Abstract: A system and method for providing an integrated inductor with a high Quality factor (Q) is provided. An embodiment comprises a magnetic core that is in a center of a conductive spiral. The magnetic core increases the inductance of the integrated inductor to allow the inductor to be used in applications such as a RF choke. The magnetic core may be formed in the same manner and time as an underbump metallization.

Abstract: An embodiment is a method for semiconductor packaging. The method comprises attaching a chip to a carrier substrate through a first side of a jig, the chip being attached by bumps; applying balls to bond pads on the carrier substrate through a second side of the jig; and simultaneously reflowing the bumps and the balls. According to a further embodiment, a packaging jig comprises a cover, a base, and a connector. The cover has a first window through the cover. The base has a second window through the base. The first window exposes a first surface of a volume intermediate the cover and the base, and the second window exposes a second surface of the volume. The first surface is opposite the volume from the second surface. The connector aligns and couples the cover to the base.

Abstract: A multifunctional optical film for enhancing light extraction includes a flexible substrate, a structured layer, and a backfill layer. The structured layer effectively uses microreplicated diffractive or scattering nanostructures located near enough to the light generation region to enable extraction of an evanescent wave from an organic light emitting diode (OLED) device. The backfill layer has a material having an index of refraction different from the index of refraction of the structured layer. The backfill layer also provides a planarizing layer over the structured layer in order to conform the light extraction film to a layer of an OLED lighting device such as solid state lighting devices or backlight units. The film may have additional layers added to or incorporated within it to an emissive surface in order to effect additional functionalities beyond improvement of light extraction efficiency.

Abstract: A method for thin wafer handling and processing is provided. In one embodiment, the method comprises providing a wafer having a plurality of semiconductor chips, the wafer having a first side and a second side. A plurality of dies are attached to the first side of the wafer, at least one of the dies are bonded to at least one of the plurality of semiconductor chips. A wafer carrier is provided, wherein the wafer carrier is attached to the second side of the wafer. The first side of the wafer and the plurality of dies are encapsulated with a planar support layer. A first adhesion tape is attached to the planar support layer. The wafer carrier is then removed from the wafer and the wafer is diced into individual semiconductor packages.

Abstract: A thin wafer protection device includes a wafer having a plurality of semiconductor chips. The wafer has a first side and an opposite second side. A plurality of dies is over the first side of the wafer, and at least one of the plurality of dies is bonded to at least one of the plurality of semiconductor chips. A wafer carrier is over the second side of the wafer. An encapsulating layer is over the first side of the wafer and the plurality of dies, and the encapsulating layer has a planar top surface. An adhesive tape is over the planar top surface of the encapsulating layer.

Abstract: A wireless charging transmitter for a portable electronic device is provided. The wireless charging transmitter includes a first housing, a second housing and a wireless charge transmitting module. The wireless charge transmitting module is disposed within the second housing. The second housing is rotatable with respect to the first housing, so that either an included angle is defined between the second housing and the first housing or the second housing and the first housing are folded together. Whereas, in a case that an included angle is defined between the second housing and the first housing, once a wireless charging receiver is contacted with the second housing, electric power may be transmitted to the wireless charging receiver. In a case that the second housing and the first housing are folded together, the wireless charging transmitter has a rectangular shape. Due to the rectangular shape, the wireless charging transmitter is easily carried.

Abstract: A wireless charging receiver for a portable electronic device is provided. The wireless charging receiver includes a base plate, a wireless charge receiving module, a fastening part and an electric connector. The portable electronic device may be fixed on the base plate of the wireless charging receiver by means of the fastening part. Through the electric connector of the wireless charging receiver, the wireless charge receiving module is electrically connected with the portable electronic device. Consequently, electric power is transmitted to the portable electronic device through the wireless charging receiver to charge the portable electronic device.

Abstract: This invention is a method applicable to an image processing device, which includes the steps of providing a preprocess module for extracting a high-frequency portion of an image inputted into the device, extracting a gradient of the image and decomposing the image into plane and edge regions according to a predetermined fixed threshold, and providing a composite up-scaling module for executing the magnification processes on the image and the high-frequency portion thereof respectively, wherein the magnification process of plane regions of the image and the high-frequency portion is based on a simple interpolation while the edge regions of the image and the high-frequency portion is based on both a smart interpolation and the simple interpolation. The magnification results of the image and the high-frequency portion are then processed by a fusion process, so as to output an image having sharp but not blocky edges, rich details and strong contrast.

Abstract: A multifunctional optical film for enhancing light extraction includes a flexible substrate, a structured layer, and a backfill layer. The structured layer effectively uses microreplicated diffractive or scattering nanostructures located near enough to the light generation region to enable extraction of an evanescent wave from an organic light emitting diode (OLED) device. The backfill layer has a material having an index of refraction different from the index of refraction of the structured layer. The backfill layer also provides a planarizing layer over the structured layer in order to conform the light extraction film to a layer of an OLED lighting device such as solid state lighting devices or backlight units. The film may have additional layers added to or incorporated within it to an emissive surface in order to effect additional functionalities beyond improvement of light extraction efficiency.

Abstract: Described is a polyurethane wire enamel composed of at least one blocked polyisocyanate adduct, blocked with alkylphenols, at least one hydroxy polyester comprising ester and/or imide and/or amide groups, at least one hydrocarbon-based organic solvent, and further auxiliaries and additives.

Abstract: Provided is a method of making microarrays that includes providing a substrate with discrete first microfeatures that have a first profile, and depositing vapor-coated materials onto the first microfeatures to form second microfeatures having a second profile that is substantially different from the first profile. Also provided is a method of adding a replication material to the vapor-coated microfeatures to form a mold. Microarrays made by this method can be used as substrates for surface-enhanced Raman spectroscopy (SERS).

Abstract: An electronic device includes a housing, a capacitive touch button, a PCB and a connection mechanism. The capacitive touch button is secured in the housing and includes a number of button bodies. The PCB is secured in the housing. The connection mechanism includes a circuit board and a connection element. The circuit board is secured in the housing and includes a number of sensor electrodes and a number of electrical protrusions, which are all arranged corresponding to the number of button bodies of the capacitive touch button. The sensor electrodes are connected to the capacitive touch button and the electrical protrusions. The connection element includes a first end and a second end. The first end is fixed on the PCB. The second end resists against the electrical protrusions for electrically connecting the capacitive touch button and the controller of the PCB.

Abstract: A system, a structure and a method of manufacturing stacked semiconductor substrates is presented. A first substrate includes a first side and a second side. A through substrate via (TSV) protrudes from the first side of the first substrate. A first protruding portion of the TSV has a conductive protective coating and a second protruding portion of the TSV has an isolation liner. The system further includes a second substrate and a joint interface structure that bonds the second substrate to the first substrate at the conductive protective coating of the first protruding portion of the TSV.

Abstract: A light extraction film having internal nanostructures and external microstructures for organic light emitting diode (OLED) devices. The light extraction film includes a flexible substantially transparent film, a low index nanostructured layer applied to the film, and a high index planarizing backfill layer applied over the nanostructured layer. External optical microstructures are applied to the flexible substantially transparent film on a side opposite the nanostructured layer to enhance light extraction from the OLED devices while providing for a more uniform luminance distribution.

Abstract: Provided is a method of fabricating a continuous nanostructured material having an electrodeposited surface layer. A conductive master drum having a relief pattern on its surface that exposes only a portion of the master drum surface is immersed into a plating bath. An electrodepositable material is coated onto the exposed surface of the drum. A support material is coated over the deposited layer and the relief structure. Removal from the drum yields the nanostructured material.

Abstract: A multifunctional optical film for enhancing light extraction includes a flexible substrate, a structured layer, and a backfill layer. The structured layer effectively uses microreplicated diffractive or scattering nanostructures located near enough to the light generation region to enable extraction of an evanescent wave from an organic light emitting diode (OLED) device. The backfill layer has a material having an index of refraction different from the index of refraction of the structured layer. The backfill layer also provides a planarizing layer over the structured layer in order to conform the light extraction film to a layer of an OLED lighting device such as solid state lighting devices or backlight units. The film may have additional layers added to or incorporated within it to an emissive surface in order to effect additional functionalities beyond improvement of light extraction efficiency.

Abstract: A thermal interface material includes an array of carbon nanotubes with interspaces defined therebetween; and a low melting point metallic material filled in the interspaces. A method for fabricating a thermal interface material, the method includes (a) providing an array of carbon nanotubes with interspaces defined therebetween; and (b) depositing a low melting point metallic material on the carbon nanotubes in the interspaces therebetween to form a metallic layer with the array of carbon nanotubes embedded therein, and thereby, achieving the thermal interface material.

Abstract: An integrated circuit structure includes a first die including TSVs; a second die over and bonded to the first die, with the first die having a surface facing the second die; and a molding compound including a portion over the first die and the second die. The molding compound contacts the surface of the second die. Further, the molding compound includes a portion extending below the surface of the second die.

Abstract: An integrated circuit structure includes a bottom die; a top die bonded to the bottom die with the top die having a size smaller than the bottom die; and a molding compound over the bottom die and the top die. The molding compound contacts edges of the top die. The edges of the bottom die are vertically aligned to respective edges of the molding compound.

Abstract: A method and system of measuring the spectroscopic impedance of a sensor and its immediate surroundings. The sensor is disposed on an engineered structure and is coated with a protective coating. The method includes providing a first optical signal having a first modulation frequency and amplitude. The method also includes transmitting the first optical signal and a second optical signal from a first location to a sensor location. The method also includes modulating the second optical signal with a second modulation frequency and amplitude, the second modulation frequency and amplitude converted from the first optical signal. The method also includes comparing the first modulation frequency to the second modulation frequency to determine one of a phase difference and a time lag and calculating the electrochemical impedance spectroscopy of the sensor and its immediate surroundings as a function of frequency.