Abstract: A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps is formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to the carrier through the bumps. The underfill is filled between the chip and the carrier. A portion of the underfill near the chip serves as a first underfill portion. The portion of the underfill near the carrier serves as a second underfill portion. The Young's modulus of the first underfill portion is smaller than the Young's modulus of the second underfill portion. The second underfill portion can be optionally replaced with a selected encapsulation. The selected encapsulation covers the chip and the carrier around the chip.

Abstract: A blower includes a scroll housing and a damping rib. The scroll housing includes a body portion for guiding air, a hopper portion for discharging the air through an outlet, and a recess formed between the body portion and the hopper portion. The damping rib is adjacent to the recess connecting the body portion with the hopper portion to enhance structural integrity of the scroll housing.

Abstract: In one preferred embodiment, an objective lens actuator includes a base, a suspension apparatus mounted on the base, a holder suspended by the suspension apparatus for holding an objective lens, a voice coil motor (VCM) for driving the holder to vibrate, and a cover. The VCM includes a first yoke, a second yoke and a pair of magnets fixed on the first yoke and the second yoke respectively. The first yoke and the second yoke respectively include a first part and a second part. The cover is made of a material having a magnetic conductivity. The cover connects the first part and the second part of each of the first yoke and the second yoke.

Abstract: A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps are formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to the carrier through the bumps. The underfill is filled between the chip and the carrier. A portion of the underfill near the chip serves as a first underfill portion. The portion of the underfill near the carrier serves as a second underfill portion. The Young's modulus of the first underfill portion is smaller than the Young's modulus of the second underfill portion. The second underfill portion can be optionally replaced with a selected encapsulation. The selected encapsulation covers the chip and the carrier around the chip.

Abstract: A recording medium and a method for previewing and selecting digital audio/video data unit on the recording medium are provided. The recording medium includes an audio/video pack of the original film, an audio/video pack of the preview film, a background page, and a page control descriptor. After having received a switch button information from a user, a medium reproducing system reads, de-multiplexes, and decodes the information correspond to a specified audio/video pack of the preview film. The medium reproducing system also composes the decoded video data of the background page and the decoded video data of different resolutions to output to a display.

Abstract: This invention provides a recording medium, and a method for storing and reproducing digital image medium data on the recording medium. It is applicable to a medium information reproducing system, and allows users to edit and store the digital image medium data. When reproducing a video image, the video image is accompanied by auxiliary audio data. Therefore, the reproduced medium data is more alive and attractive for the viewers. In addition, the recording medium supports various formats of video and audio data. Therefore, the recording medium can record various types of medium data for the users.

Abstract: A semiconductor package includes spacers, a chip, bonding wires, contacts, and an encapsulant. The chip is disposed on the spacers. The bonding wires are electrically connected to the chip, and the contacts are electrically connected to the bonding wires. The contacts are electrically connected to an external circuit board. The encapsulant encapsulates the spacers and the active and back surfaces of the chip so as to lower the thermal stress of the chip.

Abstract: A cooling/heating pad of the present invention includes a pad portion, a water reservoir system and a heat exchanger, wherein the pad portion has the pad portion is a foldable, thin, double-layered bag and has a plurality of adhered regions formed by a hot-press or ultrasonic hot melting process to form the water channel between the adhered regions; the water reservoir system has a water reservoir and a water circulating pump, the water reservoir having a water inlet and a water outlet, the water inlet of the water reservoir connected to the water outlet of the water channel, and the water circulating pump moving the cooling water in the water reservoir from the water outlet of the water reservoir to the water inlet of the water channel; and the heat exchanger includes an electrical heating semiconductor chip, and a thermal conductor mounted on one side of the electrical heating semiconductor chip; wherein the thermal conductor directly contacts the cooling water in the water reservoir, or is mounted on a wat

Abstract: A conductive jointing structure that is applied on a chip with multitude of connection pads has a first conductive structure and a second conductive structure. The first conductive structure is allocated on one of the contact pads. The second conductive structure made of lead-free based material is consisted of multitude of stacked portions with respectively different modulus. The portion contacting the first conductive structure is with small modulus, while the portion away from the first conductive structure is with large modulus.

Abstract: A flip chip package with a thermometer comprises a chip, a substrate, and a thermocouple. The chip has an active surface and a plurality of bumps disposed on the active surface. The substrate defines a region for disposing the chip, and comprises a plurality of bump pads disposed on the region, corresponding to the bumps, and electrically connected to the bumps. Each of the thermocouples comprises a thermal contact which is disposed between the substrate and one of the bumps of the chip.

Abstract: An asymmetric bump structure for wafer is provided. First, the wafer includes multi-chip units each of which has an active surface. The asymmetric bump structure includes a conductive surface on the active surface, a conductive structure contacted the portion of the conductive surface and located on the both conductive surface and the active surface, and a conductive material contacted the conductive structure. The conductive material and the conductive structure contacted part of the conductive surface have respective geometric centers which are not on an identical vertical axis.

Abstract: A chip package structure comprising a carrier, a chip and an underfill layer is disclosed. The carrier has a plurality of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps such that the active surface of the chip faces the carrier. The underfill layer is disposed on the carrier between the chip and the carrier such that a gap is maintained between the underfill layer and the chip.

Abstract: A chip package structure is provided. The chip package structure has a chip and a carrier, wherein the carrier has a package substrate and a plurality of contacts. The package substrate has a carrying surface and a back surface. The chip is disposed on the carrying surface of the package substrate, and the contacts are disposed on the back surface of the package substrate in a pattern of a plurality of concentric circles. Additionally, the chip package structure can be disposed on a circuit board with solder balls formed on the contacts to form a circuit board package structure. The thermal stress exerted on the solder balls may be uniformly distributed in the carrier, the chip package structure, and the circuit board package structure. The bonding strength between the package substrate and the circuit board is improved.

Abstract: A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the cavity. Thereafter, a chip is disposed on the first encapsulant and the chip is electrically connected to the circuit substrate. Finally, a compound is deposited over the first encapsulant and the chip to form a chip package. The chip package is warp resistant and the chip packaging process increases overall production yield.

Abstract: A chip package structure comprises a carrier, a chip and an underfill. The chip has an active surface on which a plurality of bumps are formed. The chip is flip-chip bonded onto the carrier with the active surface facing the carrier, and is electrically connected to the carrier through the bumps. The underfill is filled between the chip and the carrier. A portion of the underfill near the chip serves as a first underfill portion. The portion of the underfill near the carrier serves as a second underfill portion. The Young's modulus of the first underfill portion is smaller than the Young's modulus of the second underfill portion. The second underfill portion can be optionally replaced with a selected encapsulation. The selected encapsulation covers the chip and the carrier around the chip.

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 ?m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.

Abstract: An under-bump-metallurgy layer is provided. The under-bump-metallurgy layer is formed over the contact pad of a chip and a welding lump is formed over the under-ball-metallurgy layer. The under-bump-metallurgy layer comprises an adhesion layer, a barrier layer and a wettable layer. The adhesion layer is directly formed over the contact pad. The barrier layer made from a material such as nickel-vanadium alloy is formed over the adhesion layer. The wettable layer made from a material such as copper is formed over the barrier layer. The wettable layer has an overall thickness that ranges from about 3 ?m to about 8 ?m.

Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 ?m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.

Abstract: An under-ball-metallurgy layer between a bonding pad on a chip and a solder bump made with tin-based material is provided. The under-ball-metallurgy layer at least includes an adhesion layer over the bonding pad, a nickel-vanadium layer over the adhesion layer, a wettable layer over the nickel-vanadium layer and a barrier layer over the wettable layer. The barrier layer prevents the penetration of nickel atoms from the nickel-vanadium layer and reacts with tin within the solder bump to form inter-metallic compound. This invention also provides an alternative under-ball-metallurgy layer that at least includes an adhesion layer over the bonding pad, a wettable layer over the adhesion layer and a nickel-vanadium layer over the wettable layer. The nickel within the nickel-vanadium layer may react with tin within the solder bump to form an inter-metallic compound.

Abstract: A semiconductor package comprises spacers, a chip, bonding wires, contacts, and an encapsulant. The chip is disposed on the spacers. The bonding wires are electrically connected to the chip, and the contacts are electrically connected to the bonding wires. The contacts are electrically connected to an external circuit board. The encapsulant encapsulates the spacers and the active and back surfaces of the chip so as to lower the thermal stress of the chip.