Abstract: Systems and methods for improving timing closure of new and existing IC chips by breaking at least one parameter of interest into two or more partial parameters. More specifically, a method is provided for that includes propagating at least one timing analysis run for a semiconductor product. The method further includes identifying at least one parameter of interest used in the at least one timing analysis run. The method further includes splitting the at least one parameter into two parts comprising a controlled part and an uncontrolled part. The method further includes correlating or anti-correlating the controlled part with another parameter used in the at least one timing analysis run. The method further includes projecting timing using the correlation or anti-correlation between the controlled part and the another parameter and using the uncontrolled part of the at least one parameter.

Abstract: Systems and methods for improving timing closure of new and existing semiconductor products by balancing sensitivities. More specifically, a method is provided for that includes defining at least one set of correlated parameters for a semiconductor product, the at least one set of correlated parameters comprising a first parameter and a second parameter. The method further includes measuring performance of embedded devices within the semiconductor product. The method further includes closing timing of the semiconductor product using the measured performance of the semiconductor product. The closing the timing of the semiconductor product comprises calculating a sensitivity to the first parameter based on the measured performance of the embedded devices within the semiconductor product and balancing the sensitivity to the first parameter with a sensitivity to a second parameter such that timing degradation is shifted from the first parameter to the second parameter.

Abstract: Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively.

Abstract: Embodiments of the present invention relate to determining process variations using device threshold sensitivities. A computing device determines first and second threshold voltages for first and second transistors, respectively, wherein the first and second transistors are included in an integrated circuit and are n-channel and p-channel field effect transistors, respectively. The computing device also determines process parameters that are associated with the integrated circuit using a combination of determined first and second threshold voltages, wherein the process parameter reflects random sensitivities, timing delay differences, timing delay and slew rate changes, and/or variations between low, high, and regular threshold voltages which are associated with the first and second transistors.

Abstract: Various embodiments include approaches for controlling a supply voltage or a clock frequency to an integrated circuit (IC). Various additional embodiments include circuitry for controlling a supply voltage or a clock frequency of an IC. In some cases, a method includes: locating a set of temperature sensors on bin locations in an IC; determining temperature bounds of the bin locations in the IC as a function of a determined temperature at the set of temperature sensors; determining timing constraints as a function of supply voltages at the bin locations and the determined temperature at the set of temperature sensors; and determining operational voltage bounds for the IC as a function of the determined temperature at the set of temperature sensors.

Abstract: Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively.

Abstract: Various embodiments include approaches for controlling a supply voltage or a clock frequency to an integrated circuit (IC). Various additional embodiments include circuitry for controlling a supply voltage or a clock frequency of an IC. In some cases, a method includes: locating a set of temperature sensors on bin locations in an IC; determining temperature bounds of the bin locations in the IC as a function of a determined temperature at the set of temperature sensors; determining timing constraints as a function of supply voltages at the bin locations and the determined temperature at the set of temperature sensors; and determining operational voltage bounds for the IC as a function of the determined temperature at the set of temperature sensors.

Abstract: Systems and methods for avoiding restrictions on cell placement in a hierarchical design of integrated circuits with multi-patterning requirements are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to assign a color to each pattern shape in a first cell, assign a color to each pattern shape in a second cell, characterize quantities of interest for each pattern shape in the first cell, determine that the colors assigned in the first cell are all one to one mappable to the colors assigned in the second cells, characterize quantities of interest for each pattern shape in the second cell using the quantities of interest characterized for the first cell, and model the quantities of interest for the first cell and the second cell.

Abstract: Systems and methods for accommodating correlated parameters in SSTA are provided. The method includes determining a correlation between at least two parameters. The method further includes calculating a new parameter or a new parameter set based on the correlation between the at least two parameters. The method further includes performing the SSTA such that the new parameter or the new parameter set is propagated into the SSTA. The method further includes projecting slack using the correlation between the at least two parameters and using a processor.

Abstract: Systems and methods for performing static timing analysis during IC design. A method is provided that includes obtaining canonical input data. The method further includes calculating at least one input condition identifier based on the canonical input data. The method further includes comparing the at least one input condition identifier to a table of values. The method further includes that when a match exists between the at least one input condition identifier and at least one value within the table of values, retrieving previously calculated timing data associated with the at least one value, and applying the previously calculated timing data in a timing model for a design under timing analysis.

Abstract: Systems and methods for selective voltage binning within a three-dimensional integrated chip stack. A method is provided that includes defining a correlation between at least two parameters. At least one parameter of the at least two parameters is from a first chip of a three-dimensional integrated chip stack and at least one parameter of the at least two parameters is from a second chip of the three-dimensional integrated chip stack. The method further includes generating a covariance matrix based on the at least two parameters. The method further includes calculating a new parameter or new parameter set using the covariance matrix. The method further includes performing statistical static timing analysis (SSTA) such that the new parameter or the new parameter set is propagated into the SSTA. The method further includes determining whether timing targets for the three-dimensional integrated chip stack are achieved.

Abstract: Systems and methods for avoiding restrictions on cell placement in a hierarchical design of integrated circuits with multi-patterning requirements are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to assign a color to each pattern shape in a first cell, assign a color to each pattern shape in a second cell, characterize quantities of interest for each pattern shape in the first cell, determine that the colors assigned in the first cell are all one to one mappable to the colors assigned in the second cells, characterize quantities of interest for each pattern shape in the second cell using the quantities of interest characterized for the first cell, and model the quantities of interest for the first cell and the second cell.

Abstract: A method of optimizing power and timing for an integrated circuit (IC) chip, which uses an IC technology that exhibits temperature inversion, by modifying a voltage supplied to the IC chip, while meeting power consumption and timing delay performances across lower and higher temperature ranges. A high voltage is selected that meets a closed timing analysis across a full temperature range to meet a timing performance and a low voltage is selected to meet the timing performance and the power performance across a lower temperature range to a temperature cut point in the higher temperature range. The IC chip is turned on at the high voltage and the high voltage is lowered to the low voltage when the temperature cut point is exceeded to meet the power performance while maintaining the timing performance.

Abstract: A method of optimizing power and timing for an integrated circuit (IC) chip, identifies a plurality of valid temperature and voltage combinations that allow integrated circuit chips produced according to the integrated circuit chip design to operate within average power consumption goals and timing delay goals. Such a method selects temperature cut points from the valid temperature and voltage combinations for each of the integrated circuit chips, calculates a power consumption amount of each of the temperature cut points, and adjusts the temperature cut points based on the power consumption amount until the temperature cut points achieve the average power consumption goals. Next, this method tests each of the integrated circuit chips, and records the temperature cut points in the memory of the integrated circuit chips.

Abstract: Methods determine temperature and voltage relationships for integrated circuit library elements to produce a continuous temperature-voltage function. Some of the library elements can be used or combined to form an integrated circuit design. Further, the performance characteristics for integrated circuit chips produced according to the integrated circuit design can be defined, such performance characteristics include an operating temperature range, etc. The continuous temperature-voltage function is applied to the performance characteristics to determine a plurality of temperature/voltage combinations for the integrated circuit chips. Each of the temperature/voltage combinations comprises an operating voltage for each operating temperature within the operating temperature range of the integrated circuit chips. Next, the integrated circuit chips are produced according to the integrated circuit design. The temperature/voltage combinations are recorded in memory of the integrated circuit chips.

Abstract: Systems and methods for performing static timing analysis during IC design. A method is provided that includes obtaining canonical input data. The method further includes calculating at least one input condition identifier based on the canonical input data. The method further includes comparing the at least one input condition identifier to a table of values. The method further includes that when a match exists between the at least one input condition identifier and at least one value within the table of values, retrieving previously calculated timing data associated with the at least one value, and applying the previously calculated timing data in a timing model for a design under timing analysis.

Abstract: Systems and methods for accommodating correlated parameters in SSTA are provided. The method includes determining a correlation between at least two parameters. The method further includes calculating a new parameter or a new parameter set based on the correlation between the at least two parameters. The method further includes performing the SSTA such that the new parameter or the new parameter set is propagated into the SSTA. The method further includes projecting slack using the correlation between the at least two parameters and using a processor.

Abstract: Systems and methods for selective voltage binning within a three-dimensional integrated chip stack. A method is provided that includes defining a correlation between at least two parameters. At least one parameter of the at least two parameters is from a first chip of a three-dimensional integrated chip stack and at least one parameter of the at least two parameters is from a second chip of the three-dimensional integrated chip stack. The method further includes generating a covariance matrix based on the at least two parameters. The method further includes calculating a new parameter or new parameter set using the covariance matrix. The method further includes performing statistical static timing analysis (SSTA) such that the new parameter or the new parameter set is propagated into the SSTA. The method further includes determining whether timing targets for the three-dimensional integrated chip stack are achieved.

Abstract: Systems and methods for modeling multi-patterning variability with statistical timing analysis during IC fabrication are described. The method may be provided implemented in a computer infrastructure having computer executable code tangibly embodied on a computer readable storage medium having programming instructions operable to define at least one source of variation in an integrated circuit design. The programming instructions further operable to model the at least one source of variation for at least two patterns in at least one level of the integrated circuit design as at least two sources of variability respectively.

Abstract: Methods determine temperature and voltage relationships for integrated circuit library elements to produce a continuous temperature-voltage function. Some of the library elements can be used or combined to form an integrated circuit design. Further, the performance characteristics for integrated circuit chips produced according to the integrated circuit design can be defined, such performance characteristics include an operating temperature range, etc. The continuous temperature-voltage function is applied to the performance characteristics to determine a plurality of temperature/voltage combinations for the integrated circuit chips. Each of the temperature/voltage combinations comprises an operating voltage for each operating temperature within the operating temperature range of the integrated circuit chips. Next, the integrated circuit chips are produced according to the integrated circuit design. The temperature/voltage combinations are recorded in memory of the integrated circuit chips.