Patents by Inventor Chun Chang

Chun Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071326
    Abstract: A display device and a display method thereof are provided. A sensing module senses at least one state parameter of a display unit. A control circuit stores a plurality of overdrive characteristic lookup tables, selects and calculates an overdrive lookup table according to an overdrive characteristic corresponding to the at least one state parameter and a working parameter of the display unit, and controls the display unit to display according to the overdrive lookup table.
    Type: Application
    Filed: June 16, 2023
    Publication date: February 29, 2024
    Applicant: Qisda Corporation
    Inventor: Chun-Chang Wu
  • Patent number: 11912123
    Abstract: A traction battery pack venting system includes a plurality of battery arrays within a traction battery pack. The battery arrays each have a plurality of individual battery cells. The system further includes a divider system that provides a plurality of vented gas receiving compartments. Each of the vented gas receiving compartments are separate and distinct from the other vented gas receiving compartments within the plurality of vented gas receiving compartments. Each of the vented gas receiving compartments are associated with one of the battery arrays. Each of the vented gas receiving compartments can be associated with a manifold. The vent gas produced from thermal runaway can be discharged to the vented gas receiving compartments, directed to a manifold, and discharge to the external atmosphere.
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: February 27, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Chung-Hsing Kuo, Yongcai Wang, LeeAnn Wang, Che-chun Chang
  • Patent number: 11917923
    Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: February 27, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
  • Patent number: 11916035
    Abstract: A packaging structure including first, second, and third dies, an encapsulant, a circuit structure, and a filler is provided. The encapsulant covers the first die. The circuit structure is disposed on the encapsulant. The second die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die is disposed on the circuit structure and is electrically connected to the circuit structure. The third die has an optical signal transmission area. The filler is disposed between the second die and the circuit structure and between the third die and the circuit structure. A groove is present on an upper surface of the circuit structure. The upper surface includes first and second areas located on opposite sides of the groove. The filler directly contacts the first area. The filler is away from the second area. A manufacturing method of a packaging structure is also provided.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: February 27, 2024
    Assignee: Powertech Technology Inc.
    Inventors: Shang-Yu Chang Chien, Nan-Chun Lin, Hung-Hsin Hsu
  • Patent number: 11917772
    Abstract: A power supply with a separable communication module includes a casing with a port; a main board placed in the casing and having a power conversion circuit; a sub-board electrically connected to the power conversion circuit and provided with at least one first connector; and a communication module. The power conversion circuit has at least one electrical connection terminal. A first interface of the first connector faces the port. The communication module includes a first circuit board and a communication circuit disposed on the first circuit board, the first circuit board has an electrical connection part electrically connected to the communication circuit, the electrical connection part has a first state of connecting with the first interface, and a second state of detaching from the first interface.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: February 27, 2024
    Assignee: COTEK ELECTRONIC IND. CO., LTD.
    Inventors: Chun-Wei Wu, Ta-Chang Wei, Chung-Liang Tsai, Shou-Cheng Yeh
  • Patent number: 11916131
    Abstract: According to an exemplary embodiment, a method of forming a vertical device is provided. The method includes: providing a protrusion over a substrate; forming an etch stop layer over the protrusion; laterally etching a sidewall of the etch stop layer; forming an insulating layer over the etch stop layer; forming a film layer over the insulating layer and the etch stop layer; performing chemical mechanical polishing on the film layer and exposing the etch stop layer; etching a portion of the etch stop layer to expose a top surface of the protrusion; forming an oxide layer over the protrusion and the film layer; and performing chemical mechanical polishing on the oxide layer and exposing the film layer.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: De-Fang Chen, Teng-Chun Tsai, Cheng-Tung Lin, Li-Ting Wang, Chun-Hung Lee, Ming-Ching Chang, Huan-Just Lin
  • Publication number: 20240065012
    Abstract: A photosensitive device including a microlens substrate, a photosensitive element substrate, and an optical glue is provided. The microlens substrate includes a first substrate and microlenses. The first substrate has a first side and a second side opposite to the first side. The microlenses are located on the first side of the first substrate. The photosensitive element substrate includes a second substrate, active components, first electrodes, a second electrode, and an organic photosensitive material layer. The second substrate has a third side and a fourth side opposite to the third side. The second side of the first substrate faces the third side of the second substrate. The active components are located on the fourth side of the second substrate. The first electrodes are respectively electrically connected to the active components. The organic photosensitive material layer is located between the first electrodes and the second electrode.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 22, 2024
    Applicant: AUO Corporation
    Inventors: Yi-Huan Liao, Chun Chang, Hsin-Hsuan Lee
  • Publication number: 20240062825
    Abstract: A memory device and a method for operating the same are provided. In an erase operation, a switch voltage is applied to at least one of a string select line or a ground select line of a selected sub-block of a selected block, a gate control voltage is applied to selected word lines of the selected sub-block, and an erase voltage is applied to bit lines and a common source line of the selected sub-block. The switch voltage is smaller than the erase voltage. The gate control voltage is smaller than the switch voltage and the erase voltage.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Inventors: Chun-Chang LU, Wen-Jer TSAI, Wei-Liang LIN
  • Publication number: 20240052870
    Abstract: A flexible shoulder pin module includes a barrel having an annular head portion, a cylindrical body portion, and a through-hole extending from a top surface of the body portion to a bottom end of the head portion; and a shoulder pin having a shaft portion and a shoulder portion formed thereon. The through-hole includes a first portion adjacent to the top surface of the body portion, and a second portion having a greater diameter than the first portion. The shaft portion is insertable through the first portion into the second portion. The shoulder portion is configured to adjustably extend above the top surface of the body portion to clamp a panel thereto. A compressible device is configured to be disposed around the shaft portion and secured by a stopper panel, which is coupled to the shaft portion and placed adjacent to the head portion within the second portion.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 15, 2024
    Inventors: Chun CHANG, Hsin-Chieh LIN, Yao-Long LIN
  • Patent number: 11902123
    Abstract: Systems, methods, and computer-readable media for managing compromised sensors in multi-tiered virtualized environments. In some embodiments, a system can receive, from a first capturing agent deployed in a virtualization layer of a first device, data reports generated based on traffic captured by the first capturing agent. The system can also receive, from a second capturing agent deployed in a hardware layer of a second device, data reports generated based on traffic captured by the second capturing agent. Based on the data reports, the system can determine characteristics of the traffic captured by the first capturing agent and the second capturing agent. The system can then compare the characteristics to determine a multi-layer difference in traffic characteristics. Based on the multi-layer difference in traffic characteristics, the system can determine that the first capturing agent or the second capturing agent is in a faulty state.
    Type: Grant
    Filed: November 9, 2022
    Date of Patent: February 13, 2024
    Assignee: Cisco Technology, Inc.
    Inventors: Navindra Yadav, Abhishek Ranjan Singh, Anubhav Gupta, Shashidhar Gandham, Jackson Ngoc Ki Pang, Shih-Chun Chang, Hai Trong Vu
  • Patent number: 11900953
    Abstract: An audio processing method includes the following operations. A calculated value is obtained according to multiple audio clock frequency information contained in multiple audio input packets. An audio sampling frequency is generated according to the calculated value and a link symbol clock signal. Multiple audio output packets corresponding to the audio input packets are generated according to the audio sampling frequency.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: February 13, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Chun-Chang Liu, Jing-Chu Chan, Hung-Yi Chang
  • Patent number: 11902121
    Abstract: A method includes capturing first data associated with a first packet flow originating from a first host using a first capture agent deployed at the first host to yield first flow data, capturing second data associated with a second packet flow originating from the first host from a second capture agent deployed on a second host to yield second flow data and comparing the first flow data and the second flow data to yield a difference. When the difference is above a threshold value, the method includes determining that the second packet flow was transmitted by a component that bypassed an operating stack of the first host or a packet capture agent at the device to yield a determination, detecting that hidden network traffic exists, and predicting a malware issue with the first host based on the determination.
    Type: Grant
    Filed: August 26, 2022
    Date of Patent: February 13, 2024
    Assignee: Cisco Technology, Inc.
    Inventors: Khawar Deen, Navindra Yadav, Anubhav Gupta, Shashidhar Gandham, Rohit Chandra Prasad, Abhishek Ranjan Singh, Shih-Chun Chang
  • Publication number: 20240049364
    Abstract: A heating device includes a first capacitor, a first switch, a second switch, a second capacitor, a third capacitor, a coil and a controller. The first and second switch are coupled in series at a first node, and are coupled with the first capacitor in parallel. The second capacitor is coupled to the first switch. The third capacitor is coupled to the second switch, and is coupled to the second capacitor at a second node. The coil is coupled between the first and the second node. The controller outputs a first and a second control signal to the first switch and the second switch, respectively. After the heating device received a voltage and a starting command, the controller outputs the first and the second control signal to turn on or off the first and the second switch respectively. The duty cycle of the first signal is lower than 50%.
    Type: Application
    Filed: October 16, 2023
    Publication date: February 8, 2024
    Inventors: Thiam-Wee TAN, Cheng-Chung LI, Chun CHANG, Yu-Min MENG
  • Publication number: 20240046623
    Abstract: An image selection method is applied to retrain a model. The model is suitable for determining the component types of multiple component images, and each component type corresponds to at least one installation site. The image selection method at least includes the following steps: establishing an image labeling library, which includes a plurality of component images, and each component image is correspondingly labeled with a component type and an installation site; creating an error record, which includes at least one wrong component type previously determined incorrectly by the model and at least one wrong installation site corresponding to the wrong component type; and executing an image selection assignment to create a data set.
    Type: Application
    Filed: May 16, 2023
    Publication date: February 8, 2024
    Inventor: Kai-Chun CHANG
  • Publication number: 20240048965
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may receive, from a network node, a network assistant information (NAI) message identifying a set of characteristics of a network connection. The UE may communicate with the network node using a communication configuration associated with the set of characteristics of the network connection. Numerous other aspects are described.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Inventors: Kai-Chun CHENG, Jen-Chun CHANG, Kuhn-Chang LIN, Wen-Hsin HSIA, Chia-Jou LU, Sheng-Chih WANG, Chenghsin LIN, Yu-Chieh HUANG, Chun-Hsiang CHIU, ChihHung HSIEH, Chung Wei LIN, Yeong Leong CHOO
  • Publication number: 20240049365
    Abstract: A heating device includes a first capacitor, a first switch, a second switch, a second capacitor, a third capacitor, a coil and a controller. The first and second switch are coupled in series at a first node, and are coupled with the first capacitor in parallel. The second capacitor is coupled to the first switch. The third capacitor is coupled to the second switch, and is coupled to the second capacitor at a second node. The coil is coupled between the first and the second node. The controller outputs a first and a second control signal to the first switch and the second switch, respectively. After the heating device received a voltage and a starting command, the controller outputs the first and the second control signal to turn on or off the first and the second switch respectively. The duty cycle of the first signal is lower than 50%.
    Type: Application
    Filed: October 16, 2023
    Publication date: February 8, 2024
    Inventors: Thiam-Wee TAN, Cheng-Chung LI, Chun CHANG, Yu-Min MENG
  • Publication number: 20240049366
    Abstract: A heating device includes a first capacitor, a first switch, a second switch, a second capacitor, a third capacitor, a coil and a controller. The first and second switch are coupled in series at a first node, and are coupled with the first capacitor in parallel. The second capacitor is coupled to the first switch. The third capacitor is coupled to the second switch, and is coupled to the second capacitor at a second node. The coil is coupled between the first and the second node. The controller outputs a first and a second control signal to the first switch and the second switch, respectively. After the heating device received a voltage and a starting command, the controller outputs the first and the second control signal to turn on or off the first and the second switch respectively. The duty cycle of the first signal is lower than 50%.
    Type: Application
    Filed: October 16, 2023
    Publication date: February 8, 2024
    Inventors: Thiam-Wee TAN, Cheng-Chung LI, Chun CHANG, Yu-Min MENG
  • Publication number: 20240045130
    Abstract: The display device includes a display panel and a backlight module on the display panel. The backlight module includes light guide plate having a light incident surface, a light emitting surface facing the display panel and a reflection surface. Two sides of the light incident surface connect the light emitting surface and the reflection surface respectively. The reflection surface includes a first periphery light guide region, a second periphery light guide region, and a middle light guide region between the first periphery light guide region and the second periphery light guide region. The first periphery light guide region includes first microstructures. The second periphery light guide region includes second microstructures. The first microstructures have first light guide inclined surfaces inclined towards the second periphery light guide region. The second microstructures have second light guide inclined surfaces inclined towards the first periphery light guide region.
    Type: Application
    Filed: June 15, 2023
    Publication date: February 8, 2024
    Applicant: Qisda Corporation
    Inventors: Chang-Min SHAO, Chien-Hao KAO, Chih-Chun CHANG, Jyun-Sheng SYU
  • Patent number: 11894439
    Abstract: A semiconductor device includes a gate structure on a substrate, in which the gate structure includes a main branch extending along a first direction on the substrate and a sub-branch extending along a second direction adjacent to the main branch. The semiconductor device also includes a first doped region overlapping the main branch and the sub-branch according to a top view and a second doped region overlapping the first doped region.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: February 6, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Heng-Ching Lin, Yu-Teng Tseng, Chu-Chun Chang, Kuo-Yuh Yang, Chia-Huei Lin
  • Patent number: D1015772
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: February 27, 2024
    Inventor: Pei-Chun Chang