Abstract: A control system of a mechanical arm is provided. The control system includes a first transform circuit, a second transform circuit and a third transform circuit. The first transform circuit outputs a first digital power signal in a first mode of the mechanical arm. The second transform circuit outputs a second digital power signal in the first mode of the mechanical arm. When the control system is unable to control the mechanical arm to move in the first mode, the second digital power signal is cut off. When the control system is unable to control the mechanical arm to move in the first mode, the third transform circuit outputs a third digital power signal.

Abstract: Electrical plugs may include a first conductive pin and a second conductive pin extending from a base structure. A first insulating sleeve may surround a first base portion of the first pin and a second insulating sleeve may surround a second base portion of the second pin. Each of the first insulating sleeve and the second insulating sleeve may have a wall thickness of between about 0.10 mm and about 0.30 mm. Various other related devices, systems, and methods are also disclosed.

Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate and a membrane adjacent to the substrate and configured to generate charges in response to an acoustic wave. The membrane includes a via pattern including: first lines that partition the membrane into slices and extend to a side of the membrane such that the slices are separated from each other near the side of the membrane and connected to each other around a central region, wherein the first lines are made closer to each other when they are closer to the central region, and second lines alternatingly arranged with the first lines.

Abstract: In some embodiments, the present disclosure relates to an integrated device, including: a substrate; a semiconductor layer on the substrate and including a first structure being one of a sound port, a sealed cavity, or a proof mass, and a second structure being one of the sound port, the sealed cavity, or the proof mass, where the second structure is a different one of the sound port, the sealed cavity, or the proof mass than the first structure; a piezoelectric layer on the semiconductor layer overlying the first structure and the second structure; and an air gap extending into the semiconductor layer from an upper surface of the piezoelectric layer, wherein the first structure and portions of the piezoelectric layer overlying the first structure are spaced from the second structure and portions of the piezoelectric layer overlying the second structure by the air gap.

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

Abstract: The present disclosure relates generally to topical delivery compositions for improved topical composition comprising at least one active agent, at least one phospholipid and urea. The active agent of the present disclosure comprises non-steroid anti-inflammatory drugs (NSAIDs). The topical delivery compositions of the present disclosure improve the solubility of the NSAIDs. The present disclosure also relates to a method for preparation of a topical composition of the present disclosure. The topical compositions are useful in treating inflammation, arthritis and/or pain, or conditions for which the signs and symptoms include inflammation, arthritis and/or pain, by topical administration to a subject.

Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a substrate, a transistor structure, an isolation layer, an interface layer in an opening of the isolation layer, and a metal crown structure over the interface layer. The interface layer and the metal crown structure are disposed on opposite side of the transistor from a gate structure.

Abstract: A fault diagnosis method applied to an optical tunnel network system (OPTUNS) having multiple optical switches and multiple optical fibers connected to the multiple optical switches is disclosed and includes following steps: detecting whether the multiple tunnels of the OPTUNS include a faulty tunnel, where each tunnel respectively passes through multiple component parts; when the faulty tunnel is detected, querying the multiple component parts that are passed through by the tunnels within a certain range with the faulty tunnel; respectively calculating a faulty count of each component part queried, where the faulty count indicates the quantity that the component parts being passed through by the faulty tunnels; and outputting one or more of the component parts that have the faulty count of non-zero.

Abstract: A MEMS support structure and a cap structure are provided. At least one vertically-extending trench is formed into the MEMS support structure or a portion of the cap structure. A vertically-extending outgassing material portion having a surface that is physically exposed to a respective vertically-extending cavity is formed in each of the at least one vertically-extending trench. A matrix material layer is attached to the MEMS support structure. A movable element laterally confined within a matrix layer is formed by patterning the matrix material layer. The matrix layer is bonded to the cap structure. A sealed chamber containing the movable element is formed. Each vertically-extending outgassing material portion has a surface that is physically exposed to the sealed chamber, and outgases a gas to increase the pressure in the sealed chamber.

Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.

Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a substrate, a transistor structure, an isolation layer, an interface layer in an opening of the isolation layer, and a metal crown structure over the interface layer. The interface layer and the metal crown structure are disposed on opposite side of the transistor from a gate structure.

Abstract: An antenna module, comprising: a first antenna device, which is an AiM (Antenna in Module) and comprises at least one first antenna; a first FPC (flexible printed circuit), coupled to an outer surface of the first antenna device via a conductive structure; and at least one second antenna device, coupled to the first FPC, comprising at least one second antenna. By this way, an antenna module which can change directions of antennas via simplified structures is provided. Further, an antenna system applying the antenna module is also provided.

Abstract: Wireless communication devices may include a printed circuit board and a conductive pin structure. The printed circuit board may include a neutral power input and a live power input positioned at a first distance from each other. The conductive pin structure may include a neutral pin and a live pin positioned at a second, different distance from each other. A first sheet metal connector may electrically connect the neutral pin to the neutral power input and a second sheet metal connector may electrically connect the live pin to the live power input. Various other related devices, components, systems, and methods are also disclosed.

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.

Abstract: Disclosed is a compact electronic device configured to efficiently manage air circulation and prevent overheating. The device features an innovative cooling system comprising a fan module within a uniquely structured housing that includes a base portion, an inner casing, and a removable top cover. The inner casing features strategically placed windows that direct drawn airflow over specific power supply components, enhancing cooling performance. The enhanced cooling is also provided by an air gap formed between the base portion and the top cover, as well as sidewall intake paths of varying widths adjacent the windows. These features work together to draw in and distribute ambient air effectively across heat-generating components, leveraging negative pressure created by a fan module. The result is a highly efficient cooling mechanism for compact devices such as wireless access point configured to plug into electrical outlets.

Abstract: A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.

Abstract: An air flow redirection system for redirecting exhaust air flow away from an external surface upon which the device is positioned, the device may include a housing including a first side, a second side opposite the first side, at least one sidewall extending between the first side and second side, a vent, the vent defining an opening extending through the at least one sidewall placing an interior chamber of the device in fluid communication with an exterior region, at least one rib defining slots in the vent, and an arc. Air flow produced by a fan located in the interior chamber is directed towards the vent in a first direction, and the arc acts in combination with the at least one rib and raises a direction of the air flow upward in a second direction towards a plane of the first side as the air flow exits the vent.

Abstract: A control system for operating a plurality of air compressors collectively supplying compressed air to a manufacturing facility is disclosed which includes a demand forecast module configured to estimate the manufacturing facility's demand for the compressed air at a predetermined future time, a dynamic adjustment module configured to acquire a current air pressure from the manufacturing facility, the dynamic adjustment module combining the current air pressure and the estimated manufacturing facility's demand for compressed air to make a final forecast, and an optimization module configured to determine a target operating combination of the plurality of air compressors at the predetermined future time based on the final forecast and a current operating combination of the plurality of air compressors.

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a dielectric structure disposed over a first semiconductor substrate, where the dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the dielectric structure. The second semiconductor substrate includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. An anti-stiction structure is disposed between the movable mass and the dielectric structure, where the anti-stiction structure is a first silicon-based semiconductor.