Abstract: An assembly includes: a server rack; first side and second side outer rails attached to the rack and positionally fixed relative to the rack; a support device attached to the rack adjacent to a rear of the rack; a computer network switch having a port side positioned adjacent to the rear of the rack; and first side and second side inner rails attached to the network switch and positionally fixed relative to the network switch, the inner rails being slidably attached to the outer rails. The network switch is movable between a retracted position and an extended position, and the support device is located such that the support device physically blocks the network switch from being removed from the rear of the server rack.

Abstract: A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

Abstract: An apparatus includes a connector cover and a lever arm coupled to the connector cover, the lever arm being shaped to accommodate a portion of an activating pin, wherein contact of the activating pin with the lever arm causes a movement of the connector cover from a first position to a second position. The apparatus includes a latch assembly comprising a clamp, the clamp in a clamped position preventing the connector cover from moving from the first position to a second position. The apparatus includes a first bracket with a first indentation, the first indentation being sized to accommodate a portion of a first locating pin, wherein an insertion of the first locating pin into the first indentation moves the clamp from the clamped position to an unclamped position, the unclamped position permitting the connector cover to move when activated by the insertion of the activating pin.

Abstract: An apparatus includes a connector cover and a lever arm coupled to the connector cover, the lever arm being shaped to accommodate a portion of an activating pin, wherein contact of the activating pin with the lever arm causes a movement of the connector cover from a first position to a second position. The apparatus includes a latch assembly comprising a clamp, the clamp in a clamped position preventing the connector cover from moving from the first position to a second position. The apparatus includes a first bracket with a first indentation, the first indentation being sized to accommodate a portion of a first locating pin, wherein an insertion of the first locating pin into the first indentation moves the clamp from the clamped position to an unclamped position, the unclamped position permitting the connector cover to move when activated by the insertion of the activating pin.

Abstract: An assembly includes: a server rack; first side and second side outer rails attached to the rack and positionally fixed relative to the rack; a support device attached to the rack adjacent to a rear of the rack; a computer network switch having a port side positioned adjacent to the rear of the rack; and first side and second side inner rails attached to the network switch and positionally fixed relative to the network switch, the inner rails being slidably attached to the outer rails. The network switch is movable between a retracted position and an extended position, and the support device is located such that the support device physically blocks the network switch from being removed from the rear of the server rack.

Abstract: A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

Abstract: A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

Abstract: A hardware retention mechanism comprising a frame including a first guide shoulder and a pivot point; an actuator arm including a first guide post; and a first shape memory alloy wire strung between the first guide shoulder and the first guide post that rotates the actuator arm between a locked position and an unlocked position. The actuator arm is rotatable around the pivot point between a locked position and an unlocked position. In some embodiments, the frame may further comprise a second guide shoulder, the actuator arm may further comprise a second guide post, and a second shape memory alloy wire may be strung between the second guide shoulder and the second guide post that rotates the actuator arm between an unlocked position and a locked position.

Abstract: A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

Abstract: A system and computer program product are provided for controlling liquid-cooled electronics, which includes measuring a first set point temperature, Ta, wherein the Ta is based on a dew point temperature, Tdp of a computer room. A second set point temperature, Tb, is measured, wherein the Tb is based on a facility chilled liquid inlet temperature, Tci, and a rack power, Prack, of an electronics rack. A Modular Cooling Unit (MCU) set point temperature, Tsp, is selected. The Tsp is the higher value of said Ta and said Tb. Responsive to the selected Tsp, a control valve is regulated. The control valve controls a flow of liquid that passes through a heat exchanger.

Abstract: Aspects of the present invention include an optical fiber connector for connecting optical fibers. The optical fiber connector includes a ferrule coupled to one or more optical fiber ribbons. The optical fiber connector includes a connector housing coupled with a radius controlled ribbon bending housing. The connector housing surrounds the ferrule on at least four sides, and the one or more optical fiber ribbons coupled to the ferrule are within the connector housing. The optical fiber connector includes a strain relief clamp coupled with the radius controlled ribbon bending housing.

Abstract: Aspects of the present invention include an optical fiber connector for connecting optical fibers. The optical fiber connector includes a ferrule coupled to one or more optical fiber ribbons. The optical fiber connector includes a connector housing coupled with a radius controlled ribbon bending housing. The connector housing surrounds the ferrule on at least four sides, and the one or more optical fiber ribbons coupled to the ferrule are within the connector housing. The optical fiber connector includes a strain relief clamp coupled with the radius controlled ribbon bending housing.

Abstract: Aspects of the present invention include an optical transceiver for providing transmission and reception of optical signals. The optical transceiver includes a carrier having two opposing surfaces and one or more openings extending from a first of the two opposing surfaces to a second of the two opposing surfaces. The optical transceiver includes a laser driver chip coupled to the first surface. The optical transceiver includes a vertical cavity surface emitting laser (VCSEL) array chip coupled to the first surface. The optical transceiver includes a photodetector array chip coupled to the first surface. The optical transceiver includes a receiver amplifier chip coupled to the first surface. The optical transceiver includes an optical coupling element coupled to the second surface. The VCSEL array chip and the photodetector array chip are disposed such that optical signals can pass through the one or more openings in the carrier.

Abstract: Embodiments are directed to decomposing an all-to-all interconnection network topology into a plurality of smaller all-to-all interconnection network elements, replicating the interconnection network elements in a modular fashion, wherein the modular interconnection network elements construct the all-to-all interconnection network topology. Embodiments are directed to an apparatus comprising a shuffle cable assembly comprising a plurality of shuffle cables, where each of the plurality of shuffle cables comprises a plurality of optical fibers and a plurality of connectors, a block configured to organize, align, and maintain a position of the plurality of connectors, and at least one handle coupled to the block and configured to actuate the plurality of connectors.

Abstract: Aspects of the present invention include an optical fiber routing mat for routing optical fibers. The optical fiber routing mat includes a first layer of material and a second layer of material. A surface of the first layer of material is adhesively coupled to a surface of the second layer of material. The optical fiber routing mat includes one or more optical fibers disposed between the first layer of material and the second layer of material. The one or more optical fibers are bent to a radius at least large enough to prevent damage to the one or more optical fibers.

Abstract: A method of forming a custom module lid. The method may include placing a multichip module (MCM) between a module base and a temporary lid, target components are exposed through viewing windows in the temporary lid, a top surface of the target components is measured and mapped to create a target profile, the target profile is used to form custom pockets in a custom lid, and the custom pockets correspond to the target components.

Abstract: Aspects of the present invention include an optical fiber routing mat for routing optical fibers. The optical fiber routing mat includes a first layer of material and a second layer of material. A surface of the first layer of material is adhesively coupled to a surface of the second layer of material. The optical fiber routing mat includes one or more optical fibers disposed between the first layer of material and the second layer of material. The one or more optical fibers are bent to a radius at least large enough to prevent damage to the one or more optical fibers.

Abstract: A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

Abstract: Aspects of the present invention include an optical transceiver for providing transmission and reception of optical signals. The optical transceiver includes a carrier having two opposing surfaces and one or more openings extending from a first of the two opposing surfaces to a second of the two opposing surfaces. The optical transceiver includes a laser driver chip coupled to the first surface. The optical transceiver includes a vertical cavity surface emitting laser (VCSEL) array chip coupled to the first surface. The optical transceiver includes a photodetector array chip coupled to the first surface. The optical transceiver includes a receiver amplifier chip coupled to the first surface. The optical transceiver includes an optical coupling element coupled to the second surface. The VCSEL array chip and the photodetector array chip are disposed such that optical signals can pass through the one or more openings in the carrier.

Abstract: Aspects of the present invention include an optical fiber routing mat for routing optical fibers. The optical fiber routing mat includes a first layer of material and a second layer of material. A surface of the first layer of material is adhesively coupled to a surface of the second layer of material. The optical fiber routing mat includes one or more optical fibers disposed between the first layer of material and the second layer of material. The one or more optical fibers are bent to a radius at least large enough to prevent damage to the one or more optical fibers.