Patents by Inventor Da Wu

Da Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND SYSTEM FOR SUPPORTING GPU AUDIO OUTPUT ON GRAPHICS PROCESSING UNIT
    Publication number: 20110087345
    Abstract: The present invention sets forth a method for supporting enhanced audio on a graphics processing unit (GPU) in a computing device having a graphics subsystem. In one embodiment, the method includes the steps of determining whether an option of a GPU audio output is enabled and the graphics subsystem and a first external output device is connected, and routing a first audio stream to the GPU of the graphics subsystem for processing when the option of the GPU audio output is enabled and the graphics subsystem and the first external output device is in connection and causing the processed first audio stream to be transferred along a first transmission path to the first external output device, or otherwise causing a second audio stream to be transferred along a second transmission path to a second external output device.
    Type: Application
    Filed: October 13, 2009
    Publication date: April 14, 2011
    Inventors: Shany-I CHAN, Ching-Yee Feng, Shih-Da Wu, Tseng-Ying Lee, Li-Kai Cheng, Li-Ling Chou, Yu-Kuo Chiang, Yu-Li (David) Ho
  • Circuit board assembly
    Patent number: 7864536
    Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: January 4, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Qin Li, Yu-Hsu Lin, Jeng-Da Wu, Chih-Hang Chao
  • Medium for storing subtitle data structure of an audio/ video program and method for displaying the same
    Patent number: 7848615
    Abstract: The present invention provides a medium for storing a subtitle data structure of an audio/video program and a method for displaying the same. The subtitle data structure of the audio/video program includes a plurality of character packages and a background image package, wherein each character package further has a header that includes the start and the end of a presenting time stamp (PTS), X-Y coordinates of the character, X length, Y length and a color (or colors) of the character, as well as pixel data for displaying the character. Compared with prior art, using the subtitle data structure of the present invention can considerably save the required medium capacity for storing the subtitle data.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: December 7, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Han Tsai, Wei-Zheng Lu, Guo-Zua Wu, Kun-Da Wu, Jau-Jiu Ju, Der-Ray Huang
  • METHOD AND SYSTEM FOR SAVING INTERNET BOOKMARK AND COMPUTER-READABLE MEDIUM USING THE METHOD
    Publication number: 20100306679
    Abstract: A method and a system for saving an Internet bookmark and a computer-readable medium using the method are provided. In the present method, a web page is first connected to. Then, an image of a particular area in the web page is captured and served as a representative image of an Internet bookmark of the web page. Next, the representative image is associated with a web address of the web page. Thereafter, the representative image and the web address are saved.
    Type: Application
    Filed: April 15, 2010
    Publication date: December 2, 2010
    Applicant: HTC CORPORATION
    Inventor: Kun-Da Wu
  • Computer enclosure with airflow guide
    Patent number: 7835149
    Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: November 16, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yang Li, Yu-Hsu Lin, Jeng-Da Wu, Lei Guo, Liang-Liang Cao, Liang-Qing Shan
  • Button assembly
    Patent number: 7763817
    Abstract: A button assembly for pressing a switch in a computer bezel includes a button connected to an arm. A cutout is defined in the computer bezel. The button is inserted in the cutout, and the arm is pivotably mounted on the computer bezel. A pressing portion extends outward from a side of the arm. A slanted pressing plane is formed on the pressing portion. Pressing the button moves the arm so that one end of the slanted pressing plane away from the arm contacts the switch. The switch resists the pressing portion, causing the arm to rotate so that the other end of the slanted pressing plane moves forward, thereby the slanted pressing plane entirely contacts and activates the switch.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: July 27, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zhi-Ping Wu, Chih-Hang Chao, Yu-Hsu Lin, Jeng-Da Wu
  • Electronic apparatus with air guiding element
    Patent number: 7760498
    Abstract: An electronic apparatus includes an enclosure (30), a circuit board (40), a fan module (20), and an air guiding element (10) mounted in the enclosure. The circuit board includes at least one heat generating component (41) thereon. The fan module has a fan (22) and an output opening (213) corresponding to the fan. The air guiding element comprises a resisting panel (11) and a guiding panel (12) comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end (127) and a connecting end (125) connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: July 20, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Liang-Qing Shan, Yang Li, Yu-Hsu Lin, Jeng-Da Wu, Liang-Liang Cao, Lei Guo
  • CIRCUIT BOARD ASSEMBLY
    Publication number: 20100165579
    Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.
    Type: Application
    Filed: May 12, 2009
    Publication date: July 1, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: QIN LI, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO
  • HEAT DISSIPATION APPARATUS
    Publication number: 20100149749
    Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.
    Type: Application
    Filed: June 8, 2009
    Publication date: June 17, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Liang-Liang CAO, Jeng-Da WU, Yang LI
  • HEAT SINK ASSEMBLY
    Publication number: 20100128442
    Abstract: A heat sink assembly includes a printed circuit board, a socket attached on a top surface of the board for receiving a chip, and a heat sink attached onto the chip of the board. The socket includes a plurality of legs integrally extending down from a bottom surface of the socket. The legs contact the top surface of the board to support the socket on the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base.
    Type: Application
    Filed: May 12, 2009
    Publication date: May 27, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTDRY CO., LTD
    Inventors: ZHI-PING WU, XIAO-FENG WANG, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO
  • COMPUTER ENCLOSURE WITH AIRFLOW GUIDE
    Publication number: 20100097754
    Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.
    Type: Application
    Filed: December 22, 2008
    Publication date: April 22, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YANG LI, YU-HSU LIN, JENG-DA WU, LEI GUO, LIANG-LIANG CAO, LIANG-QING SHAN
  • METHOD FOR ADJUSTING PAGE DISPLAY MANNER, MOBILE ELECTRONIC DEVICE, AND STORAGE MEDIUM THEREOF
    Publication number: 20100097400
    Abstract: A method for adjusting a page display manner, a mobile electronic device, and a storage medium thereof are provided. In the present method, a scaling signal is first received. Then, a display ratio of a page in a touch screen is adjusted according to a variation of the scaling signal. If the display ratio is smaller than or equal to a specific ratio, the page is adjusted according to the display ratio and other open pages are displayed along with the page on the screen. Thereby, a user can resize the page, inspect all the open pages, and switch between all the open pages simply through the touch screen. As a result, it is made very convenient to browse multiple pages by using the mobile electronic device.
    Type: Application
    Filed: August 4, 2009
    Publication date: April 22, 2010
    Applicant: HTC CORPORATION
    Inventor: Kun-Da Wu
  • CIRCUIT BOARD AND LAYOUT METHOD THEREOF
    Publication number: 20100096170
    Abstract: A circuit board includes a signal plane and a ground plane. The signal plane is configured to have a plurality of signal traces arranged thereon. Each of the signal traces includes a plurality of straight line segments. Each line segment extends along a path different from the others. The ground plane includes a plurality of tiles connected in an array. Each tile is formed by ground traces. The straight line segments of each signal trace mapped on the ground plane are arranged at an angle relative to any one ground trace of the tiles. The angle is defined within a range determined by one of ground traces of a tile and an adjacent diagonal line of the tile. A method for laying out such a circuit board is also provided.
    Type: Application
    Filed: December 22, 2009
    Publication date: April 22, 2010
    Inventors: YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO
  • Process for preparing alpha calcium sulfate hemihydrate
    Patent number: 7700066
    Abstract: The invention provides a process for preparing ?-calcium sulfate hemihydrate which comprises the following steps: adding aqueous solutions containing sulfate ions and calcium ions to calcium chloride solution with a range of concentration; reacting the mixture of a) at a range of temperature for an appropriate time; filtering and washing the reaction products of b) with a rising solvent to isolate the solid and liquid phases; and d) collecting and drying the solid phase to obtain ?-calcium sulfate hemihydrate with high purity; wherein the relationship between the range of the concentration of calcium chloride (y) and the range of the reaction temperature (x) is shown as the following formula: ?0.4x5+7.33x4?52.83x3+187.17x2?328.27x+316<y<1.2x5?22x4+158.5x3?561.5x2+984.8x?588 (2<X<5).
    Type: Grant
    Filed: October 3, 2008
    Date of Patent: April 20, 2010
    Assignee: Taipei Medical University
    Inventors: Jen-Chang Yang, Hong-Da Wu, Nai-Chia Teng, Sheng-Yang Lee
  • Process for Preparing alpha Calcium Sulfate Hemihydrate
    Publication number: 20100086474
    Abstract: The invention provides a process for preparing ?-calcium sulfate hemihydrate which comprises the following steps: adding aqueous solutions containing sulfate ions and calcium ions to calcium chloride solution with a range of concentration; reacting the mixture of a) at a range of temperature for an appropriate time; filtering and washing the reaction products of b) with a rising solvent to isolate the solid and liquid phases; and d) collecting and drying the solid phase to obtain ?-calcium sulfate hemihydrate with high purity; wherein the relationship between the range of the concentration of calcium chloride (y) and the range of the reaction temperature (x) is shown as the following formula: ?0.4x5+7.33x4?52.83x3+187.17x2?328.27x+316<y<1.2x5?22x4+158.5x3?561.5x2+984.8x?588(2<X<5).
    Type: Application
    Filed: October 3, 2008
    Publication date: April 8, 2010
    Applicant: TAIPEI MEDICAL UNIVERSITY
    Inventors: Jen-Chang Yang, Hong-Da Wu, Nai-Chia Teng, Sheng-Yang Lee
  • Mounting apparatus for heat sink
    Patent number: 7675753
    Abstract: A mounting apparatus for mounting a heat sink on a board, includes a first locking hole defined in the heat sink, a second locking hole defined in the board, and a locking member. The locking member includes a base and a rod. The base defines a hole. A bottom of the base forms a pair of separated elastic claws around the hole. The elastic claws are inserted through the first and second locking holes. The rod includes an expanded portion. The rod slides in the hole of the base with the expanded portion located inbetween the claws to expand the claws outwards to be larger than the second locking hole to lock the locking member on the board and to mount the heat sink on the board.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: March 9, 2010
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yang Li, Yu-Hsu Lin, Jeng-Da Wu
  • METHOD FOR DETERMINING THE PERFORMANCE OF IMPLANTING APPARATUS
    Publication number: 20100050939
    Abstract: A method for determining the performance of an implanting apparatus comprises the steps of forming a dopant barrier layer on a substrate, forming a target layer on the dopant barrier layer, performing an implanting process by using the implanting apparatus to implant dopants into the target layer such that the target layer becomes conductive, measuring at least one electrical property of the target layer, and determining the performance of the implanting apparatus by taking the electrical property into consideration. In one embodiment of the present invention, the dopant barrier layer is silicon nitride layer, the target layer is a polysilicon layer, and the electrical property is the sheet resistance of the conductive polysilicon layer.
    Type: Application
    Filed: August 26, 2008
    Publication date: March 4, 2010
    Applicant: PROMOS TECHNOLOGIES INC.
    Inventors: YU PIN HSU, YUAN MING CHANG, WEI HENG LEE, CHENG DA WU
  • Circuit board with improved ground plane
    Patent number: 7663063
    Abstract: A circuit board is provided for improving signal quality, including a signal plane for a plurality of signal traces arranged thereon and a ground plane formed by a plurality of tiles connected to each other in an array. Each tile is formed by ground traces. Different line segments of a signal trace mapped on the ground plane cross ground traces of the tiles at similar angles, thereby minimizing interaction between the ground traces and the signal traces to reduce differences in impedances of the signal traces.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: February 16, 2010
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yu-Hsu Lin, Jeng-Da Wu, Chih-Hang Chao
  • THERMAL DEVICE FOR HEAT GENERATING SOURCE
    Publication number: 20100014244
    Abstract: A heat sink for dissipating heat from a heat source, includes a base configured to connect with a heat source, and a plurality of fins positioned on the base. A cutout is defined within the plurality of parallel fins.
    Type: Application
    Filed: September 30, 2008
    Publication date: January 21, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LIANG-LIANG CAO, YU-HSU LIN, JENG-DA WU, CHIH-HANG CHAO, YANG LI, LEI GUO
  • HEAT DISSIPATING DEVICE FOR ELECTRONIC DEVICE
    Publication number: 20100002373
    Abstract: A heat dissipating device is provided. The heat dissipating device includes a seat and a plurality of fins secured on the seat. The fins are regularly aligned in a matrix. A first set of fins comprise of a convex profile.
    Type: Application
    Filed: April 17, 2009
    Publication date: January 7, 2010
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO. LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: LEI GUO, YU-HSU LIN, JENG-DA WU, YANG LI