Abstract: A method of forming a stacked die structure is disclosed. A plurality of dies are respectively bonded to a plurality of semiconductor chips on a first surface of a wafer. An encapsulation structure is formed over the plurality of dies and the first surface of the wafer. The encapsulation structure covers a central portion of the first surface of the wafer and leaves an edge portion of the wafer exposed. A protective material is formed over the first surface of the edge portion of the wafer.

Abstract: An electrolytic capacitor includes a first electrode, a second electrode opposite to the first electrode, a separator sandwiched between the first electrode and the second electrode, a cell accommodating the first electrode, the second electrode and the separator, and an electrolytic solution filled into the inner space of the cell, with the first electrode, the second electrode and the separator immersed into the electrolytic solution. The first electrode and second electrode are in a CNT film structure, wherein the CNT film includes a number of CNTs packed closely, entangled and interconnected with each other, and disorderly arranged. The electrolytic capacitor is a high-performance capacitor.

Abstract: A method for thin wafer handling and processing is provided. In one embodiment, the method comprises providing a wafer having a plurality of semiconductor chips, the wafer having a first side and a second side. A plurality of dies are attached to the first side of the wafer, at least one of the dies are bonded to at least one of the plurality of semiconductor chips. A wafer carrier is provided, wherein the wafer carrier is attached to the second side of the wafer. The first side of the wafer and the plurality of dies are encapsulated with a planar support layer. A first adhesion tape is attached to the planar support layer. The wafer carrier is then removed from the wafer and the wafer is diced into individual semiconductor packages.

Abstract: An apparatus includes a planar heater. The planar heater includes a heating element and at least two electrodes. The at least two electrodes are separately and electrically connected to the heating element. The heating element includes a carbon nanotube film, and the carbon nanotube film comprises of a plurality of carbon nanotubes entangled with each other.

Abstract: A system and method for integrated circuit fabrication is provided. A wafer holding system includes a wafer carrier that holds the wafer at a specified alignment, and a top ring disposed on a top surface of the wafer and of the wafer carrier. The top ring holds the wafer and the wafer carrier together as a single unit. The wafer carrier includes an alignment mechanism to hold the wafer in the specified alignment.

Abstract: A method for making a high-density carbon nanotube array includes the steps of: (a) providing a substrate having a carbon nanotube array formed thereon; (b) providing an elastic film; (c) stretching the elastic film uniformly, and covering the elastic film to the carbon nanotube array; (d) exerting a pressure uniformly on the elastic film, and shrinking the carbon nanotube array and the elastic film under the pressure; and (e) separating the nanotube array from the elastic film to acquire a high-density carbon nanotube array.

Abstract: This invention is a method applicable to an image processing device, which includes the steps of providing a preprocess module for extracting a high-frequency portion of an image inputted into the device, extracting a gradient of the image and decomposing the image into plane and edge regions according to a predetermined fixed threshold, and providing a composite up-scaling module for executing the magnification processes on the image and the high-frequency portion thereof respectively, wherein the magnification process of plane regions of the image and the high-frequency portion is based on a simple interpolation while the edge regions of the image and the high-frequency portion is based on both a smart interpolation and the simple interpolation. The magnification results of the image and the high-frequency portion are then processed by a fusion process, so as to output an image having sharp but not blocky edges, rich details and strong contrast.

Abstract: A method of making a linear heater includes the following steps. Firstly, a linear supporter is provided. Secondly, a carbon nanotube structure is made. Thirdly, the carbon nanotube structure is attached on a surface of the linear supporter. Finally, at least two electrodes are provided and electrically connected to the carbon nanotube structure.

Abstract: A heater having a heating element includes a planar carbon nanotube structure and at least two electrodes. The at least two electrodes are electrically connected to the planar carbon nanotube structure. The planar carbon nanotube structure includes a plurality of linear carbon nanotube structure.

Abstract: An apparatus includes a planar heater. The planar heater includes a heating element and two electrodes. The two electrodes are electrically connected to the heating element. At least one of the two electrodes includes a carbon nanotube structure. The carbon nanotube structure includes at least one carbon nanotube film or at least one linear carbon nanotube structure.

Abstract: A method for making a heater is provided. A carbon nanotube structure is made, and a first electrode and a second electrode are provided. The first and second electrodes are electrically connected to the carbon nanotube structure.

Abstract: An apparatus includes a linear heater. The linear heater includes a linear supporter, a heating element and at least two electrodes. The heating element is located on the linear supporter and includes a carbon nanotube film. The carbon nanotube film includes a plurality of carbon nanotubes. The angle between an alignment direction of the carbon nanotubes and the surface of the heating element ranges from about 0 degrees to about 15 degrees. The at least two electrodes are separately located and electrically connected to the heating element.

Abstract: A heater having a heating element includes a carbon nanotube structure and at least two electrodes. The at least two electrodes are electrically connected to the heat element. The carbon nanotube structure includes a plurality of carbon nanotubes.

Abstract: An integrated circuit structure includes a die including a semiconductor substrate; dielectric layers over the semiconductor substrate; an interconnect structure including metal lines and vias in the dielectric layers; a plurality of channels extending from inside the semiconductor substrate to inside the dielectric layers; and a dielectric film over the interconnect structure and sealing portions of the plurality of channels. The plurality of channels is configured to allow a fluid to flow through.

Abstract: An apparatus includes a hollow heater. The hollow heater has a hollow supporter, a heating element and at least two electrodes. The at least two electrodes are separately and electrically connected to the heating element. The hollow supporter defines a hollow space, the hollow supporter has an inner surface and an outer surface. The heating element disposed on one of the surfaces of the hollow supporter. The heating element includes a carbon nanotube structure. The carbon nanotube structure includes a plurality of carbon nanotubes combined by wan der Waals attractive force.

Abstract: A multifunctional optical film for enhancing light extraction includes a flexible substrate, a structured layer, a high index backfill layer, and an optional passivation layer. The structured layer effectively uses microreplicated diffractive or scattering nanostructures located near enough to the light generation region to enable extraction of an evanescent wave from an organic light emitting diode (OLED) device. The backfill layer has a material having an index of refraction different from the index of refraction of the structured layer. The backfill layer also provides a planarizing layer over the structured layer in order to conform the light extraction film to a layer of an OLED display device. The film may have additional layers added to or incorporated within it to an emissive surface in order to effect additional functionalities beyond improvement of light extraction efficiency.

Abstract: A system, a structure and a method of manufacturing stacked semiconductor substrates is presented. A first substrate includes a first side and a second side. A through substrate via (TSV) protrudes from the first side of the first substrate. A first protruding portion of the TSV has a conductive protective coating and a second protruding portion of the TSV has an isolation liner. The system further includes a second substrate and a joint interface structure that bonds the second substrate to the first substrate at the conductive protective coating of the first protruding portion of the TSV.

Abstract: A system and method for improved semiconductor die production is provided. A preferred embodiment provides a method for creating a stackable die, the method includes providing a first substrate, and forming through-silicon vias in the first substrate. The through-silicon vias extend from a first surface of the first substrate, wherein the through-silicon vias connect to a conductive layer on the first surface of the first substrate, and wherein the conductive layer has a planar surface. The conductive layer joins to a carrier substrate with an adhesive. The method continues by joining a second substrate to a second surface of the first substrate, removing the carrier substrate, removing the adhesive layer, and patterning the conductive layer to form contact pads.

Abstract: A solar collector includes a substrate having a top surface and a bottom surface opposite to the upper surface, a sidewall, a transparent cover, and a heat-absorbing layer. The sidewall is arranged on the top surface of the substrate. The transparent cover is disposed on the sidewall opposite to the substrate to form a sealed chamber with the substrate together. The heat-absorbing layer is disposed on the upper surface of the substrate and includes a carbon nanotube film having a plurality of carbon nanotubes. The carbon nanotubes in the carbon nanotube film are entangled with each other.

Abstract: An apparatus includes a linear heater. The linear heater includes a linear supporter; a heating element and at least two electrodes. The heating element is located on the linear supporter and includes a carbon nanotube film. The carbon nanotube film includes a plurality of carbon nanotubes joined end-to-end by Van der Waals attractive force therebetween. The at least two electrodes are separately located and electrically connected to the heating element.