventors: Chen Yang, Chia-Hung Liu, Yung-Chih Wang, Yu-Chun Hsieh
  • Publication number: 20200103768
    Abstract: The present disclosure describes a semiconductor apparatus and a method for handling contamination from a semiconductor manufacturing process. The semiconductor apparatus can include a chuck configured to hold a substrate, a drain cup configured to surround the chuck and to capture a chemical sprayed from the substrate, and a detection module disposed in a space between the drain cup and the chuck and configured to monitor sidewalls of the drain cup.
    Type: Application
    Filed: June 28, 2019
    Publication date: April 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Chun HSIEH, Chih-Che Lin, Pei-Yi Su
  • Patent number: 10598087
    Abstract: An intake/outlet pipe optimization method for a rotary engine, comprising the steps of: (A) providing a rotary engine; (B) providing a simulation software package, to perform a series of simulations for the rotary engine according to different combinations of a pipe length, a pipe diameter, a pipe shape and a pipe angle, to determine an optimal combination of the pipe length, the pipe diameter, the pipe shape, and pipe angle, to obtain an optimal power output for the rotary engine; and (C) performing tests for the rotary engine, by utilizing the optimal combination of the pipe length, the pipe diameter, the pipe shape, and pipe angle obtained in step (B), to obtain a test optimized power output for the rotary engine.
    Type: Grant
    Filed: May 11, 2018
    Date of Patent: March 24, 2020
    Assignee: NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHN
    Inventors: Dun-Zen Jeng, Ming-Chun Hsieh, Chih-Chuan Lee, Ting-Hua Chieh
  • Patent number: 10572018
    Abstract: A keyswitch with adjustable tactile feedback is adjusted by an adjusting method. The keyswitch includes a baseplate, an upper housing, an upper bushing component, a lower bushing component, a keycap and a recovering component. The baseplate has an electrode module, the upper housing is disposed on the baseplate, the upper bushing component is movably disposed on the upper housing, the lower bushing component is movably located between the baseplate and the upper housing, and the keycap is connected to a connecting portion of the upper bushing component. The lower bushing component can rotate relative to the baseplate to switch between a first position and a second position. The lower bushing component has a first lateral surface and a second lateral surface with different shapes. The recovering component is disposed between the baseplate and the lower bushing component to upwardly push the lower bushing component.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: February 25, 2020
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Chen Yang, Chia-Hung Liu, Yung-Chih Wang, Yu-Chun Hsieh
  • Publication number: 20200045851
    Abstract: A heat dissipation unit includes a main body having a first and a second plate member, which are closed to each other to together define an airtight chamber in between them. A working fluid is filled in the airtight chamber, and a first wick structure layer and a holding-down thin layer are provided between the first and the second plate member and superimposed in the airtight chamber. With the holding-down thin layer and the first wick structure layer being superimposed in the airtight chamber, the first wick structure layer is closely and flatly attached to the second plate member without warping.
    Type: Application
    Filed: August 5, 2018
    Publication date: February 6, 2020
    Inventors: Kuo-Chun Hsieh, Wei-Te Wu
  • Publication number: 20200041213
    Abstract: A flat-plate heat pipe structure includes a main body. The main body has a first board body, a second board body, a first capillary structure and a working fluid. The first and second board bodies are overlapped and mated with each other. The first capillary structure is disposed between the first and second board bodies. The first capillary structure and the first and second board bodies together define at least one vapor passage. Accordingly, when the flat-plate heat pipe is thinned, the flat-plate heat pipe still keeps having a vapor passage, whereby the vapor-liquid circulation efficiency of the flat-plate heat pipe will not be deteriorated due to thinning.
    Type: Application
    Filed: October 14, 2019
    Publication date: February 6, 2020
    Inventor: Kuo-Chun Hsieh
  • Patent number: 10535682
    Abstract: An active device array substrate including a first scan line, a first data line, a second data line, a first active device, a first pixel electrode, a second active device, a second pixel electrode, and a first shielding pattern layer is provided. The first active device includes a first gate electrically connected to the first scan line, a first semiconductor pattern layer, a first source electrically connected to the first data line, and a first drain. The second active device includes a second gate electrically connected to the first scan line, a second semiconductor pattern layer, a second source electrically connected to the second data line, and a second drain. The first shielding pattern layer is overlapped with the first semiconductor pattern layer and the second semiconductor pattern layer. The first shielding pattern layer is overlapped with the second data line and not overlapped with the first data line.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: January 14, 2020
    Assignee: Au Optronics Corporation
    Inventors: Chih-Chung Su, Po-Hsueh Chen, Yi-Wei Chen, Hsiu-Chun Hsieh
  • Patent number: 10535477
    Abstract: A button switch includes a base having a pillar, a cover disposed on the base, a sleeve, an arm adjacent to the pillar and an elastic member having upward-force-applying, extending-rod, and flexible-rod portions. The sleeve jackets the pillar, passes through the cover, and has first and second ribs. The upward-force-applying portion jackets the pillar and abuts against the sleeve and the base to drive the sleeve to move away from the base. The extending-rod portion extends from the upward-force-applying portion to be connected to the flexible-rod portion located under the first rib. When the sleeve is located at a high position, the second rib biases the arm to deform. When the sleeve is located at a low position, the second rib is misaligned with the arm. The flexible-rod portion crosses the first rib to be released and then collides with the cover to make sound as the sleeve is pressed.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: January 14, 2020
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Yu-Chun Hsieh, Yung-Chih Wang, Chen Yang, Chia-Hung Liu, Yen-Hsiao Lin
  • Publication number: 20200012557
    Abstract: A solid state storage device includes a buffer, a non-volatile memory and a control circuit. A write data is temporarily stored in the buffer. The non-volatile memory includes plural dies. The plural dies include respective first spaces as data storage areas. If an amount of the write data in the buffer does not reach a predetermined data amount when a power failure occurs, the control circuit performs a parity check process on the write data to generate a parity data. The control circuit stores the write data in the data storage areas of the plural dies. The control circuit stores the parity data and a position information in a system storage area of the non-volatile memory.
    Type: Application
    Filed: August 31, 2018
    Publication date: January 9, 2020
    Inventors: Yei-Chung Lee, Shang-Chun HSIEH, Shi-Hao Tseng, Chao-Yeuan Mao
  • Patent number: 10526534
    Abstract: The composite material of the invention includes a plurality of quantum dots and a matrix. The matrix is formed by a plurality of siloxane compounds crosslinked with a component which comprises a plurality of oxime-based silicone primer compounds. The quantum dots are chemically bonded to the matrix through a plurality of amino groups. The quantum dots are uniformly dispersed in the matrix of the composite material.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: January 7, 2020
    Assignee: Unique Materials Co., Ltd.
    Inventors: Pi-Tai Chou, Chia-Chun Hsieh
  • Publication number: 20200004156
    Abstract: The present disclosure describes a leakage handling device and a method for handling a fluid leakage in a semiconductor manufacturing apparatus. The semiconductor manufacturing apparatus can include a lithography apparatus with a chuck configured to hold a substrate, and a photoresist feeder configured to dispatch a coating material on one or more areas of the substrate. The photoresist feeder can include a photoresist cartridge configured to output the coating material, a conduit fluidly connected to the photoresist cartridge, and a fluid leakage handling device disposed above the chuck, where the conduit can be configured to fluidly transport the coating material and circulate a coolant and the fluid leakage handling device can be configured to detect a fluid leakage from the conduit.
    Type: Application
    Filed: June 11, 2019
    Publication date: January 2, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fu-Chun HSIEH, Pei-Yi SU
  • Publication number: 20200004705
    Abstract: A method of retrieving data of equipment is disclosed. In the method, a host is interconnected to a control host of at least one machine equipment through network, and host uses AutoItX dll to enter an application program of control host, and then uses AutoIt Window information tool to retrieve a control ID of the control item of the to-be-retrieved date item, and select a function parameter defined in the AutoItX dll. The retrieved control ID and control item title are inputted into the selected function parameter program associated with the control item, to retrieve at least one piece of application data of the at least one machine equipment, the control host of the at least one machine equipment transmits the retrieved application data to the host through network, so that the host can obtain instant state data of the to-be-retrieved date item, to achieve the objective of real-time monitoring.
    Type: Application
    Filed: July 2, 2018
    Publication date: January 2, 2020
    Inventors: Ming-Chun HSIEH, Yi-Lin LIAO, Chun-Hsiang YANG
  • Patent number: 10522349
    Abstract: A method includes depositing a target layer over a substrate; reducing a reflection of a light incident upon the target layer by implanting ions into the target layer, resulting in an ion-implanted target layer; coating a photoresist layer over the ion-implanted target layer; exposing the photoresist layer to the light using a photolithography process, wherein the target layer reduces reflection of the light at an interface between the ion-implanted target layer and the photoresist layer during the photolithography process; developing the photoresist layer to form a resist pattern; etching the ion-implanted target layer with the resist pattern as an etch mask; processing the substrate using at least the etched ion-implanted target layer as a process mask; and removing the etched ion-implanted target layer.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: December 31, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Han Yang, Tsung-Han Wu, Chih-Wei Chang, Hsin-mei Lin, I-Chun Hsieh, Hsi-Yen Chang
  • Publication number: 20190393003
    Abstract: A keyswitch structure includes a base having a positioning means, an cover combined with the base, a plunger with an cam portion movably coupling with the cover relative to the base, a restoring unit disposed between the base and the plunger to provide a restoring force to enable the plunger to move along a direction away from the base, a tactile feedback member having a positioning portion positioned by the positioning means and an extending arm extending across a moving path of the cam portion, and an adjusting unit being movable to drive the positioning portion to shift, so that the tactile feedback member has a first deformation or a second deformation, and a pressing force required for the cam portion to pass the extending arm when the plunger moves toward the base is changed.
    Type: Application
    Filed: June 21, 2019
    Publication date: December 26, 2019
    Inventors: Yung-Chih WANG, Chia-Hung LIU, Yu-Chun HSIEH, Chen YANG
  • Publication number: 20190393004
    Abstract: A keyboard includes a plurality of keyswitch structures and an adjusting plate movably disposed under the keyswitch structures. Each of the keyswitch structures includes a tactile feedback member. The adjusting plate includes a plate body and a plurality of adjusting bars protruding from the plate body toward the keyswitch structures and respectively corresponding to the tactile feedback members of the keyswitch structures. When the adjusting plate moves relative to the keyswitch structures, the adjusting bars drive the tactile feedback members to change tactile feedback of the keyswitch structures.
    Type: Application
    Filed: August 7, 2019
    Publication date: December 26, 2019
    Inventors: Yung-Chih WANG, Chia-Hung LIU, Yu-Chun HSIEH, Chen YANG, Chih-Yao CHI
  • Publication number: 20190384958
    Abstract: A fingerprint identification device includes a substrate, a piezoelectric layer, a conductive layer, and a planar layer. The piezoelectric layer is disposed on the substrate. The conductive layer is disposed on the piezoelectric layer, and the conductive layer has a rugged microstructure on an upper surface of the conductive layer. The planar layer is disposed on the conductive layer, and a bottom of the planar layer fills the rugged microstructure of the conductive layer.
    Type: Application
    Filed: October 21, 2018
    Publication date: December 19, 2019
    Inventors: Pei-Chun HSIEH, Hung-Chieh LU
  • Publication number: 20190356428
    Abstract: The described technology is generally directed towards adaptively selecting a repetition level in wireless communications, based on events to improve coverage range via the repetition level while not unnecessarily reducing throughput. One such event can include a current signal-to-noise-ratio, e.g., as reported in a channel quality indicator report from a user equipment. Another such event can comprise a number of consecutive hybrid automatic repeat request acknowledgments or negative acknowledgments (HARQ ACKS/NACKS), in which consecutive ACKs tend to indicate good signal quality, while consecutive NACKs tend to indicate poor signal quality. A combination of channel quality indicator-based adaptive repetition level and HARQ ACK/NACK-based adaptive repetition level can be employed.
    Type: Application
    Filed: May 17, 2018
    Publication date: November 21, 2019
    Inventors: Yupeng Jia, Darwin Parra, Prabhakara Aithal, Ping-Chun Hsieh
  • Patent number: 10473404
    Abstract: A straight-through structure of heat dissipation unit includes a first plate body and a second plate body correspondingly mated with each other to define a closed chamber. A hydrophilic layer is disposed on the surface of the closed chamber and a capillary structure is disposed in the closed chamber. The first plate body is formed with a first recess, a first perforation and a second recess. The first recess is connected with the capillary structure disposed on the third face of the second plate body. One end of the second recess abuts against the capillary structure. The capillary structure layer is not in contact with the first recess. The second plate body has a second perforation in alignment with the first perforation. When it is necessary to perforate the heat dissipation unit, the straight-through structure can keep the closed chamber in the vacuumed and airtight state.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: November 12, 2019
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Kuo-Chun Hsieh, Chih-Ming Chen
  • Patent number: RE47709
    Abstract: A method of forming an interposer includes providing a semiconductor substrate, the semiconductor substrate having a front surface and a back surface opposite the front surface; forming one or more through-silicon vias (TSVs) extending from the front surface into the semiconductor substrate; forming an inter-layer dielectric (ILD) layer overlying the front surface of the semiconductor substrate and the one or more TSVs; and forming an interconnect structure in the ILD layer, the interconnect structure electrically connecting the one or more TSVs to the semiconductor substrate.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 5, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Chun Hsieh, Wei-Cheng Wu, Hsiao-Tsung Yen, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng
  • Patent number: D872113
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: January 7, 2020
    Assignee: HTC Corporation
    Inventors: Ping-Chun Hsieh, Po-Hsuan Chang, Ka Wai Aidan Leung, Tong-Mu Chiang