Abstract: A non-volatile memory device and its manufacturing method are provided. The non-volatile memory device includes a tunneling oxide layer, a floating gate, a dielectric layer, and a control gate. The tunneling oxide layer is formed on a substrate. The floating gate is formed on the tunneling oxide layer, and includes a first polysilicon layer, a second polysilicon layer, and a nitrogen dopant. A grain of the first polysilicon layer has a first grain size, and a grain of the second polysilicon layer has a second grain size that is greater than the first grain size. The nitrogen dopant is formed in interstices between the grains of the first polysilicon layer. The dielectric layer includes a first nitride film, an oxide layer, a nitride layer, and an oxide layer conformally formed on the floating gate. The control gate is formed on the dielectric layer.

Abstract: A communication apparatus includes an input terminal, an output terminal, and an interference reduction circuit. The interference reduction circuit is coupled between the input terminal and the output terminal. The interference reduction circuit receives a time-varying data signal. The interference reduction circuit acquires first partial data from the data signal at a first time, and generates a first level-shifted result and a second level-shifted result according to the first partial data. The interference reduction circuit is further configured to acquire second partial data from the data signal at a second time. The interference reduction circuit selects one of the first level-shifted result and the second level-shifted result as a selected result according to the second partial data, and sends the selected result to the output terminal.

Abstract: The present invention provides a decision feedback equalizer including a first path and a second path. The first path includes a first sampling circuit and a first latch circuit, wherein the first sampling circuit generates a first set signal and a first reset signal according to an input signal, a second set signal and a second reset signal, and the first latch circuit generates a first digital signal according to the first set signal and the first reset signal. The second path includes a second sampling circuit and a second latch circuit, wherein the second sampling circuit generates the second set signal and the second reset signal according to the input signal, the first set signal and the first reset signal, and the second latch circuit generates a second digital signal according to the second set signal and the second reset signal.

Abstract: A flat-plate heat pipe structure includes a main body. The main body has a first board body, a second board body, a first capillary structure and a working fluid. The first and second board bodies are overlapped and mated with each other. The first capillary structure is disposed between the first and second board bodies. The first capillary structure and the first and second board bodies together define at least one vapor passage. Accordingly, when the flat-plate heat pipe is thinned, the flat-plate heat pipe still keeps having a vapor passage, whereby the vapor-liquid circulation efficiency of the flat-plate heat pipe will not be deteriorated due to thinning.

Abstract: The present disclosure relates to a semiconductor structure and a method of manufacturing the semiconductor structure. The semiconductor structure includes a substrate including a first surface and a conductive trace extending over the substrate; a die disposed over the first surface of the substrate; a molding disposed over the first surface of the substrate and covering the die; and a metallic layer surrounding the molding and the substrate, wherein the metallic layer is electrically connected to at least a portion of the conductive trace exposed through the substrate.

Abstract: A manufacturing method of heat dissipation unit includes steps of: providing a mold having an upper mold section and a lower mold section, the lower mold section being formed with a receiving depression and at least one sink; providing an upper plate, a lower plate, a capillary structure and at least one heat conduction member, the heat conduction member being positioned in the sink, the lower plate, the capillary structure and the upper plate being sequentially positioned in the receiving depression, then the heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections; and integrally connecting the heat conduction member with the lower plate when the upper and lower plates are thermally pressed and connected to form the plate body by means of the upper and lower mold sections.

Abstract: A heat dissipation unit includes a main body having an upper surface and a lower surface and at least one heat conduction member having a heat absorption face and a heat conduction face. The heat conduction face of the heat conduction member is disposed under the lower surface of the main body.

Abstract: A device substrate including a substrate, first fan-out lines, second fan-out lines, third fan-out lines, touch electrode lines, and active devices is provided. The substrate includes an active area and a peripheral area connected with the active area. The first fan-out lines, the second fan-out lines, and the third fan-out lines are disposed on the peripheral area. Each of the second fan-out lines is overlapped with one corresponding first fan-out line. The second fan-out lines and the first fan-out lines belong to different conductive layers. Each of the third fan-out lines is disposed between two corresponding first fan-out lines. The third fan-out lines and the first fan-out lines belong to the same conductive layer. The touch electrode lines are electrically connected with the third fan-out lines. The active devices are disposed on the active area and electrically connected with the first fan-out lines and the second fan-out lines.

Abstract: A floor faucet structure contains: a body, an adjustable fitting sleeve, a fixing seat, and a connection sleeve. The body includes a positioning disc, a cold-water inlet tube, and a hot-water inlet. Each of the cold-water inlet tube and the hot-water inlet tube has a respective one rotation members and a respective one connector. The respective one rotation member has a longitudinal extension, a horizontal extension, and a first conduit. The respective one connector includes a first connecting section, a second connecting section, a second conduit, at least one stop ring, a first external threaded section, and a second external threaded section. The adjustable fitting sleeve includes a first coupling portion, the fixing seat includes a circular groove, multiple retaining ribs. The connection sleeve includes a second coupling portion, a cylindrical fence, and multiple locking ribs.

Abstract: An optical keyswitch includes a casing having a movable portion, a shaft movably disposed on the casing, a resilient member accommodated in the casing, and a switch module including a circuit board, an emitter, and a receiver. The emitter emits an optical signal along an optical path to the receiver. When the shaft is at a non-pressed position, the movable portion has a first spatial relation with the optical path, and the receiver receives the optical signal of a first intensity. When the shaft moves, in response to a pressing force, to a pressed position, the shaft compresses the resilient member and pushes the movable portion to move, so the movable portion no longer has the first spatial relation with the optical path, the optical signal received by the receiver has a second intensity different from the first intensity, and the switch module is triggered to generate a triggering signal.

Abstract: The present invention provides an unique ID electronic (UM) tag for a tire, which is suitable to be mounted on a surface of tire or embedded in a tire, comprising: a tag unit; a pliable protective layer; and a vuicanizable bonding layer. The pliable protective layer provided on two opposite sides of the tag unit. The vulcanizable bonding layer provided on one or each of the two opposite sides of the pliable protective layer to bond the UID tag tightly to the tire during a vulcanization process. Further, the tag unit comprises a circuit substrate provided with an antenna circuit, and an integrated circuit (IC) chip electrically connected to the antenna circuit.

Abstract: A method for lithography patterning includes depositing a target layer over a substrate, the target layer including an inorganic material; implanting ions into the target layer, resulting in an ion-implanted target layer; forming a photoresist layer directly over the ion-implanted target layer; and exposing the photoresist layer to radiation in a photolithography process. The ion-implanted target layer reduces reflection of the radiation back to the photoresist layer during the photolithography process.

Abstract: A keyswitch with adjustable tactile feedback is adjusted by an adjusting method. The keyswitch includes a baseplate, an upper housing, an upper bushing component, a lower bushing component, a keycap and a recovering component. The baseplate has an electrode module, the upper housing is disposed on the baseplate, the upper bushing component is movably disposed on the upper housing, the lower bushing component is movably located between the baseplate and the upper housing, and the keycap is connected to a connecting portion of the upper bushing component. The lower bushing component can rotate relative to the baseplate to switch between a first position and a second position. The lower bushing component has a first lateral surface and a second lateral surface with different shapes. The recovering component is disposed between the baseplate and the lower bushing component to upwardly push the lower bushing component.

Abstract: The present disclosure describes a semiconductor apparatus and a method for handling contamination from a semiconductor manufacturing process. The semiconductor apparatus can include a chuck configured to hold a substrate, a drain cup configured to surround the chuck and to capture a chemical sprayed from the substrate, and a detection module disposed in a space between the drain cup and the chuck and configured to monitor sidewalls of the drain cup.

Abstract: An intake/outlet pipe optimization method for a rotary engine, comprising the steps of: (A) providing a rotary engine; (B) providing a simulation software package, to perform a series of simulations for the rotary engine according to different combinations of a pipe length, a pipe diameter, a pipe shape and a pipe angle, to determine an optimal combination of the pipe length, the pipe diameter, the pipe shape, and pipe angle, to obtain an optimal power output for the rotary engine; and (C) performing tests for the rotary engine, by utilizing the optimal combination of the pipe length, the pipe diameter, the pipe shape, and pipe angle obtained in step (B), to obtain a test optimized power output for the rotary engine.

Abstract: A keyswitch with adjustable tactile feedback is adjusted by an adjusting method. The keyswitch includes a baseplate, an upper housing, an upper bushing component, a lower bushing component, a keycap and a recovering component. The baseplate has an electrode module, the upper housing is disposed on the baseplate, the upper bushing component is movably disposed on the upper housing, the lower bushing component is movably located between the baseplate and the upper housing, and the keycap is connected to a connecting portion of the upper bushing component. The lower bushing component can rotate relative to the baseplate to switch between a first position and a second position. The lower bushing component has a first lateral surface and a second lateral surface with different shapes. The recovering component is disposed between the baseplate and the lower bushing component to upwardly push the lower bushing component.

Abstract: A heat dissipation unit includes a main body having a first and a second plate member, which are closed to each other to together define an airtight chamber in between them. A working fluid is filled in the airtight chamber, and a first wick structure layer and a holding-down thin layer are provided between the first and the second plate member and superimposed in the airtight chamber. With the holding-down thin layer and the first wick structure layer being superimposed in the airtight chamber, the first wick structure layer is closely and flatly attached to the second plate member without warping.

Abstract: A flat-plate heat pipe structure includes a main body. The main body has a first board body, a second board body, a first capillary structure and a working fluid. The first and second board bodies are overlapped and mated with each other. The first capillary structure is disposed between the first and second board bodies. The first capillary structure and the first and second board bodies together define at least one vapor passage. Accordingly, when the flat-plate heat pipe is thinned, the flat-plate heat pipe still keeps having a vapor passage, whereby the vapor-liquid circulation efficiency of the flat-plate heat pipe will not be deteriorated due to thinning.

Abstract: An active device array substrate including a first scan line, a first data line, a second data line, a first active device, a first pixel electrode, a second active device, a second pixel electrode, and a first shielding pattern layer is provided. The first active device includes a first gate electrically connected to the first scan line, a first semiconductor pattern layer, a first source electrically connected to the first data line, and a first drain. The second active device includes a second gate electrically connected to the first scan line, a second semiconductor pattern layer, a second source electrically connected to the second data line, and a second drain. The first shielding pattern layer is overlapped with the first semiconductor pattern layer and the second semiconductor pattern layer. The first shielding pattern layer is overlapped with the second data line and not overlapped with the first data line.

Abstract: A button switch includes a base having a pillar, a cover disposed on the base, a sleeve, an arm adjacent to the pillar and an elastic member having upward-force-applying, extending-rod, and flexible-rod portions. The sleeve jackets the pillar, passes through the cover, and has first and second ribs. The upward-force-applying portion jackets the pillar and abuts against the sleeve and the base to drive the sleeve to move away from the base. The extending-rod portion extends from the upward-force-applying portion to be connected to the flexible-rod portion located under the first rib. When the sleeve is located at a high position, the second rib biases the arm to deform. When the sleeve is located at a low position, the second rib is misaligned with the arm. The flexible-rod portion crosses the first rib to be released and then collides with the cover to make sound as the sleeve is pressed.