Abstract: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.

Abstract: A bracket assembly for receiving at least one disk drive (40) includes an enclosure (10), a retaining bracket (30), and a connecting structure (312). The retaining bracket includes a pair of sidewalls (31, 32). The retaining bracket is attached to the enclosure at an edge of each sidewall. The connecting structure is defined in a first sidewall (31) of the sidewalls for attaching the first sidewall to the enclosure for altering a fixing relationship between the retaining bracket and the enclosure. The connecting structure is positioned near the disk drive, and away from the edge of the first sidewall. The method of assembling the bracket (30) to the enclosure (10) is also provided.

Abstract: A chip package structure including a carrier, a chip, and an underfill layer is disclosed. The carrier has a number of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps such that the active surface of the chip faces the carrier. The underfill layer is disposed on the carrier between the chip and the carrier such that a gap is maintained between the underfill layer and the chip.

Abstract: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.

Abstract: A chip package structure comprising a carrier, a chip and an underfill layer is disclosed. The carrier has a plurality of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps such that the active surface of the chip faces the carrier. The underfill layer is disposed on the carrier between the chip and the carrier such that a gap is maintained between the underfill layer and the chip.

Abstract: A direction and speed control device for an electronic wheelchair includes: a base member mounted on the electronic wheelchair; a manually operable pointing unit mounted on the base member and including a control stick pivotable relative to the base member; first and second three-axis g acceleration sensors, each generating a voltage output indicative of tilt of a respective one of the control stick and the base member in three orthogonal axes; and a control unit operable so as to process the voltage outputs of the first and second three-axis g acceleration sensors to generate corresponding control signals for controlling rotation direction and speed of a wheel unit of the electronic wheelchair.

Abstract: A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.

Abstract: A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the cavity. Thereafter, a chip is disposed on the first encapsulant and the chip is electrically connected to the circuit substrate. Finally, a compound is deposited over the first encapsulant and the chip to form a chip package. The chip package is warp resistant and the chip packaging process increases overall production yield.

Abstract: A heat sink assembly includes a printed circuit board, a chip mounted on a top surface of the board, and a heat sink attached onto the chip of the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base. The legs of the heat sink contact the top surface of the board to support the heat sink.

Abstract: A motherboard includes a circuit board, a first chip and a second chip disposed on the circuit board. Four securing holes are defined in the circuit board around the first chip, for mounting a heat dissipating module on the first chip. Two of the securing holes determine a first line, and the other two securing holes determine a second line parallel to the first line. A center of the second chip is located along a centerline between the first and second lines. Should the circuit board suffer from an impact, damage to the chips may be effectively minimized or prevented.

Abstract: A circuit board assembly includes a circuit board and a semiconductor chip mounted on the board. The semiconductor chip includes a plurality of solder spots arrayed thereon in a matrix pattern. The solder spots except those located at corners of the pattern are jointed to the board via tin balls to form signal transmitting channels for transmitting signals between the board and the chip. Should the circuit board suffer impact, damage to the signal transmitting channels may be effectively minimized or prevented.

Abstract: A bracket assembly for receiving at least one disk drive (40) includes an enclosure (10), a retaining bracket (30), and a connecting structure (312). The retaining bracket includes a pair of sidewalls (31, 32). The retaining bracket is attached to the enclosure at an edge of each sidewall. The connecting structure is defined in a first sidewall (31) of the sidewalls for attaching the first sidewall to the enclosure for altering a fixing relationship between the retaining bracket and the enclosure. The connecting structure is positioned near the disk drive, and away from the edge of the first sidewall. The method of assembling the bracket (30) to the enclosure (10) is also provided.

Abstract: A heat sink is provided to include a base (10) and a plurality of fins (20) mounted on the base. Each fin includes a heat dissipating portion (21). A plurality of notches (111) is defined in the base. A plurality of tabs (23) is protruded down from a bottom of each heat dissipating portion corresponding to the notches respectively.

Abstract: A chip packaging process is provided. First, a cavity is formed on a heat sink. A first encapsulant is formed on the bottom of the cavity. A circuit substrate is disposed over the heat sink. The circuit substrate has an opening that corresponds in position to the cavity. Thereafter, a chip is disposed on the first encapsulant and the chip is electrically connected to the circuit substrate. Finally, a compound is deposited over the first encapsulant and the chip to form a chip package. The chip package is warp resistant and the chip packaging process increases overall production yield.

Abstract: The present invention relates to a liposome combination, which wrapped hydrophilic drugs in water layer and wrapped hydrophobic drugs in lipid bilayer; hydrophobic drugs are photosensitizers. Using light with appropriate wavelength to activate the photosensitizer in the hydrophobic layer can result in the production of singlet oxygen and the free radical, and cause the oxidizing and breaking of the carbon chain of the phospholipid, and influences the stability of the liposome and the releases of the drug. The singlet oxygen and the free radical will attack the cancer cells at the same time as a result of combining the photodynamic- and chemo-effects.

Abstract: Injectable drug laden microspheres are obtained from unsaturated functionalized polyhydric alcohol ester of polyester by a method comprising dissolving the unsaturated functionalized ester in a hydrophobic organic solvent, dissolving drug and/or biologically active agent in water, admixing the two solutions to form water-in-oil emulsion, forming an aqueous solution of stabilizer, admixing the water-in-oil emulsion and the stabilizer solution to form water-in-oil-in-water emulsion, and evaporating the organic solvent.

Abstract: An exemplary optical disc drive apparatus includes a guide shaft configured to movably support a pickup head, and an elastically deformable member. The elastically deformable member includes a main body, and a cantilever slanting up from a middle part of a front edge of the main body. The cantilever is broad at a lower portion thereof and narrow at an upper portion thereof, and the cantilever is for resiliently pressing a corresponding end of the guide shaft. The elastically deformable member reduces a stress surface between the cantilever and the guide shaft, and lengthens the life span thereof.

Abstract: A method is provided for processing data of a sub-picture of a picture. The method includes: providing an object of the sub-picture, forming a binary bit map of the object, and determining whether the number of bits having a first binary value is greater than the number of bits having a second binary value in the binary bit map. The method further includes: determining whether it is necessary to transform the binary bit map into a transformed binary bit map so that the number of bits having the first binary value is smaller than the number of bits having the second binary value in the transformed binary bit map, and determining a compression rule by determining the most significant two bits of a section of consecutive bits in the binary bit map or the transformed binary bit map.

Abstract: The present invention provides a medium for storing a subtitle data structure of an audio/video program and a method for displaying the same. The subtitle data structure of the audio/video program includes a plurality of character packages and a background image package, wherein each character package further has a header that includes the start and the end of a presenting time stamp (PTS), X-Y coordinates of the character, X length, Y length and a color (or colors) of the character, as well as pixel data for displaying the character. Compared with prior art, using the subtitle data structure of the present invention can considerably save the required medium capacity for storing the subtitle data.

Abstract: A description data structure of a menu stored in an audio/video disc and a method for using the same are provided. The description data structure comprises a navigation data packet, a menu packet, and a program packet, wherein the menu packet further comprises a first header, a background image packet, a button 1 packet, a button 2 packet, etc. Moreover, each button packet comprises sub-picture information, and the navigation data packet comprises a button address packet for storing the address information of each button packet. By using the description data structure, the present invention allows not only the audio/video disc to be consumed less capacity for displaying images, but the use of a mask control program stored in the audio/video disc to be cancelled as well when highlighting a selected text in the menu, thereby expediting the processing of the stored data in the audio/video disc.