Abstract: A semiconductor device includes a stack of layers stacked vertically and including a source layer, a drain layer and a channel layer between the source layer and the drain layer. A gate electrode is formed in a common plane with the channel layer and a gate dielectric is formed vertically between the gate electrode and the channel layer. A first contact contacts the stack of layers on a first side of the stack of layers, and a second contact formed on an opposite side vertically from the first contact.

Abstract: Semiconductor devices and methods of forming the same include forming a drain/gate contact, in an opening of a layer of dielectric material, that includes a portion that extends up along sidewalls of the opening. A drain layer is formed on a bottom surface of the drain/gate contact. A trapped insulator layer is formed on sidewalls of the drain/gate contact. A channel layer is formed in the opening. A source layer is formed on the channel layer.

Abstract: Interposer-less multi-chip module are provided. In one aspect, an interposer-less multi-chip module includes: a substrate; a base film disposed on the substrate; and chips pressed into the base film, wherein top surfaces of the chips are coplanar. For instance, the chips can have varying thicknesses and are pressed into the base film to different depths such that top surfaces of the chips are coplanar. An interconnect layer having back-end-of line (BEOL) metal wiring can be present on the wafer over the chips. Methods of forming an interposer-less multi-chip module are also provided.

Abstract: Semiconductor devices and methods of forming the same include forming an etch mask on a stack of alternating dielectric layers and conductor layers. An exposed portion of a dielectric layer and a conductor layer is etched away to form a wordline. The forming and etching steps are repeated, adding additional etch mask material at each iteration, to form respective wordlines at each iteration.

Abstract: A method of forming a semiconductor structure includes forming a wordline stack for a non-volatile memory structure over a capping layer, the wordline stack including sets of alternating layers of insulating and gate materials each having a different width. The method also includes forming a first bitline contact layer between first and second portions of the wordline stack each including at least one of the sets. The method further includes forming a floating gate device structure vertically in a channel hole through the wordline stack, the first bitline contact layer and the capping layer. The method further includes forming wordline contacts to the gate layers and a first bitline contact to the first bitline contact layer in holes paced apart from vertical sidewalls of the floating gate device structure, and forming a second bitline contact over at least a portion of a top surface of the floating gate device structure.

Abstract: Embodiments of the invention are directed to a method of performing fabrication operations to form a transistor, wherein the fabrication operations include forming a source or drain (S/D) region having an S/D formation assistance region at least partially within a portion of a substrate. An S/D isolation region is formed around sidewalls and a bottom surface of the S/D formation assistance region and configured to electrically isolate the S/D formation assistance region from the substrate.

Abstract: Embodiments of the present invention are directed to fabrication methods and resulting semiconductor structures having a bulb-shaped buried interconnect positioned below a shallow trench isolation region. In a non-limiting embodiment of the invention, a cavity is formed below a surface of a substrate. The cavity extends under a portion of a semiconductor fin. The cavity is filled with a sacrificial material and a shallow trench isolation region is formed on the sacrificial material in the cavity. A portion of the shallow trench isolation region is removed to expose a surface of the sacrificial material in the cavity. The sacrificial material is removed from the cavity and replaced with a buried interconnect.

Abstract: Systems and methods for a capacitor based resistive processing unit with symmetrical weight updating include a first capacitor that stores a charge corresponding to a weight value. A readout circuit reads the charge stored in the first capacitor to apply a weight to an input value corresponding to an input signal using the weight value to produce an output. An update circuit updates the weight value stored in the first capacitor, including a second capacitor in communication with the first capacitor to transfer an amount of charge to the first capacitor according to an error of the output by changing a voltage difference across the first capacitor by a voltage change corresponding to the amount of charge, the voltage difference corresponding to the charge stored in the first capacitor.

Abstract: A method of forming a resistive random access memory (ReRAM) device is provided. The method includes depositing a lower cap layer on a substrate, depositing a dielectric memory layer on the lower cap layer, and depositing an upper cap layer on the dielectric memory layer. The method further includes removing portions of the lower cap layer to form a lower cap slab, dielectric memory layer to form a dielectric memory slab on the lower cap slab, and upper cap layer to form an upper cap slab on the dielectric memory slab, wherein the lower cap slab, dielectric memory slab, and upper cap slab form a resistive memory element.

Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.

Abstract: Embodiments of the present invention are directed to fabrication methods and resulting semiconductor structures having a bulb-shaped buried interconnect positioned below a shallow trench isolation region. In a non-limiting embodiment of the invention, a cavity is formed below a surface of a substrate. The cavity extends under a portion of a semiconductor fin. The cavity is filled with a sacrificial material and a shallow trench isolation region is formed on the sacrificial material in the cavity. A portion of the shallow trench isolation region is removed to expose a surface of the sacrificial material in the cavity. The sacrificial material is removed from the cavity and replaced with a buried interconnect.

Abstract: A single chip including an optoelectronic device on the semiconductor layer in a first region, the optoelectronic device comprises a bottom cladding layer, an active region, and a top cladding layer, wherein the bottom cladding layer is above and in direct contact with the semiconductor layer, the active region is above and in direct contact with the bottom cladding layer, and the top cladding layer is above and in direct contact with the active region, a silicon device on the substrate extension layer in a second region, a device insulator layer substantially covering both the optoelectronic device in the first region and the silicon device in the second region, and a waveguide embedded within the device insulator layer in direct contact with a sidewall of the active region of the optoelectronic device.

Abstract: An integrated FinFET and deep trench capacitor structure and methods of manufacture are disclosed. The method includes forming at least one deep trench capacitor in a silicon on insulator (SOI) substrate. The method further includes simultaneously forming polysilicon fins from material of the at least one deep trench capacitor and SOI fins from the SOI substrate. The method further includes forming an insulator layer on the polysilicon fins. The method further includes forming gate structures over the SOI fins and the insulator layer on the polysilicon fins.

Abstract: In one example, a field effect transistor includes a fin. The fin includes a conducting channel formed from semiconductor-on-insulator and source/drain regions formed on opposite ends of the conducting channel, wherein the source/drain regions are formed from a material other than semiconductor-on-insulator. A gate is wrapped around the conducting channel, between the source/drain regions. In another example, a method for fabricating a field effect transistor includes forming a fin on a wafer. The fin includes a conducting channel formed from semiconductor-on-insulator and source/drain regions formed on opposite ends of the conducting channel, wherein the source/drain regions are formed from a material other than semiconductor-on-insulator. A gate is also formed between the source/drain regions and wraps around the conducting channel.

Abstract: Techniques for secure and tamper-resistant wafer identification using a unique wafer fingerprint are provided. In one aspect, a method for wafer authentication includes: placing, at each level of fabrication of chips on the wafer, reference structures across the chips; inspecting the wafer at each level of the fabrication; and performing at least one of overlay and scatterometry measurements of the reference structures to use as a unique fingerprint for authenticating the wafer that has been inspected. A method for authentication throughout a process flow for fabrication of chips on a wafer is also provided, as is a wafer having chips and reference structures placed across the chips at each level of the chips to provide a unique fingerprint for authenticating the wafer.

Abstract: Embodiments of the invention are directed to a semiconductor-based structure. A non-limiting example of the semiconductor-based structure includes a fin formed over a substrate. A tunnel is formed through the fin to define an upper fin region and a lower fin region. A gate structure is configured to wrap around a circumference of the upper fin region.

Abstract: A method of forming a semiconductor structure includes forming a wordline stack for a non-volatile memory structure over a capping layer, the wordline stack including sets of alternating layers of insulating and gate materials each having a different width. The method also includes forming a first bitline contact layer between first and second portions of the wordline stack each including at least one of the sets. The method further includes forming a floating gate device structure vertically in a channel hole through the wordline stack, the first bitline contact layer and the capping layer. The method further includes forming wordline contacts to the gate layers and a first bitline contact to the first bitline contact layer in holes paced apart from vertical sidewalls of the floating gate device structure, and forming a second bitline contact over at least a portion of a top surface of the floating gate device structure.

Abstract: A CMOS-based resistive processing unit (RPU) for a neural network. The RPU includes a capacitor device configured to store a charge representing a weight value associated with a neural network circuit operation. A current source Field Effect Transistor (FET) device is operatively connected to the capacitor device for increasing a charge on the capacitor. A current sink FET device operatively connected to the capacitor device is configured for decreasing the stored capacitor charge. An analog weight update circuit receives one or more update signals generated in conjunction with the neural network circuit operation, the analog weight update circuit controlling the current source FET device and the current sink FET device to provide either a determined amount of current to increase the stored charge on the capacitor device, or sink a determined amount of current to decrease the stored charge on the capacitor device.

Abstract: A CMOS-based resistive processing unit (RPU) and method for a neural network. The RPU includes a capacitor device configured to store a charge representing a weight value associated with a neural network circuit operation. A current source Field Effect Transistor (FET) device is operatively connected to the capacitor device for increasing a charge on the capacitor. A current sink FET device operatively connected to the capacitor device is configured for decreasing the stored capacitor charge. An analog weight update circuit receives one or more update signals generated in conjunction with the neural network circuit operation, the analog weight update circuit controlling the current source FET device and the current sink FET device to provide either a determined amount of current to increase the stored charge on the capacitor device, or sink a determined amount of current to decrease the stored charge on the capacitor device.

Abstract: A neural network device includes a crossbar grid including first metal lines running in a first direction and second metal lines running transversely to the first metal lines and being electrically isolated from the first metal lines. An array of cross-over elements is included. Each cross-over element is connected between a first metal line and a second metal line. The cross-over elements each include a floating gate transistor device having a floating node. The floating node is configured to store a programmable weight value.