Abstract: A docking apparatus for printed circuit boards including a cassette housing so as to define a housing cavity for containing a printed circuit board (PCB) and a linkage mechanism disposed so as to be associated with the cassette housing. The linkage mechanism includes a linkage arm pivotally connected to the cassette housing via a pivot and has a first arm pivotally connected to the PCB, a clevis pivotally connected to a second arm extending from the first arm, a shaft extending through an aperture in the clevis at a first end defining the shaft, the first end configured to operably transfer axial translation of the shaft to the clevis, and an opposite second end defining the shaft includes a thread, and a nut operably secured to the cassette housing.

Abstract: A method and apparatus for providing an electromagnetic conduction seal in a device disposed within an electrical enclosure includes a metal EMC gasket defined by a first end an and opposite second end. The first end is operably secured to the device and at least the second end is allowed to float while remaining in electrical contact with the device. A lock strip is fixed to the device and is configured to provide limits of deflection of an intermediate portion of the gasket intermediate the first and second ends and captivate at least one floating end of the gasket. The intermediate portion provides an electromagnetic conduction seal between the device and with at least one of another device and/or the electrical enclosure.

Abstract: A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.

Abstract: An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.

Abstract: Method and apparatus to prevent disturbances on the system power busses in a data processing system while communication channels of the system are partitioned and redundant to eliminate interruptions. Power to Direct Access Storage Devices (DASD) and Terminators are powered-on in a slow controlled manner to prevent disturbances on the power busses. This allows for hot plugging of DASD backplanes. Very fast (1u sec.) soft switch circuits along with parasitic (Lparx) storage components provide over current protection from any shorting component or disk drive.

Abstract: An I/O subsystem for providing a high density modular input/output package in a data processing system. The I/O subsystem includes an enclosure having a midplane assembly in the center portion. The enclosure includes electrical components including redundant power supplies, air moving units and DASD carriers having DASD drives assemblies therein in the front portion of the enclosure, and planar boards having PCI card assemblies slidably mounted thereon in the rear portion of the enclosure. The mid plane includes multiconductor power buses for distribution of power from the power supplies to the electrical components of the I/O subsystem.

Abstract: A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.

Abstract: A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the

Abstract: A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the

Abstract: A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit board and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a linkage mechanism, wherein the linkage mechanism includes an engagement configuration and a disengagement configuration and wherein the linkage mechanism is disposed so as to be associated with the cassette housing and a housing bezel, wherein the housing bezel is disposed relative to the cassette housing so as to be associated with the cable opening.

Abstract: A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit board and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a linkage mechanism, wherein the linkage mechanism includes an engagement configuration and a disengagement configuration and wherein the linkage mechanism is disposed so as to be associated with the cassette housing and a housing bezel, wherein the housing bezel is disposed relative to the cassette housing so as to be associated with the cable opening.

Abstract: A cartridge is provided for the insertion and removal of printed circuit cards from a printed circuit board. The cartridges are self-contained and employ board level guides for establishing a position from which the force of card insertion can be withstood. The cartridges include an external actuating lever which also preferably operates a portion of an EMI shield system which is integrated with the circuit board. The cartridge tops also interlock to provide additional overall structural rigidity.

Abstract: A solid state circuit breaker is disclosed for use in connection with a voltage bus, the voltage bus supplying electrical current to a load. The solid state circuit breaker includes a current controller for controlling the magnitude of current supplied by the voltage bus. A first current sensor senses the magnitude of the electrical current supplied by the voltage bus, the first current sensor having an output in communication with the current controller. An inductor is included within the first current sensor, the inductor providing a back electromotive force on the voltage bus. The back electromotive force is proportional to the rate of change of current flowing through the voltage bus.

Abstract: A guide structure and matching printed circuit card carrying cartridge provides hot pluggability functionality even when electronic circuit components need to be disposed in very tight spaces. The guide structure includes front and rear portions linked by slot-defining rungs. Front and rear apertures provide alignment and/or locking functions. The guide structure is easily manufacturable from a single sheet of metal which is stamped and formed to meet all desirable design specifications. A matching self-contained docking cartridge is provided with mating parts for these apertures. EMI shielding and cooling functions are also accommodated.

Abstract: A solid state circuit breaker is disclosed for use in connection with a voltage bus, the voltage bus supplying electrical current to a load. The solid state circuit breaker includes a current controller for controlling the magnitude of current supplied by the voltage bus. A first current sensor senses the magnitude of the electrical current supplied by the voltage bus, the first current sensor having an output in communication with the current controller. An inductor is included within the first current sensor, the inductor providing a back electromotive force on the voltage bus. The back electromotive force is proportional to the rate of change of current flowing through the voltage bus.

Abstract: A preferred embodiment of an easily loadable self-contained cartridge for printed circuit card insertion and removal comprises a top wall and a front conductive bezel which is pivoted at its top with the top of the box wall. A set of three linked arms with an actuating arm extending through and affixed to the bezel provides a mechanism for moving a card-bearing movable carrier. One end of the set of linked arms is affixed to the top wall and a middle arm includes a pin which rides in a slot in the carrier to effect the desired vertical carrier motion which moves a printed circuit card edge connector into and out of a board level connector. The carrier includes slotted clips for holding the printed circuit card at one or more corners. The carrier is adjustable. A side wall includes a ridge which mates with board level guides.

Abstract: An over-voltage protection circuit for power supplies employing phase-shift controllers is provided. The power supplies typically comprise a redundant system for maintaining availability of bus voltage in the event of the failure of one of the supplies. The circuitry provides advantages in high power applications over prior art by overcoming the inefficiencies of connecting the supplies to a common bus through a diode. Additional circuitry eliminates the false shutdown of working power supplies.

Abstract: A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from computer systems. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, predesigned load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided.

Abstract: A d.c. motor together with a hot gas bypass valve is incorporated into a cooling system specifically designed for removing heat from computer systems. Unlike typical refrigeration systems, the cooling system herein runs continuously and responds to changes in thermal load. This allows the unit to operate within a wide range of ambient conditions and at various thermal load levels unlike other systems which were capable of operation only at a single, predesigned load level. The cooling system is modular and is easily added to or removed from a redundant system which includes a single evaporator with multiple refrigerant loops which provides yet another aspect of continuous operation due to the inherent redundancy thus provided.

Abstract: An electromagnetic contactor assembly with a sensing circuit for determining contactor state based upon the reluctance of the contactor coil. The coil has an electromagnetic coil and a movable contact separated from the coil by a gap when the coil is not energized. Energizing the coil causes the movable contact to close the gap and contact the coil. The determination of the relationship between the reluctance in the coil when the gap is in an open and closed state allows contactor gap status to be measured by measuring the coil inductance. A sensing circuit is added to the drive circuit to measure changes in AC current during the pulse cycle which holds the contacts in this closed position. The sensing circuit measures the AC current and is able to signal contactor status based on that value.