Abstract: Optical modules and methods of forming the same are provided. In an embodiment, an exemplary method includes forming multiple first optical elements over a first wafer, forming multiple second optical elements over a second wafer, forming multiple third optical elements over a third wafer, aligning the first wafer with the second wafer such that, upon the aligning of the first wafer with the second wafer, each first optical element is vertically overlapped with a corresponding second optical element. The method also includes bonding the first wafer with the second wafer to form a first bonded structure, aligning the second wafer with the third wafer such that, and upon bonding the second wafer of the first bonded structure to the third wafer, where upon the aligning of the second wafer with the third wafer, each second optical element is vertically overlapped with a corresponding third optical element.

Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.

Abstract: The embodiments of the disclosure provide a method for providing a virtual plane, a host, and a computer readable storage medium The method includes: tracking a hand gesture of a hand and determining whether the hand has performed a target gesture; in response to determining that the hand has performed the target gesture, providing the virtual plane at a reference height in a virtual world of a reality service; and displaying a height adjustment element in the virtual world, wherein the height adjustment element is used for adjusting a height of the virtual plane in the virtual world.

Abstract: A process of collaboration between different agencies for classifying an event captured in a video stream. In operation, a video stream captured by a camera operated by a public-safety agency is analyzed using a first video analytics engine trained using a first set of video analytics data associated with the public-safety agency and an abnormal event with respect to a person or object captured in the video stream is detected. When it is determined that the video stream is captured at a location that is proximity to an operating environment of a non-public-safety agency, a query is transmitted to a second video analytics engine trained using a second set of video analytics data associated with the non-public-safety agency. The abnormal event is reclassified as a normal event when a response from the second video analytics engine indicates that the abnormal event is normal within the operating environment of the non-public-safety agency.

Abstract: A method and system for employing video analytics in providing a situational awareness alert is disclosed. The method includes automatically detecting that a first person has entered a coverage area of a security camera. The method also includes automatically determining that the first person is registered in a monitoring service associated with the coverage area. The method also includes determining that a plurality of environmental and geospatial parameters associated with the coverage area satisfy a situational awareness threshold applicable to the first person. In response to the situational awareness threshold being satisfied, video analytics is employed to analyze video captured by security camera(s) to determine that there exists a second person having a respective Point Of View (POV) that permits staring observation of the first person by the second person.

Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.

Abstract: The invention provides a semiconductor structure, which comprises a substrate, a high-voltage device region is defined on the substrate, in the high-voltage device region, the substrate comprises a first region, a first groove surrounds the first region, and a second region surrounds the first groove, and a contact gate structure is located in the high-voltage device region, when viewed from a top view, the contact gate structure comprises a plurality of columnar dielectric layers arranged in an array.

Abstract: A mechanical equipment comprises a control system and a safety system. The safety system is coupled to the control system, and the safety system monitors the operation of the mechanical equipment, and generates a first monitoring signal and a second monitoring signal according to a synchronization signal. The first monitoring signal and the second monitoring signal are obtained by monitoring the mechanical equipment at the same monitoring time.

Abstract: A rotating mechanical equipment is provided. The rotating mechanical equipment detects a vibration based on 2 times the rotation frequency to suppress the vibration of the rotating mechanical equipment.

Abstract: A MEMS support structure and a cap structure are provided. At least one vertically-extending trench is formed into the MEMS support structure or a portion of the cap structure. A vertically-extending outgassing material portion having a surface that is physically exposed to a respective vertically-extending cavity is formed in each of the at least one vertically-extending trench. A matrix material layer is attached to the MEMS support structure. A movable element laterally confined within a matrix layer is formed by patterning the matrix material layer. The matrix layer is bonded to the cap structure. A sealed chamber containing the movable element is formed. Each vertically-extending outgassing material portion has a surface that is physically exposed to the sealed chamber, and outgases a gas to increase the pressure in the sealed chamber.

Abstract: A control system of a mechanical arm is provided. The control system includes a first transform circuit, a second transform circuit and a third transform circuit. The first transform circuit outputs a first digital power signal in a first mode of the mechanical arm. The second transform circuit outputs a second digital power signal in the first mode of the mechanical arm. When the control system is unable to control the mechanical arm to move in the first mode, the second digital power signal is cut off. When the control system is unable to control the mechanical arm to move in the first mode, the third transform circuit outputs a third digital power signal.

Abstract: A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate and a membrane adjacent to the substrate and configured to generate charges in response to an acoustic wave. The membrane includes a via pattern including: first lines that partition the membrane into slices and extend to a side of the membrane such that the slices are separated from each other near the side of the membrane and connected to each other around a central region, wherein the first lines are made closer to each other when they are closer to the central region, and second lines alternatingly arranged with the first lines.

Abstract: In some embodiments, the present disclosure relates to an integrated device, including: a substrate; a semiconductor layer on the substrate and including a first structure being one of a sound port, a sealed cavity, or a proof mass, and a second structure being one of the sound port, the sealed cavity, or the proof mass, where the second structure is a different one of the sound port, the sealed cavity, or the proof mass than the first structure; a piezoelectric layer on the semiconductor layer overlying the first structure and the second structure; and an air gap extending into the semiconductor layer from an upper surface of the piezoelectric layer, wherein the first structure and portions of the piezoelectric layer overlying the first structure are spaced from the second structure and portions of the piezoelectric layer overlying the second structure by the air gap.

Abstract: Electrical plugs may include a first conductive pin and a second conductive pin extending from a base structure. A first insulating sleeve may surround a first base portion of the first pin and a second insulating sleeve may surround a second base portion of the second pin. Each of the first insulating sleeve and the second insulating sleeve may have a wall thickness of between about 0.10 mm and about 0.30 mm. Various other related devices, systems, and methods are also disclosed.

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

Abstract: The present disclosure relates generally to topical delivery compositions for improved topical composition comprising at least one active agent, at least one phospholipid and urea. The active agent of the present disclosure comprises non-steroid anti-inflammatory drugs (NSAIDs). The topical delivery compositions of the present disclosure improve the solubility of the NSAIDs. The present disclosure also relates to a method for preparation of a topical composition of the present disclosure. The topical compositions are useful in treating inflammation, arthritis and/or pain, or conditions for which the signs and symptoms include inflammation, arthritis and/or pain, by topical administration to a subject.

Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a substrate, a transistor structure, an isolation layer, an interface layer in an opening of the isolation layer, and a metal crown structure over the interface layer. The interface layer and the metal crown structure are disposed on opposite side of the transistor from a gate structure.

Abstract: A fault diagnosis method applied to an optical tunnel network system (OPTUNS) having multiple optical switches and multiple optical fibers connected to the multiple optical switches is disclosed and includes following steps: detecting whether the multiple tunnels of the OPTUNS include a faulty tunnel, where each tunnel respectively passes through multiple component parts; when the faulty tunnel is detected, querying the multiple component parts that are passed through by the tunnels within a certain range with the faulty tunnel; respectively calculating a faulty count of each component part queried, where the faulty count indicates the quantity that the component parts being passed through by the faulty tunnels; and outputting one or more of the component parts that have the faulty count of non-zero.

Abstract: A MEMS support structure and a cap structure are provided. At least one vertically-extending trench is formed into the MEMS support structure or a portion of the cap structure. A vertically-extending outgassing material portion having a surface that is physically exposed to a respective vertically-extending cavity is formed in each of the at least one vertically-extending trench. A matrix material layer is attached to the MEMS support structure. A movable element laterally confined within a matrix layer is formed by patterning the matrix material layer. The matrix layer is bonded to the cap structure. A sealed chamber containing the movable element is formed. Each vertically-extending outgassing material portion has a surface that is physically exposed to the sealed chamber, and outgases a gas to increase the pressure in the sealed chamber.

Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.