Patents by Inventor Chun Wen

Chun Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12216077
    Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a substrate, a transistor structure, an isolation layer, an interface layer in an opening of the isolation layer, and a metal crown structure over the interface layer. The interface layer and the metal crown structure are disposed on opposite side of the transistor from a gate structure.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Yi-Shao Liu, Fei-Lung Lai
  • Patent number: 12218419
    Abstract: An antenna module, comprising: a first antenna device, which is an AiM (Antenna in Module) and comprises at least one first antenna; a first FPC (flexible printed circuit), coupled to an outer surface of the first antenna device via a conductive structure; and at least one second antenna device, coupled to the first FPC, comprising at least one second antenna. By this way, an antenna module which can change directions of antennas via simplified structures is provided. Further, an antenna system applying the antenna module is also provided.
    Type: Grant
    Filed: December 20, 2022
    Date of Patent: February 4, 2025
    Assignee: MEDIATEK INC.
    Inventors: Chia-Yen Wei, Jen-Chun Wen
  • Publication number: 20250024603
    Abstract: Wireless communication devices may include a printed circuit board and a conductive pin structure. The printed circuit board may include a neutral power input and a live power input positioned at a first distance from each other. The conductive pin structure may include a neutral pin and a live pin positioned at a second, different distance from each other. A first sheet metal connector may electrically connect the neutral pin to the neutral power input and a second sheet metal connector may electrically connect the live pin to the live power input. Various other related devices, components, systems, and methods are also disclosed.
    Type: Application
    Filed: July 10, 2023
    Publication date: January 16, 2025
    Inventors: Ming-Tsung SU, Chun-Wen WANG
  • Patent number: 12191185
    Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: January 7, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Fa Lee, Chin-Lin Chou, Shang-Ying Tsai, Shou-Wen Kuo, Kuei-Sung Chang, Jiun-Rong Pai, Hsu-Shui Liu, Chun-Wen Cheng
  • Patent number: 12190036
    Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: January 7, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chung-Pin Chou, Chun-Wen Wang, Meng Ku Chi, Yan-Cheng Chen, Jun-Xiu Liu
  • Publication number: 20250008707
    Abstract: Disclosed is a compact electronic device configured to efficiently manage air circulation and prevent overheating. The device features an innovative cooling system comprising a fan module within a uniquely structured housing that includes a base portion, an inner casing, and a removable top cover. The inner casing features strategically placed windows that direct drawn airflow over specific power supply components, enhancing cooling performance. The enhanced cooling is also provided by an air gap formed between the base portion and the top cover, as well as sidewall intake paths of varying widths adjacent the windows. These features work together to draw in and distribute ambient air effectively across heat-generating components, leveraging negative pressure created by a fan module. The result is a highly efficient cooling mechanism for compact devices such as wireless access point configured to plug into electrical outlets.
    Type: Application
    Filed: June 28, 2024
    Publication date: January 2, 2025
    Inventors: Ming-Tsung SU, Chun-Wen WANG, Yu-Ting HUANG, Chun-Hung LIU, Meng-Jung CHUANG
  • Patent number: 12172263
    Abstract: A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: December 24, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Michael Yen, Kao-Feng Liao, Hsin-Ying Ho, Chun-Wen Hsiao, Sheng-Chao Chuang, Ting-Hsun Chang, Fu-Ming Huang, Chun-Chieh Lin, Peng-Chung Jangjian, Ji James Cui, Liang-Guang Chen, Chih Hung Chen, Kei-Wei Chen
  • Publication number: 20240422936
    Abstract: An air flow redirection system for redirecting exhaust air flow away from an external surface upon which the device is positioned, the device may include a housing including a first side, a second side opposite the first side, at least one sidewall extending between the first side and second side, a vent, the vent defining an opening extending through the at least one sidewall placing an interior chamber of the device in fluid communication with an exterior region, at least one rib defining slots in the vent, and an arc. Air flow produced by a fan located in the interior chamber is directed towards the vent in a first direction, and the arc acts in combination with the at least one rib and raises a direction of the air flow upward in a second direction towards a plane of the first side as the air flow exits the vent.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 19, 2024
    Inventors: Ming-Tsung SU, Chun-Wen WANG, Chun Hung LIU, Yu-Ting HUANG
  • Patent number: 12158154
    Abstract: A control system for operating a plurality of air compressors collectively supplying compressed air to a manufacturing facility is disclosed which includes a demand forecast module configured to estimate the manufacturing facility's demand for the compressed air at a predetermined future time, a dynamic adjustment module configured to acquire a current air pressure from the manufacturing facility, the dynamic adjustment module combining the current air pressure and the estimated manufacturing facility's demand for compressed air to make a final forecast, and an optimization module configured to determine a target operating combination of the plurality of air compressors at the predetermined future time based on the final forecast and a current operating combination of the plurality of air compressors.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: December 3, 2024
    Assignee: WISTRON CORPORATION
    Inventors: Bang-Chun Wen, Ji Wang
  • Patent number: 12151932
    Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a dielectric structure disposed over a first semiconductor substrate, where the dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the dielectric structure. The second semiconductor substrate includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. An anti-stiction structure is disposed between the movable mass and the dielectric structure, where the anti-stiction structure is a first silicon-based semiconductor.
    Type: Grant
    Filed: August 3, 2023
    Date of Patent: November 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuei-Sung Chang, Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yuan-Chih Hsieh, Yi-Ren Wang
  • Publication number: 20240379595
    Abstract: A method includes providing a workpiece having a first conductive pad and a second conductive pad over a substrate, a topmost point of the second conductive pad is above that of the first conductive pad by a height difference, conformally forming a first etch stop layer on the first and the second conductive pads, forming a dielectric structure over the first etch stop layer, performing a planarization process to the dielectric structure, and after the performing of the planarization process, conformally depositing a dielectric layer over the workpiece, the dielectric layer including a first portion disposed directly over the first conductive pad and a second portion disposed directly over the second conductive pad, where a thickness difference between a thickness of the first portion of the dielectric layer and a thickness of the second portion of the dielectric layer is less than the height difference.
    Type: Application
    Filed: May 8, 2023
    Publication date: November 14, 2024
    Inventors: Hsiang-Ku Shen, Chun-Wen Hsiao, Fang-I Chih, Wen-Ling Chang
  • Publication number: 20240381564
    Abstract: Disclosed is a system including a fan module and a flexible cable. The flexible cable has a first end and a second end. The flexible cable includes a first portion at the first end electrically connected to the fan module and a second portion that extends from the first portion towards the second end and includes one or more contact targets adjacent the second end. The one or more contact targets are configured to engage one or more respective connectors on a circuit board. The fan module may further include a housing and a fan. The housing includes a first member located at a first side, a second member located at a second side, and a slot defined by the first member and the second member. The flexible cable extends through the slot and perpendicularly extends to the second side of the housing to connect to the circuit board.
    Type: Application
    Filed: May 9, 2023
    Publication date: November 14, 2024
    Inventors: Ming-Tsung SU, Wang Chun WEN
  • Publication number: 20240375939
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip (IC) including a substrate. A plurality of adhesive structures is disposed on the substrate. A microelectromechanical systems (MEMS) structure is disposed on the adhesive structures. The MEMS structure comprises a movable element disposed within a cavity. A first plurality of stopper bumps is disposed between the movable element and the substrate.
    Type: Application
    Filed: July 25, 2024
    Publication date: November 14, 2024
    Inventors: Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng
  • Publication number: 20240367964
    Abstract: A MEMS support structure and a cap structure are provided. At least one vertically-extending trench is formed into the MEMS support structure or a portion of the cap structure. A vertically-extending outgassing material portion having a surface that is physically exposed to a respective vertically-extending cavity is formed in each of the at least one vertically-extending trench. A matrix material layer is attached to the MEMS support structure. A movable element laterally confined within a matrix layer is formed by patterning the matrix material layer. The matrix layer is bonded to the cap structure. A sealed chamber containing the movable element is formed. Each vertically-extending outgassing material portion has a surface that is physically exposed to the sealed chamber, and outgases a gas to increase the pressure in the sealed chamber.
    Type: Application
    Filed: July 21, 2024
    Publication date: November 7, 2024
    Inventors: Kuei-Sung Chang, Tai-Bang An, Chun-Wen Cheng, Hung-Hua Lin
  • Publication number: 20240372283
    Abstract: An electrical plug connector may include a housing defined by a body, a first prong, and a second prong. The first prong includes a first portion and a second portion including a first recess located on the second portion. The second prong includes a third portion and a fourth portion including a second recess located on the fourth portion. Each of the first prong and second prong outwardly extend from an end of the housing. The first prong may also include a third recess located opposite the first recess and the second prong may also include a fourth recess located opposite the second recess. The recesses arranged on the first prong and second prong are configured to engage a contact member located in a corresponding receptacle of an electrical outlet to retain a position of the electrical plug connector in the electrical outlet and restrict movement in an axial direction.
    Type: Application
    Filed: May 3, 2023
    Publication date: November 7, 2024
    Inventors: Ming-Tsung SU, Wang Chun WEN
  • Patent number: 12134555
    Abstract: Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: November 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Chia Liu, Chia-Hua Chu, Chun-Wen Cheng
  • Publication number: 20240343551
    Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a dielectric layer formed over the substrate. The semiconductor device structure further includes a movable membrane formed over the dielectric layer. In addition, the movable membrane includes first recessed portions arranged in a ring shape in a top view and second recessed portions surrounded by the first recessed portions.
    Type: Application
    Filed: June 24, 2024
    Publication date: October 17, 2024
    Inventors: Yi-Chuan TENG, Chun-Yin TSAI, Chia-Hua CHU, Chun-Wen CHENG
  • Publication number: 20240296828
    Abstract: A method, system and computer program product for triggering an audio component change action is disclosed. The method includes analyzing audio corresponding to a period of time to identify one or more audio components of the audio that are matching to a defined set of feature parameters. The method also includes triggering an audio component change action on output of the audio, wherein effecting the audio component change action includes at least one of changing audio component volume and changing categorization of the one or more audio components, which may be based on NLP analyzation of preferences relating to volume and category of the one or more audio components.
    Type: Application
    Filed: March 2, 2023
    Publication date: September 5, 2024
    Inventors: CHUN WEN OOI, JIA WEI YEAP
  • Publication number: 20240271287
    Abstract: The present disclosure provides a gas sensor. The gas sensor includes a substrate, an insulating layer over the substrate, a conductor layer over and in contact with a top surface of the substrate, and a gas sensing film. The conductor layer includes a conductive pattern having a plurality of openings, and the conductive pattern is embedded in the insulating layer. The gas sensing film is formed over a portion of the conductive pattern.
    Type: Application
    Filed: April 17, 2024
    Publication date: August 15, 2024
    Inventors: MING-TA LEI, CHIA-HUA CHU, HSIN-CHIH CHIANG, TUNG-TSUN CHEN, CHUN-WEN CHENG
  • Patent number: 12054383
    Abstract: Various embodiments of the present disclosure are directed towards an electronic device that comprises a semiconductor substrate having a first surface opposite a second surface. The semiconductor substrate at least partially defines a cavity. A first microelectromechanical systems (MEMS) device is disposed along the first surface of the semiconductor substrate. The first MEMS device comprises a first backplate and a diaphragm vertically separated from the first backplate. A second MEMS device is disposed along the first surface of the semiconductor substrate. The second MEMS device comprises spring structures and a moveable element. The spring structures are configured to suspend the moveable element in the cavity. A segment of the semiconductor substrate continuously laterally extends from under a sidewall of the first MEMS device to under a sidewall of the second MEMS device.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: August 6, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Chun Yin Tsai, Wen Cheng Kuo