Patents by Inventor Da Wu
Da Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090307382Abstract: A method and system are implemented to instantaneously detect a hot plugging of a video connector in a computer device by detecting a change in the electrical state of one ground pin of the video connector. The computer device comprises a video connector having at least two ground pins, a processing unit, and a hot-plugging detection circuit coupled between the processing unit and one of the ground pins of the video connector, wherein the hot-plugging detection circuit is configured to detect a hot plugging of the video connector based on a change in voltage potential of the ground pin.Type: ApplicationFiled: June 6, 2008Publication date: December 10, 2009Inventors: Shany-I Chan, Yu-Kuo Chiang, Shih-Da Wu, Patrick Beaulieu, William S. Herz, Li-Ling Chou, Ching-Yee Feng
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Publication number: 20090298284Abstract: A method for preparing an integrated circuit structure performs a deposition process to form a precursor layer on a substrate, and the precursor layer has a phase transition property in a transition temperature region. Subsequently, a first thermal treating process is performed at a first temperature to transform the precursor layer into a polymorphous layer possessing a predetermined crystalline phase, and the first temperature is higher than an upper limit of the temperature of the transition temperature region.Type: ApplicationFiled: May 28, 2008Publication date: December 3, 2009Applicant: PROMOS TECHNOLOGIES INC.Inventors: TZU LUN CHENG, CHENG DA WU, DA YU CHUANG, WEI HENG LEE
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Publication number: 20090291548Abstract: A method for preparing a P-type polysilicon gate structure comprises the steps of forming a gate oxide layer on a substrate, forming an N-type polysilicon layer on the gate oxide layer, performing a first implanting process to convert the N-type polysilicon layer into a P-type polysilicon layer, performing a second implanting process to implant P-type dopants into a portion of the P-type polysilicon layer near the interface between the gate oxide layer and the P-type polysilicon layer, and performing a thermal treating process at a predetermined temperature for a predetermined period to complete the P-type polysilicon gate structure.Type: ApplicationFiled: May 20, 2008Publication date: November 26, 2009Applicant: PROMOS TECHNOLOGIES INC.Inventors: YUAN MING CHANG, CHENG DA WU, DA YU CHUANG, YEN TA CHEN
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Publication number: 20090266207Abstract: The safety device mainly contains a main controller, a detector, and an emergency braking member. The main controller contains a detection member connecting the detector, an alarm member producing visual or audible alarm, and a driving member for activating the emergency braking member to reverse or stop the motor of the machine tool. The detection member could be an electrostatic detection unit, or a capacitance detection unit, or a combination of the two. The detector is positioned on a top surface of a platform and in front of a saw of the machine tool. The detector could also be part of an axle of the saw so that the saw is effectively an extension of the detector and provides both cutting and safety functions.Type: ApplicationFiled: April 24, 2008Publication date: October 29, 2009Inventors: CHIH-HUI CHIU, JUN-DA WU, BO-JYUN SIAO
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Patent number: 7606119Abstract: In one preferred embodiment, an objective lens actuator includes a base, a suspension apparatus mounted on the base, a holder suspended by the suspension apparatus for holding an objective lens, a voice coil motor (VCM) for driving the holder to vibrate, and a cover. The VCM includes a first yoke, a second yoke and a pair of magnets fixed on the first yoke and the second yoke respectively. The first yoke and the second yoke respectively include a first part and a second part. The cover is made of a material having a magnetic conductivity. The cover connects the first part and the second part of each of the first yoke and the second yoke.Type: GrantFiled: June 24, 2006Date of Patent: October 20, 2009Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chih-Hang Chao, Yu-Hsu Lin, Jeng-Da Wu, Chun-Ming Chen
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Publication number: 20090213549Abstract: A heat sink assembly includes a printed circuit board, an electronic component mounted on the printed circuit board, and a heat sink mounted on the printed circuit board for dissipating heat from the electronic component. The printed circuit board includes a heat-conduction layer. The heat sink includes a base configured to contact the heat-conduction layer, and a main body extending upward from the base configured to contact the electronic component. The cross section of the base is larger than the cross section of the main body. A plurality of fins extends from the main body.Type: ApplicationFiled: September 15, 2008Publication date: August 27, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: LEI GUO, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO, YANG LI, LIANG-LIANG CAO
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Publication number: 20090188699Abstract: A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers.Type: ApplicationFiled: May 9, 2008Publication date: July 30, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: Yu-Hsu Lin, Jeng-Da Wu, Chih-Hang Chao
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Publication number: 20090190309Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.Type: ApplicationFiled: June 12, 2008Publication date: July 30, 2009Applicants: HONG FU JIN PRECISION INDUSTRy (shenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: LIANG-QING SHAN, YANG LI, YU-HSU LIN, JENG-DA WU, LIANG-LIANG CAO, LEI GUO
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Publication number: 20090185351Abstract: A mounting apparatus for mounting a heat sink on a board, includes a first locking hole defined in the heat sink, a second locking hole defined in the board, and a locking member. The locking member includes a base and a rod. The base defines a hole. A bottom of the base forms a pair of separated elastic claws around the hole. The elastic claws are inserted through the first and second locking holes. The rod includes an expanded portion. The rod slides in the hole of the base with the expanded portion located inbetween the claws to expand the claws outwards to be larger than the second locking hole to lock the locking member on the board and to mount the heat sink on the board.Type: ApplicationFiled: July 25, 2008Publication date: July 23, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) Co., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YANG LI, YU-HSU LIN, JENG-DA WU
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Publication number: 20090166062Abstract: A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier.Type: ApplicationFiled: May 10, 2008Publication date: July 2, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: ZHI-PING WU, JENG-DA WU, YU-HSU LIN, CHIH-HANG CHAO, LIANG-LIANG CAO
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Publication number: 20090166164Abstract: A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch.Type: ApplicationFiled: April 14, 2008Publication date: July 2, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: ZHI-PING WU, CHIH-HANG CHAO, YU-HSU LIN, JENG-DA WU
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Publication number: 20090168330Abstract: An electronic device includes an enclosure (30), a circuit board (40), and an airflow guiding duct (10). The enclosure includes a bottom wall (31) and a rear wall (32) perpendicular to the bottom wall. The circuit board is mounted on the bottom wall of the enclosure. The circuit board includes a first heat generating element (41) and a second heat generating element (42) near to the first heat generating element. The airflow guiding duct includes two side panels (11) and a connecting panel (13) connecting a pair of side edges (112) of the two side panels. A first opening (17) is defined by a lower edge (131) of the connecting panel and lower edges (111) of the two side panels and corresponding to the first heat generating element. The lower edges of the two side panels and the lower of the connecting panel are in the same plane. The first opening is a predetermined distance from the circuit board and the airflow guiding duct is capable of allowing air flow from different directions.Type: ApplicationFiled: May 12, 2008Publication date: July 2, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YANG LI, YU-HSU LIN, JENG-DA WU, LEI GUO, LIANG-LIANG CAO
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Publication number: 20090168361Abstract: A printed circuit board assembly includes a printed circuit board with a heat generating component attached thereon, a base, and a thermal plate. The heat generating component comprises a side surface. The base defines a receiving room and an opening configured for access into the receiving room. The printed circuit board is received in the receiving room via the opening. The thermal plate is mounted on the base to cover the opening. A conducting piece is formed on the thermal plate and extends into the receiving room. The conducting piece includes a contacting portion extending from the thermal plate and in contact with the side surface. The conducting piece is configured for conducting heat from the heat generating component to the thermal plate. A heat dissipating hole is defined on the thermal plate in alignment with the contacting portion configured for dissipating heat from the base.Type: ApplicationFiled: July 25, 2008Publication date: July 2, 2009Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHIH-HANG CHAO, YU-HSU LIN, JENG-DA WU, LEI GUO
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Publication number: 20090171604Abstract: The invention related to a method and circuit that is used to compensate for S-parameters of a passive circuit which do not satisfy passivity. The method includes the following steps: (1) getting S-parameters which do not satisfy passivity, these S-parameters being composed of an S-parameter matrix S; (2) computing matrix [S×S?], wherein matrix S? is a complex conjugate transposed matrix of the S-parameter matrix S; (3) computing the eigenvalues of the matrix [S×S?], and choosing an eigenvalue ? whose real part real(?) is the biggest; (4) computing a compensating value ?, the compensating value ? being equal to real(?)1/2×(1+?), wherein the ? is a very small positive number; and (5) dividing each of the S-parameters by the compensating value ? to get the compensated S-parameters.Type: ApplicationFiled: May 21, 2008Publication date: July 2, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO
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Publication number: 20090071698Abstract: A circuit board includes a capacitor having two pins disposed thereon. A line determined by the two pins of the capacitor is not perpendicular to any of main sides of the circuit board.Type: ApplicationFiled: September 28, 2007Publication date: March 19, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHIH-HANG CHAO, YU-HSU LIN, JENG-DA WU
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Publication number: 20090039295Abstract: A detachable inner shield suitable for an isolation bushing of an ion implanter is provided. The inner shield is mounted on an inside of the isolation bushing and completely fitting the inside of the isolation bushing.Type: ApplicationFiled: February 20, 2008Publication date: February 12, 2009Applicant: PROMOS TECHNOLOGIES INC.Inventors: Hung-Pin Yu, Hsueh-Li Chiang, Cheng-Da Wu, Shiu-Shien Hsheng
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Patent number: 7482204Abstract: A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the cavity. Thereafter, a chip is disposed on the first encapsulant and the chip is electrically connected to the circuit substrate. Finally, a compound is deposited over the first encapsulant and the chip to form a chip package. The chip package is warp resistant and the chip packaging process increases overall production yield.Type: GrantFiled: December 21, 2007Date of Patent: January 27, 2009Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Chin-Li Kao, Yi-Shao Lai, Jeng-Da Wu, Tong-Hong Wang
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Publication number: 20090016024Abstract: A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.Type: ApplicationFiled: September 3, 2007Publication date: January 15, 2009Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventors: CHIH-HANG CHAO, YU-HSU LIN, JENG-DA WU
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Patent number: 7451466Abstract: An exemplary optical disc drive apparatus includes a guide shaft configured to movably support a pickup head, and an elastically deformable member. The elastically deformable member includes a main body, and a cantilever slanting up from a middle part of a front edge of the main body. The cantilever is broad at a lower portion thereof and narrow at an upper portion thereof, and the cantilever is for resiliently pressing a corresponding end of the guide shaft. The elastically deformable member reduces a stress surface between the cantilever and the guide shaft, and lengthens the life span thereof.Type: GrantFiled: October 16, 2006Date of Patent: November 11, 2008Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chih-Hang Chao, Yu-Hsu Lin, Jeng-Da Wu
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Patent number: 7447039Abstract: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.Type: GrantFiled: October 17, 2006Date of Patent: November 4, 2008Assignee: Hon Hai Precision Industry Co., Ltd.Inventors: Chih-Hang Chao, Yu-Hsu Lin, Jeng-Da Wu