Patents by Inventor Da Wu

Da Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITE OF AMORPHOUS CALCIUM PHOSPHATE/CALCIUM SULFATE HEMIHYDRATE (CSH/ACP) FOR BONE IMPLANTATION AND PROCESS FOR PRODUCING THE SAME
    Publication number: 20120189683
    Abstract: The invention provides a composite of ?-calcium sulfate (CS) hemihydrate/amorphous calcium phosphate (?-CSH/ACP), comprising ?-CSH and ACP at a weight ratio of about 10:90 to about 90:10. Particularly, the composite of the invention has a resorption period of 3-6 months. The invention also provides a one-pot process for producing ?-CSH/ACP composite of the invention. The one-pot process of the invention can produce ?-CSH and ACP in a single process and easily obtain ?-CSH/ACP composite.
    Type: Application
    Filed: January 20, 2011
    Publication date: July 26, 2012
    Applicant: TAIPEI MEDICAL UNIVERSITY
    Inventors: JEN-CHANG YANG, SHENG-YANG LEE, DUEN-CHENG WANG, HAW-MING HUANG, WEI-JEN CHANG, MALOSI POMA, HONG-DA WU, DIAN-YU JI
  • Chip package structure
    Patent number: 8154125
    Abstract: A chip package structure including a carrier, a chip, and an underfill layer is disclosed. The carrier has a number of bumps disposed thereon. The chip has an active surface. The chip is flip-chip bonded and electrically connected to the carrier through the bumps such that the active surface of the chip faces the carrier. The underfill layer is disposed on the carrier between the chip and the carrier such that a gap is maintained between the underfill layer and the chip.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: April 10, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Jeng-Da Wu
  • Motherboard
    Patent number: 8154879
    Abstract: A motherboard includes a printed circuit board, a first chip and a second chip arranged on the printed circuit board in parallel. A plurality of securing holes are defined in the printed circuit board around the first chip. At least one isolating hole is defined in the printed circuit board between the second chip and a first line determined by two of the securing holes close to the second chip. Should the printed circuit board suffer an impact, damage to the chips may be effectively minimized or prevented.
    Type: Grant
    Filed: September 3, 2007
    Date of Patent: April 10, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chih-Hang Chao, Yu-Hsu Lin, Jeng-Da Wu
  • SAFETY DEVICE FOR MACHINE TOOL
    Publication number: 20110308365
    Abstract: A safety device for a machine tool includes a machine, a main controller, a detection unit, a warning system, a drive circuit and a temporary stop device. The detection unit includes a contact sensing element and a non-contact sensing element. After the detection unit is induced and triggered by a charged body, a sensing signal is generated and transmitted to the main controller and interpreted by the main controller to drive the warning system, and the drive circuit transmits an analog signal to a charged body of the temporary stop device to rotate a motor of the machine in a reverse direction for a brake. The present invention provides a double sensing protection device with both contact and non-contact sensing effects to improve the safety of using the machine tool and prevent operators from being injured.
    Type: Application
    Filed: September 2, 2011
    Publication date: December 22, 2011
    Applicant: YUAN ZE UNIVERSITY
    Inventors: CHIH-HUI CHIU, JUN-DA WU, BO-JYUN SIAO
  • Reducing false positives during behavior monitoring
    Patent number: 8079085
    Abstract: A program installed on a computer system registers and is placed on an installed program list or an uninstall software list. A check of the uninstall software list (USL) is added as a secondary verification mechanism to a behavior monitoring engine. A signature-based malware scan engine may be used. If the scan engine does not flag the file as malware, then the behavior monitoring engine monitors the activities performed by the underlying application. When the behavior monitoring engine flags an activity as potentially suspicious, the USL is checked to determine if the application running the process is on the USL. If so, then the process is treated as legitimate and there is no need to alert the user. Only if both the behavior is flagged as suspicious and the application performing the behavior is not on the USL will the user receive an alert as to the potential malware.
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: December 13, 2011
    Assignee: Trend Micro Incorporated
    Inventors: Chun-Da Wu, Ming-Yan Sun, Chien-Hua Lu
  • HIGH YIELD DIALYSIS-FREE PROCESS FOR PRODUCING ORGANOSOLUBLE REGENERATED SILK FIBROIN
    Publication number: 20110288273
    Abstract: The invention relates to a simple and high yield process for producing a regenerated silk fibroin which does not need dialysis. Particularly, a process of the invention is characterized in that the silk fibroin is precipitated by applying a shear stress and/or changing the solvent power of the fibroin solution. The process of the invention simplifies the process of producing silk fibroin and greatly shortens the process time to 1 to 2 hours, whereas the conventional dialysis process is complex and needs around 2 to 3 days. In addition to reducing the time needed, the process of the invention can increase productivity of silk fibroin by at least 8%.
    Type: Application
    Filed: May 20, 2010
    Publication date: November 24, 2011
    Applicant: TAIPEI MEDICAL UNIVERSITY
    Inventors: Jen-Chang YANG, Sheng-Yang LEE, Chien Chung CHEN, Yun-Ting HSU, Hong-Da WU, Dian-Yu JI
  • Printed circuit board
    Patent number: 8035034
    Abstract: A printed circuit board includes a base and a signal trace laid on the base. The signal trace includes a plurality of straight line segments parallel to the first fibers. The signal trace is laid on the base in such a manner that the line segments of the signal trace mapped on the base partly superpose the first fibers and partly superpose gaps between two adjacent first fibers.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: October 11, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yu-Hsu Lin, Jeng-Da Wu, Chih-Hang Chao
  • PROCESS FOR PRODUCING INORGANIC INTERCONNECTED 3D OPEN CELL BONE SUBSTITUTES
    Publication number: 20110229547
    Abstract: The present invention relates to a process of using a heat responsive mixture to produce inorganic interconnected 3D open-cell bone substitutes which can be applied in the orthopedic or dental field for treatment of bone damage. The invention provides a simple and easily-controlled process of preparing porous inorganic bone substitute materials.
    Type: Application
    Filed: March 16, 2010
    Publication date: September 22, 2011
    Applicant: TAIPEI MEDICAL UNIVERSITY
    Inventors: Jen-Chang Yang, Sheng-Yang Lee, Tsuimin Tsai, Hong-Da Wu, Hsin-Tai Hu, Yan-Cheng Yang, Chen-Feng Ma
  • Method and apparatus for compensating S-parameters of passive circuits
    Patent number: 7996169
    Abstract: The invention related to a method and circuit that is used to compensate for S-parameters of a passive circuit which do not satisfy passivity. The method includes the following steps: (1) getting S-parameters which do not satisfy passivity, these S-parameters being composed of an S-parameter matrix S; (2) computing matrix [S×S?], wherein matrix S? is a complex conjugate transposed matrix of the S-parameter matrix S; (3) computing the eigenvalues of the matrix [S×S?], and choosing an eigenvalue ? whose real part real(?) is the biggest; (4) computing a compensating value ?, the compensating value ? being equal to real(?)1/2×(1+?), wherein the ? is a very small positive number; and (5) dividing each of the S-parameters by the compensating value ? to get the compensated S-parameters.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: August 9, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yu-Hsu Lin, Jeng-Da Wu, Chih-Hang Chao
  • HEAT DISSIPATING SYSTEM
    Publication number: 20110188208
    Abstract: A heat dissipating system includes a circuit board, a chip module, a first clamping member, a second clamping member, and a plurality of stress adjusting members. The circuit board includes a top surface and a bottom surface opposite to the top surface. The chip module includes a base portion located on the top surface of the circuit board via solder balls and a chip disposed on the base portion. The first clamping member abuts the chip. The second clamping member abuts the bottom surface of the circuit board. The stress adjusting members extend through the second clamping member and engage with the first clamping member.
    Type: Application
    Filed: July 6, 2010
    Publication date: August 4, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: JENG-DA WU
  • CIRCUIT BOARD ASSEMBLY
    Publication number: 20110188219
    Abstract: A circuit board assembly includes a circuit board having a first side and a second side opposite to the first side. A chip module is connected to the first side of the circuit board. The chip module includes a substrate and a chip disposed on the substrate. The first clamping member defines a recess and a contact portion around the recess. The chip is received in the recess, and the contact portion abuts the substrate. A second clamping member abuts the second side of the circuit board. A plurality of stress adjusting members extends through the second clamping member and engages the first clamping member.
    Type: Application
    Filed: April 2, 2010
    Publication date: August 4, 2011
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: JENG-DA WU
  • CIRCUIT BOARD ASSEMBLY
    Publication number: 20110164380
    Abstract: A circuit board assembly is provided, includes a circuit board having a first side and a second side opposite to the first side. A chip is connected to the first side of the circuit board. A first heat dissipating device is located on the first side of the circuit board. The chip is located between the first heat dissipating device and the first side of the circuit board. A second heat dissipating device abuts the second side of the circuit board, and the second heat dissipating device are secured to the first heat dissipating device to clamp the circuit board and the chip.
    Type: Application
    Filed: March 31, 2010
    Publication date: July 7, 2011
    Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jeng-Da WU, Chih-Hang CHAO, Zhi-Ping WU
  • Printed circuit board
    Patent number: 7973244
    Abstract: A printed circuit board includes a base formed from a plurality of woven fibers, and signal traces laid on the base. Each of the signal traces includes at least a straight line segment. The signal traces are laid on the base in such a manner that the line segments of the signal traces mapped on the base cross the fibers at angles not equal to zero degrees.
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: July 5, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yu-Hsu Lin, Chan-Fei Tai, Jeng-Da Wu, Chih-Hang Chao
  • Direction and speed control device for an electronic wheelchair
    Patent number: 7974753
    Abstract: A direction and speed control device for an electronic wheelchair includes: a base member mounted on the electronic wheelchair; a manually operable pointing unit mounted on the base member and including a control stick pivotable relative to the base member; first and second three-axis g acceleration sensors, each generating a voltage output indicative of tilt of a respective one of the control stick and the base member in three orthogonal axes; and a control unit operable so as to process the voltage outputs of the first and second three-axis g acceleration sensors to generate corresponding control signals for controlling rotation direction and speed of a wheel unit of the electronic wheelchair.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: July 5, 2011
    Assignee: Kwang Yang Motor Co., Ltd.
    Inventors: Yang-Chi Kuo, Shih-Chia Hsieh, Ying-Da Wu, Shih-Wang Tu
  • CALCIUM PHOSPHATE COMPLEX FOR ORAL CARE APPLICATIONS, ITS PREPARATION METHOD, AND COMPOSITIONS CONTAINING THE SAME
    Publication number: 20110150791
    Abstract: The invention is directed to a calcium phosphate complex and the composition containing the same for oral care applications, in which the calcium phosphate complex is formed by chelating the ?-polyglutamic acid (?-PGA) with amorphous calcium phosphate (ACP). This complex can prevent crystallization of ACP and maintain its high solubility. The calcium phosphate complex has superior mucoadhesion properties, allowing it to remain in the mouth longer and offering effective buffering, by which dental caries can be alleviated and prevented.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 23, 2011
    Applicant: TAIPEI MEDICAL UNIVERSITY
    Inventors: JEN-CHANG YANG, SHENG-YANG LEE, DER-ZEN LIU, NAI-CHIA TENG, EN-SHENG KE, CHIEN CHUNG CHEN, DIAN-YU JI, CHEN-FENG MA, HONG-DA WU
  • Method and System for Communicating with External Device Through Processing Unit in Graphics System
    Publication number: 20110109636
    Abstract: The present invention sets forth a method and system for communicating with an external device through a processing unit in a graphics system of a computing device. In one embodiment, the method comprises allocating a first set of memory buffers having a first memory buffer and a second memory buffer in the graphics system based on an identification information of the external device, and invoking a first thread processor of the processing unit of the graphics system to perform services associated with a physical layer according to the identification information of the external device by storing a first data stream received from the external device through an I/O interface of the processing unit of the graphics system in the first memory buffer and retrieving a second data stream from the second memory buffer for transmission to the external device through the I/O interface.
    Type: Application
    Filed: November 12, 2009
    Publication date: May 12, 2011
    Inventors: Shany-I CHAN, Ching-Yee Feng, Shih-Da Wu, Li-Kai Cheng, Li-Ling Chou, Yu-Kuo Chiang, Yu-Li (David) Ho
  • Heat dissipation apparatus
    Patent number: 7929304
    Abstract: A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: April 19, 2011
    Assignees: Hong-Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Liang-Liang Cao, Jeng-Da Wu, Yang Li
  • METHOD AND SYSTEM FOR SUPPORTING GPU AUDIO OUTPUT ON GRAPHICS PROCESSING UNIT
    Publication number: 20110087345
    Abstract: The present invention sets forth a method for supporting enhanced audio on a graphics processing unit (GPU) in a computing device having a graphics subsystem. In one embodiment, the method includes the steps of determining whether an option of a GPU audio output is enabled and the graphics subsystem and a first external output device is connected, and routing a first audio stream to the GPU of the graphics subsystem for processing when the option of the GPU audio output is enabled and the graphics subsystem and the first external output device is in connection and causing the processed first audio stream to be transferred along a first transmission path to the first external output device, or otherwise causing a second audio stream to be transferred along a second transmission path to a second external output device.
    Type: Application
    Filed: October 13, 2009
    Publication date: April 14, 2011
    Inventors: Shany-I CHAN, Ching-Yee Feng, Shih-Da Wu, Tseng-Ying Lee, Li-Kai Cheng, Li-Ling Chou, Yu-Kuo Chiang, Yu-Li (David) Ho
  • Circuit board assembly
    Patent number: 7864536
    Abstract: A circuit board assembly includes a circuit board with two heat dissipating assemblies mounted thereon and an L-shaped back plate attached to an underside of the circuit board. Each of the heat dissipating assembly includes at least a pair of securing members at opposite corners thereof. The back plate includes a first portion and a second portion each defining at least a pair of circular protrusions corresponding to the securing members of the heat dissipating assemblies.
    Type: Grant
    Filed: May 12, 2009
    Date of Patent: January 4, 2011
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Qin Li, Yu-Hsu Lin, Jeng-Da Wu, Chih-Hang Chao
  • Medium for storing subtitle data structure of an audio/ video program and method for displaying the same
    Patent number: 7848615
    Abstract: The present invention provides a medium for storing a subtitle data structure of an audio/video program and a method for displaying the same. The subtitle data structure of the audio/video program includes a plurality of character packages and a background image package, wherein each character package further has a header that includes the start and the end of a presenting time stamp (PTS), X-Y coordinates of the character, X length, Y length and a color (or colors) of the character, as well as pixel data for displaying the character. Compared with prior art, using the subtitle data structure of the present invention can considerably save the required medium capacity for storing the subtitle data.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: December 7, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Meng-Han Tsai, Wei-Zheng Lu, Guo-Zua Wu, Kun-Da Wu, Jau-Jiu Ju, Der-Ray Huang