Abstract: Provided is a method of making colloidal platinum nanoparticles. The method includes three consecutive steps: dissolving platinum powders by a halogen-containing oxidizing agent in HCl to obtain an inorganic platinum solution containing an inorganic platinum compound; adding a reducing agent into the same reaction vessel to form a mixture solution and heating the mixture solution to undergo a reduction reaction and produce a composition containing platinum nanoparticles, residues and a gas, and guiding the gas out of the reaction vessel, wherein the amount of the residues is less than 15% by volume of the mixture solution; and adding a medium into the same reaction vessel to disperse the platinum nanoparticles to obtain colloidal platinum nanoparticles. The method is simple, safe, time-effective, cost-effective, and has the advantage of high yield.

Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer. The patterned first photoresist layer is used to form a first opening in an interconnect structure. The patterned first photoresist is removed, and a second photoresist layer is formed over the interconnect structure and in the first opening. The second photoresist layer is patterned to form a second opening over the interconnect structure in the first opening. The second opening is narrower than the first opening. At least one metal layer is plated through the patterned second photoresist layer to form the connector.

Abstract: A grating coupled laser (GCL) includes an active section and a passive section. The passive section is butt coupled to the active section to form a butt joint with the active section. The active section includes an active waveguide. The passive section includes a passive waveguide, a transmit grating coupler, and a top cladding. The passive waveguide is optically coupled end to end with the active waveguide and includes a first portion and a second portion. The first portion of the passive waveguide is positioned between the second portion of the passive waveguide and the active waveguide. The transmit grating coupler is optically coupled to the passive waveguide and includes grating teeth that extend upward from the second portion of the passive waveguide. The top cladding is positioned directly above the first portion of the passive waveguide and is absent directly above at least some of the transmit grating coupler.

Abstract: A semiconductor device includes a passivation layer formed on a semiconductor substrate, a protective layer overlying the passivation layer and having an opening, an interconnect structure formed in the opening of the protective layer, a bump formed on the interconnect structure, and a molding compound layer overlying the interconnect structure and being in physical contact with a lower portion of the bump.

Abstract: A device includes a first die, a second die, one or more redistribution layers (RDLs) electrically connected to the first die, a plurality of connectors on a surface of the one or more RDLs and a package substrate electrically connected to the first die and the second die. The package substrate is electrically connected to the first die through the one or more RDLs and the plurality of connectors. The package substrate comprises a cavity, and the second die is at least partially disposed in the cavity.

Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer. The patterned first photoresist layer is used to form a first opening in an interconnect structure. The patterned first photoresist is removed, and a second photoresist layer is formed over the interconnect structure and in the first opening. The second photoresist layer is patterned to form a second opening over the interconnect structure in the first opening. The second opening is narrower than the first opening. At least one metal layer is plated through the patterned second photoresist layer to form the connector.

Abstract: An assembly has at least one integrated circuit (IC) die fixed in a medium. The assembly has a redistribution layer over the IC die. The redistribution layer has conductors connecting first pads on active faces of the IC die to second pads at an exposed surface of the assembly. A die unit is provided over the IC die. The die unit has a bottom die interconnected to a package substrate. Respective portions of the redistribution layer corresponding to each of the at least one IC die partially underlie the bottom die, and extend beyond the bottom die. The package substrate has contacts connected to the ones of the second pads corresponding to the at least one IC die.

Abstract: Optical connectors are provided for connecting sets of optical waveguides, such as optical fiber ribbons to each other, to printed circuit boards, or to backplanes. The provided connectors utilize expanded beam optics with non-contact optical mating resulting in relaxed mechanical precision requirements. The provided connectors can have low optical loss, are easily scalable to high channel count (optical fibers per connector) and can be compatible with low insertion force blind mating.

Abstract: A semiconductor device includes a passivation layer formed on a semiconductor substrate, a protective layer overlying the passivation layer and having an opening, an interconnect structure formed in the opening of the protective layer, a bump formed on the interconnect structure, and a molding compound layer overlying the interconnect structure and being in physical contact with a lower portion of the bump.

Abstract: A thermochromic polymer composition including a base polymer material; a temperature sensitive material, which changes a color of the thermochromic polymer composition in response to a temperature change; and a stabilizer, which enhances stability performance of the thermochromic polymer composition. The thermochromic polymer composition which has a good thermochromic performance and good thermal performance and thus could provide a visible indication of the overheat condition. An electrical device is formed from the thermochromic polymer composition. A further embodiment of the process for preparing the thermochromic polymer composition and forming the electrical device.

Abstract: A thermochromic electrical device is made of thermochromic plastic material and has a visual indicator pre-printed with regular print or ink to allow visible warning of a scalding situation when the thermochromic plastic portion fades from its original color to leave the warning visible. The electric device may be any one of, for example, a cable tie, a cable connector, a terminal connector, a splice connector, and a cable jacket.

Abstract: A method of providing a geographically distributed live mixed-reality meeting is described. The method comprises receiving, from a camera at a first endpoint, a live video stream; generating an mixed reality view incorporating the received video stream; rendering the mixed reality view at a display at the first endpoint and transmitting the mixed reality view to at least one other geographically distant endpoint; receiving data defining a bounding area; calculating a real world anchor for the bounding area using the data defining the bounding area; rendering the bounding area in the mixed reality view at a real world position determined using the real world anchor; and applying different rule sets to content objects placed into the mixed reality view by users dependent upon the position of the content objects relative to the bounding area in real world space.

Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons and embedded optical waveguides, and optical interconnects useful for connecting multiple optical waveguides such as in optical fiber ribbon cables and printed circuit boards (PCBs) having optoelectronic capabilities. In particular, the disclosure provides an efficient, compact, and reliable optical waveguide connector that incorporates microlenses and re-directing elements which combine the features of optical waveguide alignment, along with redirecting and shaping of the optical beam.

Abstract: A flight control method includes obtaining route data for instructing an aircraft to fly on a route represented by the route data, analyzing the route data according to a preset splitting condition, splitting the route into multiple sub-routes in response to the route data satisfying the preset splitting condition, and determining a to-be-executed sub-route from the multiple sub-routes and transmitting the to-be-executed sub-route to the aircraft.

Abstract: A flight control method includes acquiring, by a smart terminal, data of at least two flight routes. The flight control method also includes associating, by the smart terminal and based on preset information of at least two aircrafts, at least one aircraft with a flight route of the at least two flight routes. The flight control method further includes based on a result of the associating, sending, by the smart terminal, data of the flight route to the associated at least one aircraft.

Abstract: A device includes a bottom package component that includes a bottom die, and a dam over a top surface of the bottom die. The dam has a plurality of sides forming a partial ring, with an air gap surrounded by the plurality of side portions. The air gap overlaps the bottom die. A top package component is bonded to the bottom package component, wherein the air gap separates a bottom surface of the top package component from the bottom die.

Abstract: A device comprises a substrate having a die mounted on the first side of the substrate and a moldable underfill (MUF) disposed on the first side of the substrate and around the die. An interposer is mounted on the first side of the substrate, with the interposer having lands disposed on a first side of the interposer. The interposer mounted to the substrate by connectors bonded to a second side of the interposer, the connectors providing electrical connectivity between the interposer and the substrate. A package is mounted on the first side of the interposer and is electrically connected to the lands. At least one of the lands is aligned directly over the die and wherein a pitch of the connectors is different than a pitch of the lands.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a bump structure disposed on a first substrate and a molding compound in physical contact with the bump structure. The bump structure protrudes from the molding compound. A conductive region is on a second substrate and contacts the bump structure. A no-flow underfill (NUF) material is vertically between the molding compound and the second substrate and laterally surrounds the bump structure. The NUF material is separated from the molding compound.

Abstract: A multiple optical fiber connection apparatus comprises an outer housing to receive a plurality of optical fibers and a collar body disposed within the housing having a fiber comb portion disposed at a front portion of the collar body. The fiber comb portion includes an array of grooves, with each groove configured to guide an optical fiber disposed therein, and a ramp section adjacent the groove array, wherein the ramp section including a gradual rising portion.

Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.