Abstract: A storage device is disclosed herein. The storage device comprises a block including a plurality of memory cells and a circuit coupled to the plurality of memory cells of the block. The circuit is configured to program memory cells of a plurality of strings of a word line of the block and verify, for a plurality of sets of the memory cells, a data state of a set of the memory cells, where each set of the plurality of sets of the memory cells includes a memory cell from each string of the plurality of strings of the word line. Further, the circuit is configured to determine a number of sets of the plurality of memory cell sets that are verified to be in a first data state and determine, based on the number of sets, whether the block is faulty.

Abstract: A method for programming a target memory cell of a memory array of a non-volatile memory system, the method comprising performing a read operation of one or more memory cells neighboring a target memory cell, thereby determining a data pattern of the one or more neighboring memory cells, storing the data pattern and, during a program operation of the target memory cell, adjusting a verify voltage level according to the stored data pattern of the one or more neighboring memory cells.

Abstract: A memory device includes a channel, a control gate electrode, and at least one charge storage element located between the channel and the control gate electrode. The control gate electrode includes a first electrically conductive layer, a second electrically conductive layer and a ferroelectric material layer located between the first electrically conductive layer and the second electrically conductive layer.

Abstract: A method for memory program verification includes performing a write operation on memory cells of a memory device. The method also includes identifying memory strings associated with respective memory cells of the memory cells. The method also includes identifying a first memory string of the memory strings. The method also includes disabling a portion of a write verification for the first memory string. The method also includes enabling the portion of the write verification for other memory strings of the memory strings. The method also includes performing at least the portion of the write verification operation on write verification enabled memory strings.

Abstract: Techniques are described for optimizing the peak current during a program operation by controlling a timing and ramp rate of a program-inhibit voltage signal as a function of a program loop number and/or program progress. A transition voltage between a regulated ramp up rate and an unregulated ramp up rate can also be adjusted. For initial and final sets of program loops in a program operation, the ramp up of the program-inhibit voltage signal can occur early so that it overlaps with operations of sense circuits in updating their latches based on results from a verify test in a previous program loop. For an intermediate set of program loops, the overlap is avoided. The ramp up rate can be larger and the transition voltage smaller for the initial and final sets of program loops compared to the intermediate set of program loops.

Abstract: A method of concurrently programming a memory. Various methods include: applying a non-negative voltage on a first bit line coupled to a first memory cell; applying a negative voltage on a second bit line coupled to a second memory cell, where the negative voltage is generated using triple-well technology; then applying a programming pulse to the first and second memory cells concurrently; and in response, programming the first and second memory cells to different states. The methods also include applying a quick pass write operation to the first and second memory cells, by: applying a quick pass write voltage to the first bit line coupled to the first memory cell, where the quick pass write voltage is higher than the non-negative voltage; applying a negative quick pass write voltage to the second bit line coupled to the first memory cell, where the negative quick pass write voltage is generated using triple-well technology.

Abstract: Techniques for fast programming and read operations for memory cells. A first set of bit lines is connected to a first set of NAND strings and is interleaved with a second set of bit lines connected to a second set of NAND strings. The first set of NAND strings can be programmed by driving a voltage on the first set of bit lines while floating a voltage on the second set of bit lines, to reduce an inter-bit line capacitance and provide a relatively high access speed and a relatively low storage density (e.g., bits per memory cell). The second set of NAND strings can be programmed by concurrently driving a voltage on the first and second sets of bit lines, to provide a relatively low access speed and a relatively high storage density.

Abstract: Method(s) and structure(s) for a two-page read operation are described and provide a multiple page read. The two page read operation provides for reading two pages with in a block without reducing the control gates to a low voltage level. The two page read can read the first page using an incrementing voltage level at discrete steps and starting the second page read at the high state for the control gates from the first page read. The second page read then decrements the control gate voltages level through the steps. This should reduce energy consumption. The two-page read operation will also reduce the time as the time period to reset the control gates to a low state are not required in between the page read operations.

Abstract: Method(s) and structure(s) for a two-page read operation are described and provide a multiple page read. The two page read operation provides for reading two pages with in a block without reducing the control gates to a low voltage level. The two page read can read the first page using an incrementing voltage level at discrete steps and starting the second page read at the high state for the control gates from the first page read. The second page read then decrements the control gate voltages level through the steps. This should reduce energy consumption. The two-page read operation will also reduce the time as the time period to reset the control gates to a low state are not required in between the page read operations.

Abstract: An apparatus comprises a driver circuit, sense circuit, and die controller. The driver circuit supplies a pass voltage to a selected word line and unselected word lines, a sense voltage to an adjacent word line, and a bit line voltage to bit lines coupled to selected and unselected word lines. The sense circuit determines nonconducting and conducting memory cells on the adjacent word line. The die controller then directs the driver circuit to ramp the sense voltage on the adjacent word line to the pass voltage and ramp the pass voltage on the selected word line to ground. The die controller then directs the driver circuit to ramp the bit line voltage for bit lines coupled to nonconducting memory cells to a bit line compensation voltage and directs the sense circuit to read memory cells of the selected word line based on the bit line compensation voltage.

Abstract: A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate, where the electrically conductive layers comprise word lines located between a source select gate electrode and a drain select gate electrode, a memory opening vertically extending through each layer of the alternating stack to a top surface of the substrate, a memory film and vertical semiconductor channel having a doping of a first conductivity type located in the memory opening, and an active region having a doping of a second conductivity type that is an opposite of the first conductivity type and adjoined to an end portion of the vertical semiconductor channel to provide a p-n junction. The end portion of the vertical semiconductor channel has a first thickness, and a middle portion of the vertical semiconductor channel has a second thickness which is less than the first thickness.

Abstract: Techniques are provided to adaptively determine when to begin verify tests for memory cells during a program operation. The memory cells are programmed using a normal programming speed until their threshold voltage exceeds an initial verify voltage. The memory cells are then programmed further using a reduced programming speed until their threshold voltage exceeds a final verify voltage. In one aspect, a count of memory cells which exceeds the initial verify voltage is used to determine when to begin verify tests for a higher data state. In another aspect, a count of the higher state memory cells which exceeds the initial or final verify voltage is used to determine when to begin verify tests for the higher data state. The counted memory cells are not subject to the reduced programming speed.

Abstract: An apparatus includes a programming circuit configured to supply a program pulse to increase a threshold voltage of a memory cell. The apparatus also includes a sensing circuit configured to determine that the threshold voltage of the memory cell satisfies a trigger threshold voltage in response to the program pulse. The apparatus further includes a damping circuit configured to increase a voltage of a bit line connected to the memory cell after initiation of and during a second program pulse in response to the threshold voltage of the memory cell satisfying the trigger threshold voltage, the second program pulse being sent by the programming circuit.

Abstract: A method of concurrently programming a memory. Various methods include: applying a non-negative voltage on a first bit line coupled to a first memory cell; applying a negative voltage on a second bit line coupled to a second memory cell, where the negative voltage is generated using triple-well technology; then applying a programming pulse to the first and second memory cells concurrently; and in response, programming the first and second memory cells to different states. The methods also include applying a quick pass write operation to the first and second memory cells, by: applying a quick pass write voltage to the first bit line coupled to the first memory cell, where the quick pass write voltage is higher than the non-negative voltage; applying a negative quick pass write voltage to the second bit line coupled to the first memory cell, where the negative quick pass write voltage is generated using triple-well technology.

Abstract: A method reading memory using bi-directional sensing, including programming first memory cells coupled to a first word-line using a normal programming order; programming second memory cells coupled to a second word-line using a normal programming order; reading data from the first memory cells by applying a normal sensing operation to the first word-line; and reading data from the second memory cells by applying a reverse sensing operation to the second word-line. Methods also include receiving an error associated with reading data from the first memory cells; and then reading the data from the first memory cells by applying a reverse sensing operation to the first word-line. Method also include receiving an error associated with reading the data from the second memory cells; and then reading the data from the second memory cells by applying a normal sensing operation to the second word-line.

Abstract: A method of concurrently programming a memory. Various methods include: applying a non-negative voltage on a first bit line coupled to a first memory cell; applying a negative voltage on a second bit line coupled to a second memory cell, where the negative voltage is generated using triple-well technology; then applying a programming pulse to the first and second memory cells concurrently; and in response, programming the first and second memory cells to different states. The methods also include applying a quick pass write operation to the first and second memory cells, by: applying a quick pass write voltage to the first bit line coupled to the fist memory cell, where the quick pass write voltage is higher than the non-negative voltage; applying a negative quick pass write voltage to the second bit line coupled to the first memory cell, where the negative quick pass write voltage is generated using triple-well technology.

Abstract: A memory apparatus and method of operation are provided. The apparatus includes first memory cells coupled to control circuit and a particular word line and storing a first cell data. The apparatus also includes second memory cells coupled to a source side neighbor word line disposed on a source side of the particular word line and storing second cell threshold voltages programmed after the first cell data. The control circuit senses the second cell threshold voltages at a first time while applying a predetermined initial read voltage to the source side neighbor word line. The control circuit senses the first cell data at a second time while iteratively applying one of a plurality of particular read voltages to the particular word line and simultaneously and iteratively applying one of a plurality of neighbor pass voltages to the source side neighbor word line based on the second cell threshold voltages.

Abstract: A methodology and structure for accounting for fabrication difference in memory holes is described. Increasing the distance of the memory holes from the sources of etchant or other fabrication material results in different characteristics of the memory from the outer memory holes to the inner memory holes. These difference can be accounted for by grouping the memory holes and altering the parameters of the program or verify operations based on the groupings. The bitline voltage for the inner grouping can be less than the bitline voltage for the outer groupings. The sense timing can be greater for the outer groupings relative to the inner groupings. This can result in voltage threshold for the inner groupings and outer groupings overlying each other to improve memory performance.

Abstract: Methods and systems for improving the reliability of data stored within a semiconductor memory are described. One issue with determining stored data states for memory cells within a NAND-type memory is that the voltage at the source end of a NAND string may vary greatly from when a memory cell of the NAND string is program verified to when the memory cell is subsequently read leading to bit errors. To compensate for this variability in the source line voltage, different sensing conditions (e.g., the bit line voltages and/or the sensing times) may be applied during a read operation to different sets of memory cells depending on the source line resistance from the memory cells or on the source line voltage zone assigned to the memory cells.

Abstract: Techniques are provided to adaptively determine when to begin verify tests for memory cells during a program operation. The memory cells are programmed using a normal programming speed until their threshold voltage exceeds an initial verify voltage. The memory cells are then programmed further using a reduced programming speed until their threshold voltage exceeds a final verify voltage. In one aspect, a count of memory cells which exceeds the initial verify voltage is used to determine when to begin verify tests for a higher data state. In another aspect, a count of the higher state memory cells which exceeds the initial or final verify voltage is used to determine when to begin verify tests for the higher data state. The counted memory cells are not subject to the reduced programming speed.