Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons, and fiber optic connectors useful for connecting multiple optical fibers such as in optical fiber ribbon cables. In particular, the disclosure provides an efficient, compact, and reliable optical fiber connector that incorporates an optically transmissive substrate combining the features of optical fiber alignment, along with redirecting and shaping of the optical beam.

Abstract: Methods of forming connectors and packaged semiconductor devices are disclosed. In some embodiments, a connector is formed by forming a first photoresist layer over an interconnect structure, and patterning the first photoresist layer with a pattern for a first portion of a connector. A first metal layer is plated through the patterned first photoresist layer to form the first portion of the connector which has a first width. A second photoresist layer is formed over the interconnect structure and the first portion of the connector. The second photoresist layer is patterned with a pattern for a second portion of the connector. A second metal layer is plated through the patterned second photoresist layer to form the second portion of the connector over the first portion of the connector. The second portion of the connector has a second width, the second width being less than the first width.

Abstract: The present disclosure relates to a monitoring module and an escalator/autowalk including the monitoring module. A monitoring device comprises: a first component disposed on one of the driving device of the escalator or autowalk and a fixed device; and a recess portion disposed on the other of the driving device of the escalator or autowalk and the fixed device and configured to receive at least a part of the first component; wherein a relative movement between the recess portion and the first component triggers the first component so as to indicate a movement of the driving device. By applying the monitoring device of the present disclosure, it is possible to achieve monitoring the movement of the driving device of the escalator or autowalk in multiple directions.

Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons, and fiber optic connectors useful for connecting multiple optical fibers such as in optical fiber ribbon cables. In particular, the disclosure provides an efficient, compact, and reliable optical fiber connector that incorporates a unitary substrate combining the features of optical fiber alignment and redirection of the optical beam to a connected optical fiber.

Abstract: Presented herein is a package comprising a carrier device of a device stack and at least one top device of the device stack mounted on a first side of the carrier device. A lid is mounted on the first side of the carrier device, with a first portion of the lid attached to the carrier device and a second portion of the lid extending past and overhanging a respective edge of the carrier device. The lid comprises a recess disposed in a first side, and the at least one top device is disposed within the recess. A thermal interface material disposed on the top device and contacts a surface of the recess.

Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons, and fiber optic connectors useful for connecting multiple optical fibers such as in optical fiber ribbon cables. In particular, the disclosure provides an efficient, compact, and reliable optical fiber connector that incorporates an optically transmissive substrate combining the features of optical fiber alignment, along with redirecting and shaping of the optical beam.

Abstract: A semiconductor device and a method of making the same are provided. A first die and a second die are placed over a carrier substrate. A first molding material is formed adjacent to the first die and the second die. A first redistribution layer is formed overlying the first molding material. A through via is formed over the first redistribution layer. A package component is on the first redistribution layer next to the copper pillar. The package component includes a second redistribution layer. The package component is positioned so that it overlies both the first die and the second die in part. A second molding material is formed adjacent to the package component and the first copper pillar. A third redistribution layer is formed overlying the second molding material. The second redistribution layer is placed on a substrate and bonded to the substrate.

Abstract: A method of forming a semiconductor package includes forming a passivation layer over a semiconductor substrate. The semiconductor substrate includes a first chip region, a second chip region and a scribe line region. The scribe line region is positioned between the first chip region and the second chip region. The method also includes forming a bump over the passivation layer on at least one of the first chip region and the second chip region. The method further includes removing a portion of the passivation layer to form a groove in the passivation layer on the scribe line region. The method additionally includes filling the groove with a molding compound layer. The molding compound layer is filled to a point that entirely fills the groove, covers the passivation layer, and covers a lower portion of the bump. The method also includes separating the first chip region from the second chip region along the scribe line region.

Abstract: Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant. The second die is attached by an external electrical connector to the redistribution structure. The second die is on an opposite side of the redistribution structure from the first die. A second encapsulant is on the redistribution structure and at least laterally encapsulates the second die. The second encapsulant has a surface distal from the redistribution structure. A conductive feature extends from the redistribution structure through the second encapsulant to the surface of the second encapsulant. A conductive pillar is on the conductive feature, and the conductive pillar protrudes from the surface of the second encapsulant.

Abstract: A connector is disclosed that includes a light coupling unit designed to receive light from an input side of the light coupling unit and transmit the received light to a mating connector from an output side of the light coupling unit along a direction different than the mating direction of the connector. The light coupling unit rotates when the connector mates with the mating connector.

Abstract: A connector is disclosed that includes a housing and first and second attachment areas located in the housing and spaced apart from each other along the mating direction of the connector. The second, but not the first, attachment area is designed to move relative to the housing. The connector further includes an optical waveguide that is permanently attached to, and under a first bending force between, the first and second attachment areas. The connector also includes a light coupling unit located in the housing for receiving light from the optical waveguide and transmitting the received light to a mating connector along a direction different than the mating direction of the connector. The mating of the connector to the mating connector causes the optical waveguide to be under a greater second bending force between the first and second attachment areas.

Abstract: A dimensional measuring device sends a beam of light to a remote probe having a retroreflector and a pitch/yaw sensor. The pitch/yaw sensor passes the light through an aperture and a lens to a position sensor that generates an electrical signal indicative of the position of the received light. A processor uses the electrical signal to determine a pitch angle and a yaw angle of the remote probe.

Abstract: An integrated circuit structure includes an alignment bump and an active electrical connector. The alignment bump includes a first non-solder metallic bump. The first non-solder metallic bump forms a ring encircling an opening therein. The active electrical connector includes a second non-solder metallic bump. A surface of the first non-solder metallic bump and a surface of the second non-solder metallic bump are substantially coplanar with each other.

Abstract: The disclosure generally relates to sets of optical waveguides such as optical fiber ribbons and embedded optical waveguides, and optical interconnects useful for connecting multiple optical waveguides such as in optical fiber ribbon cables and printed circuit boards (PCBs) having optoelectronic capabilities. In particular, the disclosure provides an efficient, compact, and reliable optical waveguide connector that incorporates microlenses and re-directing elements which combine the features of optical waveguide alignment, along with redirecting and shaping of the optical beam.

Abstract: Presented herein is a package comprising a carrier device of a device stack and at least one top device of the device stack mounted on a first side of the carrier device. A lid is mounted on the first side of the carrier device, with a first portion of the lid attached to the carrier device and a second portion of the lid extending past and overhanging a respective edge of the carrier device. The lid comprises a recess disposed in a first side, and the at least one top device is disposed within the recess. A thermal interface material disposed on the top device and contacts a surface of the recess.

Abstract: Stacked semiconductor devices and methods of forming the same are disclosed. First tier workpieces are mounted on a top surface of a semiconductor device to form first tier stacks, the semiconductor device comprising one or more integrated circuit dies, the semiconductor device having one or more test pads per integrated circuit die on the top surface of the semiconductor device. Each of the first tier stacks is electrically tested to identify first known good stacks and first known bad stacks. Second tier workpieces are mounted atop the first known good stacks, thereby forming second tier stacks. Each of the second tier stacks is electrically tested to identify second known good stacks and second known bad stacks. Stacking process further comprises one or more workpiece mounting/testing cycles. The stacking process continues until the stacked semiconductor devices comprise desired number of workpieces.

Abstract: A method of forming a semiconductor package includes depositing a passivation layer overlying a semiconductor substrate, wherein the semiconductor substrate includes a scribe line region positioned between a first chip region and a second chip region. The method further includes forming a bump overlying the passivation layer on at least one of the first chip region or the second chip region, wherein the bump comprises a copper pillar and a cap layer. The method further includes forming a groove passing through the passivation layer on the scribe line region, wherein the groove extends into the semiconductor substrate to expose a stepped sidewall of the semiconductor substrate. The method further includes applying a molding compound layer to cover the passivation layer and a lower portion of the bump and fill the groove. The method further includes singulating along the scribe line region.

Abstract: Optical connectors are provided for connecting sets of optical waveguides (104), such as optical fiber ribbons to each other, to printed circuit boards, or to backplanes. The provided connectors (100) include a housing (110) that has an attachment area (102) for receiving and permanently attaching a plurality of optical waveguides. Additionally, the provided connectors include a light coupling unit (120) disposed in and configured to move with the housing. The provided connectors also include a second attachment area (108) for receiving and permanently attaching to the plurality of optical waveguides that causes each optical waveguide to be bent between the two attachment areas. The provided connectors utilize expanded beam optics with non-contact optical mating resulting in relaxed mechanical precision requirements. The provided connectors can have low optical loss, are easily scalable to high channel count (optical fibers per connector) and can be compatible with low insertion force blind mating.

Abstract: Presented herein are a package-on-package device having a molded underfill and a method for forming the same, the method comprising applying a package mount mounting a die to the first side of a carrier package. A molded underfill may be applied first side of the carrier package, and be in contact with a portion of the package mount a portion of a sidewall of the die. A top package having at least one land may be mounted to the first side of the carrier package above the die, and, optionally separated from the top of the die. The package mount may be coined prior to, during or after applying the molded underfill to optionally be level with the underfill surface. The underfill region contacting the package mount may be below or above the surface of the underfill region contacting the die sidewall.

Abstract: Integrated circuit (IC) packages and methods of forming the IC packages are provided. In an embodiment, IC dies are formed and are placed on a carrier to form a packaged semiconductor device. An encapsulant is formed over the IC dies and between the neighboring IC dies. The encapsulant and the IC dies are planarized to expose contacts on top surfaces of the IC dies, and redistribution layers (RDLs) are formed over the planarized encapsulant and the planarized IC dies. Openings are formed in a topmost dielectric layer of the RDLs to expose interconnects in the RDL, and a conductive seed layer is formed over the RDL and in the openings. Connectors of a first type and connectors of a second type are formed over the seed layer in the openings. The packaged semiconductor device is diced into individual IC packages.