Patents by Inventor Chun Wen
Chun Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12043538Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a first dielectric layer formed over the substrate. The semiconductor device structure also includes a first movable membrane formed over the first dielectric layer. In addition, the first movable membrane has a first corrugated portion and a first edge portion connecting to the first corrugated portion. The semiconductor device structure further includes a second dielectric layer formed over the first movable membrane. In addition, the first edge portion is sandwiched between the first dielectric layer and the second dielectric layer, the first corrugated portion is partially sandwiched between the first dielectric layer and the second dielectric layer and is partially exposed by a cavity, and a bottom surface of the first corrugated portion is lower than a bottom surface of the first edge portion.Type: GrantFiled: April 1, 2022Date of Patent: July 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yi-Chuan Teng, Chun-Yin Tsai, Chia-Hua Chu, Chun-Wen Cheng
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Publication number: 20240234213Abstract: A semiconductor device structure is provided. The semiconductor device structure includes an isolation feature formed over a substrate that includes a first fin and a second fin separated from each other by the isolation feature. The semiconductor device structure also includes an insulating fin structure formed in the isolation feature between the first fin and the second fin. The insulating fin structure includes a first insulating fin base partially formed within the isolation feature and a first insulating capping layer formed over a top surface of the first insulating fin base.Type: ApplicationFiled: March 25, 2024Publication date: July 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chu-An LEE, Chen-Hao WU, Peng-Chung JANGJIAN, Chun-Wen HSIAO, Teng-Chun TSAI, Huang-Lin CHAO
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Publication number: 20240224001Abstract: Systems and methods for integrating an enterprise digital assistant into a public safety talkgroup. One example system includes a talkgroup server communicatively coupled to a dispatch console and a public safety digital assistant server. The talkgroup server includes an electronic processor configured to receive connection information, associated with an incident, for an enterprise digital assistant server, establish a connection with the enterprise digital assistant server based on the connection information, and generate a talkgroup for the incident, the talkgroup members including the public safety digital assistant server, the dispatch console, and the enterprise digital assistant server.Type: ApplicationFiled: December 29, 2022Publication date: July 4, 2024Inventors: Chun Wen Ooi, Jia Wei Yeap, Mohamad Fathur Hafeezat Mohd Zahari
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Publication number: 20240220850Abstract: A device, system, and method for reducing machine learning bias in machine learning generated textual lists of time-stamped events is provided. The device generates, via a machine learning algorithm, using sensor data related to the incident, a textual list of time-stamped events for an incident, one or more of the events associated with respective machine learning confidence scores. For a given time-stamped event having a respective machine learning confidence score less than a threshold confidence score, the device redacts the given event in the list and replaces it in the list with a field for receiving input, the list of rendered at a display screen with the given event in the list replaced with the field. The device receives, via an input device, input at the field and after receiving the input, un-redacts the given event, and renders, at the display screen, the received input received and the given event.Type: ApplicationFiled: December 29, 2022Publication date: July 4, 2024Inventors: Chun Wen OOI, Wooi Ping TEOH
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Publication number: 20240204817Abstract: A portable communication device having an inner sealing surface forming contours around screw bosses is provided. The device comprises non-metallic housings that mate to form an interior. A first housing comprises: an inner sidewall forming a sealing surface extending around the inner sidewall; an outer sidewall opposing the inner sidewall; and screw bosses between the inner sidewall and the outer sidewall, the sealing surface extending into the interior in respective regions of the screw bosses to form respective contours around the screw bosses. A second housing comprises: a respective sidewall, adjacent to the sealing surface, an outer circumference of the respective sidewall complementary to the sealing surface; and a compressible seal extending around the outer circumference of the respective sidewall, the compressible seal compressing against the sealing surface and the respective contours to seal the interior from moisture.Type: ApplicationFiled: December 14, 2022Publication date: June 20, 2024Inventors: Liong Siung WONG, Pedram DJAVADKHANI, Chun Wen OOI
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Patent number: 11987891Abstract: The present disclosure provides a gas sensor. The gas sensor includes a substrate, a conductor layer over the substrate, wherein the conductor layer includes a conductive pattern including a plurality of openings, the openings being arranged in a repeating pattern, an insulating layer in the plurality of openings and over a top surface of the conductive pattern, wherein the conductive pattern is embedded in the insulating layer, and a gas sensing film over a portion of the insulating layer.Type: GrantFiled: June 20, 2022Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Ming-Ta Lei, Chia-Hua Chu, Hsin-Chih Chiang, Tung-Tsun Chen, Chun-Wen Cheng
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Patent number: 11987494Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.Type: GrantFiled: March 8, 2021Date of Patent: May 21, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng
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Publication number: 20240163987Abstract: A dimming circuit is configured to generate a dimming signal to control a brightness of a light emitting device. The brightness is correlated with a duty ratio of the dimming signal. The dimming circuit is configured to count a conduction time of the dimming signal according to a programmable period count code and a programmable brightness code, based upon a fundamental frequency, wherein when the conduction time is less than a conduction time lower limit, based upon a down conversion ratio, the dimming circuit reduces a frequency of the dimming signal according to the programmable period count code and the programmable brightness code, wherein the down conversion ratio is greater than 1 to an extent where a dimming conduction time is greater than or equal to a conduction time lower threshold.Type: ApplicationFiled: August 30, 2023Publication date: May 16, 2024Inventors: Chun-Wen Wang, Yi-Hua Chang, Hsing-Shen Huang
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Patent number: 11983041Abstract: A flexible display, including a stand, a supporting mechanism, a flexible screen, a driving component, a driven component, and a link, is provided. The supporting mechanism is connected to the stand. The flexible screen is attached to the supporting mechanism. The driving component is disposed on the stand. The driven component is disposed on a side of the supporting mechanism distant from the stand. The link has a first end and a second end opposite to the first end. The first end is connected to the driving component, and the second end is connected to the driven component. The driving component drives the driven component through the link to move on a first horizontal plane to drive the supporting mechanism and the flexible screen to transform when the driving component moves between the first horizontal plane and a second horizontal plane that is parallel to the first horizontal plane.Type: GrantFiled: October 21, 2021Date of Patent: May 14, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Yu-Wen Cheng, Yan-Yu Chen, Chun-Wen Wang, Chung-Lin Hsieh
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Patent number: 11970387Abstract: A micro-electro mechanical system (MEMS) device includes a MEMS substrate, at least one movable element laterally confined within a matrix layer that overlies the MEMS substrate, and a cap substrate bonded to the matrix layer through bonding material portions. A first movable element selected from the at least one movable element is located inside a first chamber that is laterally bounded by the matrix layer and vertically bounded by a first capping surface that overlies the first movable element. The first capping surface includes an array of downward-protruding bumps including respective portions of a dielectric material layer. Each of the downward-protruding bumps has a vertical cross-sectional profile of an inverted hillock. The MEMS device can include, for example, an accelerometer.Type: GrantFiled: March 21, 2022Date of Patent: April 30, 2024Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Chun-wen Cheng, Chi-Hang Chin, Kuei-Sung Chang
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Publication number: 20240107325Abstract: A computer system (such as a controller) that selects channels and/or channel widths for use during communication in a shared band of frequencies is described. During operation, the computer system may receive, associated with access points in a region (such as a zone), information specifying unavailable channels associated with the shared band of frequencies, where the unavailable channels are currently used by the access points. For example, the information may be included in access-point status reports from the access points. Then, based at least in part on the unavailable channels, the computer system may determine the channels and/or the channel widths for use by the access points during communication in the shared band of frequencies in the region. Next, the computer system may provide, addressed to the access points, second information specifying the determined channels and/or the channel width.Type: ApplicationFiled: September 26, 2023Publication date: March 28, 2024Applicant: ARRIS Enterprises LLCInventors: Yuan-Yao Chang, Shao-Chun Wen
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Patent number: 11942373Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first fin, a second fin and a third fin therebetween. A first insulating structure includes a first insulating layer formed between the first and third fins, a capping structure covering the first insulating layer, a first insulating liner covering sidewall surfaces of the first insulating layer and the capping structure and a bottom surface of the first insulating layer, and a second insulating liner formed between the first insulating liner and the first fin and between the first insulating liner and the third fin. The second insulating structure includes a second insulating layer formed between the second fin and the third fin and a third insulating liner formed between the second insulating layer and the second fin and between the second insulating layer and the third fin.Type: GrantFiled: May 10, 2023Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chu-An Lee, Chen-Hao Wu, Peng-Chung Jangjian, Chun-Wen Hsiao, Teng-Chun Tsai, Huang-Lin Chao
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Publication number: 20240085678Abstract: Various embodiments of the present disclosure are directed towards a camera module comprising flat lenses. Flat lenses have reduced thicknesses compared to other types of lenses, whereby the camera module may have a small size and camera bumps may be omitted or reduced in size on cell phones and the like incorporating the camera module. The flat lenses are configured to focus visible light into a beam of white light, split the beam into sub-beams of red, green, and blue light, and guide the sub-beams respectively to separate image sensors for red, green, and blue light. The image sensors generate images for corresponding colors and the images are combined into a full-color image. Optically splitting the beam into the sub-beams and using separate image sensors for the sub-beams allows color filters to be omitted and smaller pixel sensors. This, in turn, allows higher quality imaging.Type: ApplicationFiled: May 8, 2023Publication date: March 14, 2024Inventors: Jung-Huei Peng, Chun-Wen Cheng, Yi-Chien Wu, Tsun-Hsu Chen
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Patent number: 11895734Abstract: Techniques for converged incident management workflows between private and public safety are provided. A workflow server connected to a network and associated with an enterprise detects that a workflow has been initiated. The workflow includes an action to request a public safety response. A workflow identifier for the workflow that has been initiated is sent to a public safety network. Information associated with the workflow that has been initiated is sent to the public safety network. An indication of capabilities of the public safety response is received. The workflow server creates at least one of a trigger node and an action node associated with the indication of capabilities of the public safety response. At least one existing workflow within the workflow server is modified to include the at least one of the trigger node an action node associated with the indication of capabilities of the public safety response.Type: GrantFiled: December 9, 2021Date of Patent: February 6, 2024Assignee: MOTOROLA SOLUTIONS, INC.Inventors: Chun Wen Ooi, Wooi Ping Teoh
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Publication number: 20240036294Abstract: An optical device includes a substrate, a first electrode, a second electrode, and a first lens. The first electrode and the second electrode are over the substrate and configured to generate a first electric field. The first lens is between the first electrode and the second electrode and has a focal length that varies in response to the first electric field applied to the first lens.Type: ApplicationFiled: July 28, 2022Publication date: February 1, 2024Inventors: WEI-LIN CHEN, CHING-CHUNG SU, JUNG-HUEI PENG, CHUN-WEN CHENG, CHUN-HAO CHOU, KUO-CHENG LEE
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Publication number: 20240039065Abstract: A battery module including a battery frame, a plurality of locking structures, a plurality of battery units, and a plurality of lug structures is provided. The battery frame is provided with an accommodating space. The battery frame includes a first portion extending along a first direction and a second portion extending along a second direction. The first direction is different from the second direction. The locking structures are disposed on the battery frame. At least one of the plurality of locking structures is disposed on an outer side of each of the first portion and the second portion. The battery units are disposed in the accommodating space. Each of the lug structures includes a lock portion configured to detachably engage with one of the locking structures.Type: ApplicationFiled: February 21, 2023Publication date: February 1, 2024Inventors: Po-Ching HUANG, Hui Wen CHIU, Chun-Wen WANG, Pao-Long FAN, Cheng-Ping TSAI, Ting-Jui HU, Chao Chan TAN, Ming-Hung YAO, Chien-Chih SHIH, Jui-Liang HO, Ching-Kai YU, Chih-Wei LAI
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Patent number: 11879756Abstract: A position detection module and a position detection system thereof are provided. The position detection module includes a first output port, a second output port, a third output port and a fourth output port. The first output port outputs a first detection signal, the second output port outputs a first position signal, the third output port outputs a second detection signal, and the fourth output port outputs a second position signal. Thus, the design of two sets of detection signals and position signals enables the position detection module to be fault-tolerant for meeting the requirements of safe dual-channel.Type: GrantFiled: March 25, 2022Date of Patent: January 23, 2024Assignee: Techman Robot Inc.Inventors: Chun-Wen Lai, Chih-Jan Kao, Yen-Chou Lu
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Patent number: 11846556Abstract: A dual-loop torque sensing system includes four position sensors disposed in the motor and the reduction drive to form a dual-loop for detection to calculate the output torques. The detection of the position sensors is for confirming abnormality of the dual-loop or the position sensors. A failure alarm is issued to enhance the safety of the working environment.Type: GrantFiled: November 4, 2021Date of Patent: December 19, 2023Assignee: TECHMAN ROBOT INC.Inventors: Chun-Wen Lai, Yu-Chin Jiang
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Patent number: 11848395Abstract: The present invention discloses a method for preparing a bifacial PERC solar cell. The present invention has high photoelectric conversion efficiency, high appearance quality, and high EL yield, and could solve the problems of both scratching and undesirable deposition.Type: GrantFiled: December 21, 2020Date of Patent: December 19, 2023Assignees: Guangdong Aiko Solar Energy Technology Co., Ltd., ZHEJIANG AIKO SOLAR ENERGY TECHNOLOGY CO., LTD.Inventors: Jiebin Fang, Kang-Cheng Lin, Chun-Wen Lai, Nailin He, Wenjie Yin, Ta-Neng Ho, Gang Chen
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Publication number: 20230382720Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical systems (MEMS) package comprising a wire-bond damper. A housing structure overlies a support substrate, and a MEMS structure is between the support substrate and the housing structure. The MEMS structure comprises an anchor, a spring, and a movable mass. The spring extends from the anchor to the movable mass to suspend and allow movement of the movable mass in a cavity between the support substrate and the housing structure. The wire-bond damper is on the movable mass or structure surrounding the movable mass. For example, the wire-bond damper may be on a top surface of the movable mass. As another example, the wire-bond damper may be on the support substrate, laterally between the anchor and the movable mass. Further, the wire-bond damper comprises a wire formed by wire bonding and configured to dampen shock to the movable mass.Type: ApplicationFiled: August 9, 2023Publication date: November 30, 2023Inventors: Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng