Patents by Inventor Chun Wen

Chun Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11121572
    Abstract: A charging service method includes transmitting information of a communication device to a charging station, transmitting information of the charging station to the communication device, acquiring available service information of the charging station from a charging station server according to the information of the charging station, selecting at least one service option for generating charging service information, transmitting the charging service information to the charging station server, generating charging station certification information to the communication device, relaying the charging station certification information from the communication device to the charging station, and enabling a charging function of the charging station to charge the communication device after the charging station certification information is received by the charging station.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: September 14, 2021
    Assignee: ITE Tech. Inc.
    Inventors: Chun-Wen Lin, Ming-Hsun Sung
  • Publication number: 20210280524
    Abstract: A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.
    Type: Application
    Filed: May 23, 2021
    Publication date: September 9, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Lin, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu
  • Publication number: 20210273358
    Abstract: A printed circuit board (PCB) connector interface module and an accessory system. The module including a first layer, a second layer, and a plurality of inner layers. The first layer includes a first set of contact pads configured to electrically connect to an accessory device, and a heat and scratch resistant coverlay that is adjacent to and has a first surface that is level with a first surface of the first set of contact pads. The second layer including a second set of contact pads configured to electrically connect to an internal printed circuit board (PCB) of an electronic apparatus. The plurality of inner layers including one or more printed circuit boards (PCB) and a plurality of contact vias, wherein the plurality of contact vias electrically connect the first set of contact pads to the second set of contact pads.
    Type: Application
    Filed: February 27, 2020
    Publication date: September 2, 2021
    Inventors: Chun Wen Ooi, Jorge L. Garcia, Siew Im Low, Kay Siang Sim, Wooi Ping Teoh
  • Publication number: 20210265222
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate having adjacent first and second fins protruding from the substrate. A first gate structure and a second gate structure are across the first and second fins, respectively. An insulating structure is formed between the first gate structure and the second gate structure and includes a first insulating layer separating the first fin from the second fin, a capping structure formed in the first insulating layer, and a second insulating layer covered by the first insulating layer and the capping structure.
    Type: Application
    Filed: April 30, 2021
    Publication date: August 26, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chu-An LEE, Chen-Hao WU, Peng-Chung JANGJIAN, Chun-Wen HSIAO, Teng-Chun TSAI, Huang-Lin CHAO
  • Patent number: 11099152
    Abstract: The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: August 24, 2021
    Inventors: Yi-Shao Liu, Chun-Ren Cheng, Ching-Ray Chen, Yi-Hsien Chang, Fei-Lung Lai, Chun-Wen Cheng
  • Publication number: 20210255663
    Abstract: A head-mounted display device includes a display assembly, a rotating assembly, and a fixed assembly. The rotating assembly is connected to the display assembly and includes a motor holder, a motor and a first connecting element. The motor is disposed on the motor holder. The first connecting element has a first accommodating portion and a second accommodating portion, wherein the first connecting element receives a part of the motor and the second connecting element receives a part of the motor holder. The fixed assembly is connected to the rotating assembly. The rotating assembly rotates the display assembly relative to the fixed assembly.
    Type: Application
    Filed: July 30, 2020
    Publication date: August 19, 2021
    Inventors: Chun-Lung CHEN, Yuan-Peng YU, Chun-Wen WANG, Chia-Hsing SHIH, Hung-Chieh WU, Chang-En TSAI
  • Publication number: 20210246014
    Abstract: A MEMS support structure and a cap structure are provided. At least one vertically-extending trench is formed into the MEMS support structure or a portion of the cap structure. A vertically-extending outgassing material portion having a surface that is physically exposed to a respective vertically-extending cavity is formed in each of the at least one vertically-extending trench. A matrix material layer is attached to the MEMS support structure. A movable element laterally confined within a matrix layer is formed by patterning the matrix material layer. The matrix layer is bonded to the cap structure. A sealed chamber containing the movable element is formed. Each vertically-extending outgassing material portion has a surface that is physically exposed to the sealed chamber, and outgases a gas to increase the pressure in the sealed chamber.
    Type: Application
    Filed: February 7, 2020
    Publication date: August 12, 2021
    Inventors: Kuei-Sung Chang, Tai-Bang An, Chun-wen Cheng, Hung-Hua Lin
  • Patent number: 11089408
    Abstract: A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: August 10, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Chun Yin Tsai
  • Publication number: 20210238030
    Abstract: Various embodiments of the present disclosure are directed towards a method for forming a microelectromechanical systems (MEMS) device. The method includes forming a filter stack over a carrier substrate. The filter stack comprises a particle filter layer having a particle filter. A support structure layer is formed over the filter stack. The support structure layer is patterned to define a support structure in the support structure layer such that the support structure has one or more segments. The support structure is bonded to a MEMS structure.
    Type: Application
    Filed: March 31, 2021
    Publication date: August 5, 2021
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Wen Cheng Kuo
  • Patent number: 11078074
    Abstract: Processes for integrating complementary metal-oxide-semiconductor (CMOS) devices with microelectromechanical systems (MEMS) devices are provided. In some embodiments, the MEMS devices are formed on a sacrificial substrate or wafer, the sacrificial substrate or wafer is bonded to a CMOS die or wafer, and the sacrificial substrate or wafer is removed. In other embodiments, the MEMS devices are formed over a sacrificial region of a CMOS die or wafer and the sacrificial region is subsequently removed. Integrated circuit (ICs) resulting from the processes are also provided.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: August 3, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu
  • Patent number: 11079808
    Abstract: A dual-axis hinge assembly including a first rotating shaft, a second rotating shaft, torque components, a rotating shaft sleeve, a first bracket, a second bracket, and two bracket sleeves is provided. The second rotating shaft is disposed side-by-side to the first rotating shaft. The torque components are disposed at the first rotating shaft and the second rotating shaft. The rotating shaft sleeve covers the first rotating shaft, the second rotating shaft, and the torque components. The first bracket is connected to the first rotating shaft. The second bracket is connected to the second rotating shaft. The two bracket sleeves are respectively coaxial with the first rotating shaft and the second rotating shaft and respectively cover the first bracket and the second bracket. The two bracket sleeves and the rotating shaft sleeve are sleeved together. The invention further provides a plurality of electronic devices.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: August 3, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hsin-Chieh Fang, Wang-Hung Yeh, Shu-Hung Lin, Chun-Wen Wang
  • Publication number: 20210232745
    Abstract: A semiconductor wafer defect detection system captures test images of a semiconductor wafer. The system analyzes the test images with an analysis model trained with a machine learning process. The analysis model generates simulated integrated circuit layouts based on the test images. The system detects defects in the semiconductor wafer by comparing the simulated integrated circuit layouts to reference integrated circuit layouts.
    Type: Application
    Filed: November 24, 2020
    Publication date: July 29, 2021
    Inventors: Chung-Pin CHOU, Chun-Wen WANG, Meng Ku CHI, Yan-Cheng CHEN, Jun-Xiu LIU
  • Publication number: 20210226077
    Abstract: The present invention discloses a method for preparing a bifacial PERC solar cell. The present invention has high photoelectric conversion efficiency, high appearance quality, and high EL yield, and could solve the problems of both scratching and undesirable deposition.
    Type: Application
    Filed: December 21, 2020
    Publication date: July 22, 2021
    Inventors: Jiebin Fang, Kang-Cheng Lin, Chun-Wen Lai, Nailin He, Wenjie Yin, Ta-Neng Ho, Gang Chen
  • Patent number: 11051109
    Abstract: A MEMS microphone includes a substrate having an opening, a first diaphragm, a first backplate, a second diaphragm, and a second backplate. The first diaphragm faces the opening in the substrate. The first backplate includes multiple accommodating-openings and it is spaced apart from the first diaphragm. The second diaphragm joints the first diaphragm together at multiple locations by pillars passing through the accommodating-openings in the first backplate. The first backplate is located between the first diaphragm and the second diaphragm. The second backplate includes at least one vent hole and it is spaced apart from the second diaphragm. The second diaphragm is located between the first backplate and the second backplate.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: June 29, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Wen-Tuan Lo
  • Patent number: 11050189
    Abstract: An accessory connector (102) and connector system (100) are provided. The accessory connector (102) comprises and edge tongue portion at one end and a thumb screw recess at the opposite end with a floating header therebetween. The edge tongue portion enables pivotal engagement of the accessory connector to a device interface. The floating header (110) has a perimeter alignment wall (112) surrounding a plurality of pogo pins (114) recessed therein. The floating header is movable in planar directions within the accessory connector prior to attachment of the connector to the radio connector interface (154). The x-y moveability allows for fine alignment of the pogo pins to corresponding contacts and loading of the pogo pins to the contacts in a z-direction.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: June 29, 2021
    Assignee: MOTOROLA SOLUTIONS, INC.
    Inventors: Jorge L Garcia, Kiok Yung Lee, Chun Wen Ooi
  • Publication number: 20210188627
    Abstract: Various embodiments of the present disclosure are directed towards a method for manufacturing a microelectromechanical systems (MEMS) device. The method includes forming a particle filter layer over a carrier substrate. The particle filter layer is patterned while the particle filter layer is disposed on the carrier substrate to define a particle filter in the particle filter layer. A MEMS substrate is bonded to the carrier substrate. A MEMS structure is formed over the MEMS substrate.
    Type: Application
    Filed: March 5, 2021
    Publication date: June 24, 2021
    Inventors: Chia-Hua Chu, Chun-Wen Cheng, Wen Cheng Kuo
  • Patent number: 11040870
    Abstract: Various embodiments of the present disclosure are directed towards a microelectromechanical system (MEMS) device. The MEMS device includes a dielectric structure disposed over a first semiconductor substrate, where the dielectric structure at least partially defines a cavity. A second semiconductor substrate is disposed over the dielectric structure. The second semiconductor substrate includes a movable mass, where opposite sidewalls of the movable mass are disposed between opposite sidewall of the cavity. An anti-stiction structure is disposed between the movable mass and the dielectric structure, where the anti-stiction structure is a first silicon-based semiconductor.
    Type: Grant
    Filed: July 25, 2019
    Date of Patent: June 22, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuei-Sung Chang, Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yuan-Chih Hsieh, Yi-Ren Wang
  • Publication number: 20210179419
    Abstract: A micro-electro mechanical system (MEMS) device includes a MEMS substrate, at least one movable element laterally confined within a matrix layer that overlies the MEMS substrate, and a cap substrate bonded to the matrix layer through bonding material portions. A first movable element selected from the at least one movable element is located inside a first chamber that is laterally bounded by the matrix layer and vertically bounded by a first capping surface that overlies the first movable element. The first capping surface includes an array of downward-protruding bumps including respective portions of a dielectric material layer. Each of the downward-protruding bumps has a vertical cross-sectional profile of an inverted hillock. The MEMS device can include, for example, an accelerometer.
    Type: Application
    Filed: December 16, 2019
    Publication date: June 17, 2021
    Inventors: Chun-wen CHENG, Chi-Hang CHIN, Kuei-Sung CHANG
  • Patent number: 11027310
    Abstract: The present disclosure relates to a method of depositing a fluid onto a substrate. In some embodiments, the method may be performed by mounting a substrate to a micro-fluidic probe card, so that the substrate abuts a cavity within the micro-fluidic probe card that is in communication with a fluid inlet and a fluid outlet. A first fluidic chemical is selectively introduced into the cavity via the fluid inlet of the micro-fluidic probe card.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: June 8, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Wen Cheng, Jung-Huei Peng, Yi-Shao Liu, Fei-Lung Lai, Shang-Ying Tsai
  • Patent number: D923618
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: June 29, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yu-Wen Cheng, Wang-Hung Yeh, Chun-Wen Wang