Abstract: A data storage device utilized for confirming firmware data includes a flash memory and a controller. The controller is coupled to the flash memory to receive first firmware data and first sorting hash data related to the first firmware data, and it divides a first hash data generated from the first firmware data into a plurality of data groups, and re-assembles the data groups according to a mapping and sorting algorithm to generate second sorting hash data. The controller includes an efuse region for writing the mapping and sorting algorithm. When the controller determines that the second sorting hash data is identical to the first sorting hash data, the first firmware data is allowed to update the controller.

Abstract: In an embodiment, a method includes: receiving, within a processing chamber, a wafer with a photoresist mask above a metal layer, wherein the processing chamber is connected to a gas source; applying an etchant configured to etch the metal layer in accordance with the photoresist mask within the processing chamber; and applying gas from the gas source to perform plasma ashing in the processing chamber.

Abstract: The present disclosure provides a method for packaging a camera assembly. The method includes: providing a photosensitive chip; mounting an optical filter on the photosensitive chip; temporarily bonding the photosensitive chip and functional components on a carrier substrate, where the photosensitive chip has soldering pads facing away from the carrier substrate and the functional components have soldering pads facing toward the carrier substrate; forming an encapsulation layer covering the carrier substrate, the photosensitive chip, and the functional components, and exposing the optical filter; after the encapsulation layer is formed, removing the carrier substrate; and after the carrier substrate is removed, forming a redistribution layer structure on a side of the encapsulation layer facing away from the optical filter to electrically connect the soldering pads of the photosensitive chip with the soldering pads of the functional components.

Abstract: Camera assemblies and packaging methods, lens modules and electronic devices are provided. An exemplary packaging method of the camera assembly includes providing a photosensitive chip having a soldering pad and a filter; mounting the filter to the photosensitive chip with the filter facing the soldering pad of the photosensitive chip; providing a first carrier substrate and temporarily bonding functional components and the filter on the first carrier substrate, wherein the functional component contains a soldering pad facing the first carrier substrate; forming an encapsulation layer to cover the first carrier substrate and the functional components, and at least cover portions of sidewall surfaces of the photosensitive chip; removing the first carrier substrate; and forming a re-distribution layer structure on a side of the encapsulation layer adjacent to the filter to electrically connect the soldering pad of the photosensitive chip and the soldering pad of the functional component.

Abstract: The present disclosure provides a method for packaging a camera assembly. The method includes providing a photosensitive chip having a plurality of first soldering pads; mounting a filter on the photosensitive chip; providing a first carrier substrate; and bonding a plurality of functional components and the photosensitive chip to the first carrier substrate. The plurality of functional components has a plurality of second soldering pads, and the first soldering pads and the second soldering pads all face away from the first carrier substrate. The method includes forming an encapsulation layer to cover the first carrier substrate, the photosensitive chip, and the functional components. The encapsulation layer exposes the filter. The method further includes forming a redistribution layer structure, on one side of the encapsulation layer close to the filter, to electrically connect to the first soldering pads and the second soldering pads; and removing the first carrier substrate.

Abstract: The present disclosure provides an image capturing assembly and its packaging method, a lens module and an electronic device. The packaging method includes: providing a photosensitive chip; mounting an optical filter on the photosensitive chip; providing a carrier substrate and temporarily bonding the photosensitive chip and functional components on the carrier substrate; and forming an encapsulation layer on the carrier substrate and at least between the photosensitive chip and the functional components.

Abstract: An image capturing assembly and its packaging method are provided. The method includes: providing a photosensitive chip having soldering pads and a mounted optical filter; bonding functional components on a provided first carrier substrate temporarily, where the functional components have soldering pads facing away from or facing toward the first carrier substrate; forming an encapsulation layer at least being filled between the functional components on the first carrier substrate, and forming a through hole in the encapsulation layer; placing the photosensitive chip in the through hole and bonding the photosensitive chip on the first carrier substrate temporarily, where the soldering pads of the photosensitive chip face away from the first carrier substrate; and after the photosensitive chip is temporarily bonded on the first carrier substrate, forming a redistribution layer structure to electrically connect the soldering pads of the photosensitive chip with the soldering pads of the functional components.

Abstract: The present disclosure provides a camera assembly and a packaging method thereof, a lens module, and an electronic device.

Abstract: The present disclosure provides a method for forming a photosensitive assembly. The method includes providing a transparent cover plate; providing a photosensitive chip, including a photosensitive region and a peripheral region surrounding the photosensitive region; and bonding the transparent cover plate to the photosensitive chip through a bonding layer located in the peripheral region of the photosensitive chip. The transparent cover plate, the bonding layer, and the photosensitive chip enclose a cavity that accommodates the photosensitive region. The method further includes forming an encapsulation layer to at least cover the sidewall of the bonding layer and the sidewall of the transparent cover plate.

Abstract: A data storage device includes a memory device and a controller. The memory device includes multiple memory blocks. Each memory block includes multiple pages. The controller is coupled to the memory device and includes an ECC engine configured to check and correct errors that have occurred in data stored in the memory blocks. When a number of error bits in a page of one of the memory blocks exceeds a threshold, the controller is configured to add a block number of the memory block in a predetermined queue and when a garbage collection procedure has been triggered, the controller is configured to perform garbage collection on the memory block.

Abstract: The present invention is a scalable multi-service virtual assistant platform that can construct a fluid and dynamic dialogue by assembling responses to end user utterances from two kinds of agents, information agents and action agents. The information agents and action agents are managed by a masterbot or arbiter. The virtual assistant can gain new skills by getting instructions about a new service expressed in a form of pre-requisites and action combinations; the virtual assistant platform automatically handles dialogue generation, arbitration and optimization to survey prerequisites from the end user, and eventually to take action. The present invention allows a large number of services to implemented using a small number of building blocks. These building blocks can be used to assemble a much larger number of services. In turn, each service can be delivered through a large variety of conversations with end users, enabling a fluid and dynamic dialogue to be seamlessly implemented.

Abstract: The invention introduces a method for reducing data errors in transceiving of a flash storage interface, performed by a processing unit of a first side, at least including: descrambling first data from a second side via an enabled descrambler of a lowest layer; determining whether a reception error is occurred by continuously monitoring first descrambled data; sending a NAC (negative acknowledgement control) frame to the second side to inform the second side that the reception error is occurred for the first data each time the reception error is determined for the first descrambled data; and when a total number of occurrences of the reception errors reaches a predefined threshold, disabling the descrambler of the lowest layer.

Abstract: A projection lens structure includes a first group of lens, an aperture stop and a second group of lend. The aperture stop is arranged at a rear of the first group of lens to form a long-focus lens with a focal length between 30-80 mm and the second group of lens is arranged at a rear of the aperture stop to form a short-focus lens with a focal length between 20-30 mm. With the long-focus lens and the short-focus lens operated correspondingly, the structure of the projection lens is simple and the manufacturing cost is low without affecting the quality of produced images.

Abstract: A data storage device includes a memory device and a controller. The memory device includes a first buffer, a second buffer, and a backup memory block. The first buffer is an MLC block and the second buffer is an SLC block. The controller is coupled to the memory device, receives a write command to write predetermined data in the memory device and determines whether the predetermined data has to be written into different buffers. When the controller determines that the predetermined data has to be written into different buffers, the controller writes a portion of the predetermined data that has been written in one or more predetermined pages of the first buffer into the backup memory block.

Abstract: A data storage device includes a memory device and a controller. The memory device includes multiple memory blocks. The memory blocks include single-level cell blocks and multiple-level cell blocks. The controller is coupled to the memory device. When the controller executes a predetermined procedure to write data stored in the single-level cell blocks into the multiple-level cell blocks, the controller is configured to determine whether a valid page count corresponding to each single-level cell block is greater than a threshold, and when the valid page count corresponding to more than one single-level cell block is greater than the threshold, the controller is configured to execute a first merge procedure to directly write the data stored in the single-level cell blocks with the valid page count greater than the threshold into one or more of the multiple-level cell blocks.

Abstract: A projection lens structure includes a first group of lens, an aperture stop and a second group of lend. The aperture stop is arranged at a rear of the first group of lens to form a long-focus lens with a focal length between 30-80 mm and the second group of lens is arranged at a rear of the aperture stop to form a short-focus lens with a focal length between 20-30 mm. With the long-focus lens and the short-focus lens operated correspondingly, the structure of the projection lens is simple and the manufacturing cost is low without affecting the quality of produced images.

Abstract: A planar heating structure is disclosed. The planar heating structure includes a glass substrate layer, a nanometallic transparent conductive layer, and a first passivation layer. The nanometallic transparent conductive layer is disposed on the glass substrate layer and receives a voltage to generate heat energy. The first passivation layer is disposed on the nanometallic transparent conductive layer and completely covers the nanometallic transparent conductive layer.

Abstract: Provided herein is a method for manufacturing a semiconductor device. A substrate including a MEMS region and a connection region thereon is provided; a dielectric layer disposed on the substrate in the connection region is provided; a poly-silicon layer disposed on the dielectric layer is provided, wherein the poly-silicon layer serves as an etch-stop layer; a connection pad disposed on the poly-silicon layer is provided; and a passivation layer covering the dielectric layer is provided, wherein the passivation layer includes an opening that exposes the connection pad and a transition region between the connection pad and the passivation layer, and a conductive layer conformally covering the connection pad and the poly-silicon layer in the transition region is provided.

Abstract: A data storage device is provided. The data storage device includes a flash memory and a controller. The flash memory stores a firmware. The firmware includes a plurality of mode page settings, and each mode page setting includes a plurality of mode parameters. The controller receives a mode selection command and a data out message arranged to rewrite a first mode page setting among the plurality of mode page settings from a host. The controller determines whether the data out message will change the mode parameters which cannot be rewritten in the first mode page setting according to the data out message. When the data out message will not change the mode parameters which cannot be rewritten in the first mode page setting, the controller determines whether a plurality of new mode parameters are kept in the flash after the data storage device is turned off.

Abstract: A tunable antenna device includes a substrate, a switch, a control circuit, an antenna and a frequency adjustment portion. The substrate includes first and second surfaces and first and second through-holes. The switch is on the first surface and includes first, second and first control terminals. The control circuit is on the first surface and electrically coupled to the first control terminal. The antenna is on the second surface and includes first and second radiation members. The frequency adjustment portion is on the second surface and includes first and second metal portions. The first metal portion includes a first interdigital structure electrically coupled to the first radiation member. The second metal portion includes second and third interdigital structures electrically coupled to the second radiation member. The second and third interdigital structures are electrically coupled to the first and second terminals through the first and second through-holes respectively.