Patents by Inventor Fei Yu

Fei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11909134
    Abstract: An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.
    Type: Grant
    Filed: March 24, 2023
    Date of Patent: February 20, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Fei Yu, Shiping Cheng
  • Publication number: 20240056677
    Abstract: An electronic device and methods are provided for co-photographing. In the course of a video call, video content associated with two users can be obtained, and a co-photographing image or a co-photographing video of the content of the two users can be further obtained. During the video call, the two users can exchange co-photographing details. After the video call ends, the co-photographing video can be quickly generated. User experience can be improved by reducing post-processing activity and improving definition of synthesized imagery or synthesized video.
    Type: Application
    Filed: January 17, 2022
    Publication date: February 15, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Lanhao Chen, Shikun Xu, Fei Yu, Qingji Meng, Zhongling Chen
  • Publication number: 20240044831
    Abstract: A glucose electrochemical sensor based on a hydrogel of a cationic redox polymer containing a transition metal complex medium, and a preparation method thereof. A sensing layer of the glucose electrochemical sensor comprises a cationic redox polymer containing a transition metal complex medium, glucose oxidase, and a crosslinking agent. The glucose electrochemical sensor can specifically measure glucose, and the linear correlation coefficient between a stable current signal of the glucose electrochemical sensor and the glucose concentration is high. The influence of interfering substances on glucose measurement can be eliminated, and the influence of oxygen concentration in a solution on glucose measurement can also be eliminated.
    Type: Application
    Filed: August 18, 2021
    Publication date: February 8, 2024
    Applicant: MicroTech Medical (Hangzhou) Co., Ltd.
    Inventors: Yuhui LU, Fei YU
  • Publication number: 20240045651
    Abstract: An audio output method is applied to an electronic device and includes: receiving audio output requests from M audio applications on the electronic device; selecting N target applications from the M audio applications; and outputting audio data of the N target applications, where M is greater than N. In this application, a quantity of target applications is limited.
    Type: Application
    Filed: October 23, 2023
    Publication date: February 8, 2024
    Inventors: Aofei Wang, Fei Yu, Yajun Fan
  • Publication number: 20240021693
    Abstract: A semiconductor device a method of forming the same are provided. The method includes forming a fin extending from a substrate and forming a gate dielectric layer along a top surface and sidewalls of the fin. A first thickness of the gate dielectric layer along the top surface of the fin is greater than a second thickness of the gate dielectric layer along the sidewalls of the fin.
    Type: Application
    Filed: August 8, 2023
    Publication date: January 18, 2024
    Inventors: Kuei-Lun Lin, Yen-Fu Chen, Po-Ting Lin, Chia-Yuan Chang, Xiong-Fei Yu, Chi On Chui
  • Patent number: 11862468
    Abstract: In an embodiment, a method includes: depositing a gate dielectric layer on a first fin and a second fin, the first fin and the second fin extending away from a substrate in a first direction, a distance between the first fin and the second fin decreasing along the first direction; depositing a sacrificial layer on the gate dielectric layer by exposing the gate dielectric layer to a self-limiting source precursor and a self-reacting source precursor, the self-limiting source precursor reacting to form an initial layer of a material of the sacrificial layer, the self-reacting source precursor reacting to form a main layer of the material of the sacrificial layer; annealing the gate dielectric layer while the sacrificial layer covers the gate dielectric layer; after annealing the gate dielectric layer, removing the sacrificial layer; and after removing the sacrificial layer, forming a gate electrode layer on the gate dielectric layer.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: January 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuei-Lun Lin, Chia-Wei Hsu, Xiong-Fei Yu, Chi On Chui, Chih-Yu Hsu, Jian-Hao Chen
  • Publication number: 20230405695
    Abstract: The invention discloses an abrasive belt clamp holder used with scroll saw and using method, and belongs to the technical field of scroll saws. An abrasive belt clamp holder used with scroll saw comprising a pin-free saw blade, wherein a clamp holder main body is connected to each of two ends of the pin-free saw blade, a placement groove matching the pin-free saw blade is provided in an outer wall of the clamp holder main body, a first bolt is movably connected to each of two sides of the outer wall of the clamp holder main body, the pin-free saw blade is disposed between two first bolts, a clamping plate is detachably connected to the top of the clamp holder main body, and an abrasive belt is connected between the clamping plate and the clamp holder main body.
    Type: Application
    Filed: August 28, 2023
    Publication date: December 21, 2023
    Inventors: Fei YU, Xuguang JING, Liyi SUN, Huili YANG, Jian SUN, Jingde WANG, Jialing LIU
  • Patent number: 11844598
    Abstract: Electrochemical Impedance Spectroscopy (EIS) is used in conjunction with continuous glucose monitors and continuous glucose monitoring (CGM) to enable in-vivo sensor calibration, gross (sensor) failure analysis, and intelligent sensor diagnostics and fault detection. An equivalent circuit model is defined, and circuit elements are used to characterize sensor behavior.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: December 19, 2023
    Assignee: Medtronic MiniMed, Inc.
    Inventors: Andrea Varsavsky, Fei Yu, Michael E. Miller, Ning Yang
  • Publication number: 20230400650
    Abstract: An optical connector has a first connection end configured to fit with a peer adapter. The electrical connector has a second connection end configured to fit with the peer adapter. The first connection end and the second connection end have a same opening direction. In addition, the first connection end may slide along a plugging direction of the peer adapter relative to the second connection end. The first connection end is configured to be connected to the peer adapter before the second connection end. The optical connector is connected to the peer adapter before the electrical connector. This ensures that a channel for transmitting an optical signal is communicated before a channel for transmitting an electrical signal is communicated, thereby avoiding fiber burning and improving security and reliability of the opto-electronic adapter during use.
    Type: Application
    Filed: August 25, 2023
    Publication date: December 14, 2023
    Inventors: Zhongxing WANG, Bo YAN, Fei YU, Le LIU
  • Publication number: 20230372730
    Abstract: The present disclosure relates to the field of beauty instruments, and a skin care assembly are disclosed. The skin care assembly provided in the present disclosure includes a first cover, an electrode, and a cold compress component. The electrode is fixed on the first cover to discharge for a skin. The first cover is defined with a first opening, and the cold compress component is received in the first opening to contact and cool the skin during the electrode discharging for the skin. The electrode may provide a beauty effect to the skin by generating micro-current and radio frequency, and the cold compress component provides a suitable environment temperature for the skin, thus the beauty effect is improved.
    Type: Application
    Filed: August 1, 2023
    Publication date: November 23, 2023
    Inventors: FEI YU, YUPING PAN
  • Publication number: 20230377891
    Abstract: In an embodiment, a method includes: depositing a gate dielectric layer on a first fin and a second fin, the first fin and the second fin extending away from a substrate in a first direction, a distance between the first fin and the second fin decreasing along the first direction; depositing a sacrificial layer on the gate dielectric layer by exposing the gate dielectric layer to a self-limiting source precursor and a self-reacting source precursor, the self-limiting source precursor reacting to form an initial layer of a material of the sacrificial layer, the self-reacting source precursor reacting to form a main layer of the material of the sacrificial layer; annealing the gate dielectric layer while the sacrificial layer covers the gate dielectric layer; after annealing the gate dielectric layer, removing the sacrificial layer; and after removing the sacrificial layer, forming a gate electrode layer on the gate dielectric layer.
    Type: Application
    Filed: August 1, 2023
    Publication date: November 23, 2023
    Inventors: Kuei-Lun Lin, Chia-Wei Hsu, Xiong-Fei Yu, Chi On Chui, Chih-Yu Hsu, Jian-Hao Chen
  • Publication number: 20230378294
    Abstract: A method includes providing first and second channel layers in NMOS and PMOS regions respectively of a substrate; depositing a first layer comprising hafnium oxide over the first and second channel layers; forming a first dipole pattern over the second channel layer and not over the first channel layer; driving a first metal from the first dipole pattern into the first layer by annealing; removing the first dipole pattern; depositing a second layer comprising hafnium oxide over the first layer and over the first and second channel layers; forming a second dipole pattern over the second layer and the first channel layer and not over the second channel layer; driving a second metal from the second dipole pattern into the second layer by annealing; removing the second dipole pattern; and depositing a third layer comprising hafnium oxide over the second layer and over the first and the second channel layers.
    Type: Application
    Filed: August 7, 2023
    Publication date: November 23, 2023
    Inventors: Chia-Yuan Chang, Te-Yang Lai, Kuei-Lun Lin, Xiong-Fei Yu, Chi On Chui, Tsung-Da Lin, Cheng-Hao Hou
  • Patent number: 11818074
    Abstract: The present invention relates to a method for estimating clock frequency offsets of industrial wireless sensor networks based on timing response. In the method, a data packet is sent from a node to be synchronized to a reference node. After the reference node receives the data packet, it replies an acknowledgement after a timing response interval, which is mapped according to a sequence number of the data packet. After communication and interaction for multiple times, a relative frequency offset and a fixed delay between node clocks can be estimated by the node to be synchronized without exchanging timestamp information. The present invention does not need to receive or send messages specially used for time synchronization parameter estimation, which realizes a long-term tracking of clock frequency offset with a low computation cost and reduces communication overhead and energy consumption.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: November 14, 2023
    Assignee: Chongqing University Of Posts And Telecommunications
    Inventors: Heng Wang, Yang Zhong, Fei Yu
  • Patent number: 11807756
    Abstract: A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: November 7, 2023
    Assignee: ELITE MATERIAL CO., LTD.
    Inventors: Yi-Fei Yu, Ching-Huan Lee, Chen-Yu Hsieh
  • Patent number: 11786656
    Abstract: A cloud big data-based system and method for insulin pump individualized configuration optimization are provided. The system includes an insulin pump, a real-time continuous glucose monitoring system, a smart phone, a glucose monitoring application software installed in the smart phone and a cloud big data server. By means of personal blood glucose measurement historical data of users stored in the cloud, the insulin pump individualized configuration optimization system provides effective calculation of an individualized optimal insulin injection volume and injection rate for each user, thus aiding physicians and patients to formulate diabetes treatment plans with increased effectiveness.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: October 17, 2023
    Assignee: MICROTECH MEDICAL (HANGZHOU) CO., LTD.
    Inventors: Fei Yu, Zhiyan Chen, Jianfeng Lv
  • Patent number: 11782554
    Abstract: An electronic device obtains an included angle between a touchscreen (a curved screen with a radian on a side edge) and a horizontal plane; starts a camera in response to the included angle between the touchscreen and the horizontal plane falling within a first preset angle range; obtains a distance between the electronic device and a user and a face yaw degree of the user in response to the camera collecting a face image; and performs anti-mistouch processing on a preset mistouch operation of the user on the touchscreen in response to the distance between the electronic device and the user being less than a first distance threshold and the face yaw degree falling within a second preset angle range.
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: October 10, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Lanhao Chen, Shikun Xu, Jianwei Cui, Fei Yu
  • Patent number: 11784642
    Abstract: The present disclosure provides a touch circuit, a touch panel and a display device. The touch circuit includes: a plurality of touch signal lines electrically connected with a control circuit, a voltage signal line for providing a preset voltage, and a plurality of switching circuits in one to one correspondence with the touch signal lines, wherein each switching circuit of the plurality of the switching circuits is electrically connected with the corresponding touch signal line and the voltage signal line, the switching circuit is configured to be in an off state under a condition that a voltage value on the corresponding touch signal line is within a preset range, and is also configured to be in an on state under a condition that the voltage value on the corresponding touch signal line is not within the preset range.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: October 10, 2023
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Erlong Song, Fei Yu, Huijie Meng, Bo Wei, Hongjun Zhou, Lili Du
  • Publication number: 20230299515
    Abstract: An edge connector includes a first row of golden fingers and a second row of golden fingers. The first row of golden fingers is adjacent to a plugging end of the edge connector, and the second row of golden fingers is adjacent to the first row of golden fingers. In a plugging direction of the edge connector, each golden finger in the first row of golden fingers has a first end proximate to the plugging end and a second end opposite to the first end. A first end of a grounded golden finger in the first row of golden fingers is protruded from other golden fingers, and second ends of two or more than two golden fingers in the first row of golden fingers are not aligned with each other.
    Type: Application
    Filed: March 24, 2023
    Publication date: September 21, 2023
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Fei Yu, Shiping Cheng
  • Patent number: 11756832
    Abstract: A method includes depositing a high-k gate dielectric layer over and along sidewalls of a semiconductor fin. The method further includes depositing an n-type work function metal layer over the high-k gate dielectric layer and performing a passivation treatment on the high-k gate dielectric layer through the n-type work function metal layer. The passivation treatment comprises a remote plasma process. The method further includes depositing a fill metal over the n-type work function metal layer to form a metal gate stack over the high-k gate dielectric layer. The metal gate stack comprising the n-type work function metal layer and the fill metal.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: September 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pei Ying Lai, Chia-Wei Hsu, Cheng-Hao Hou, Xiong-Fei Yu, Chi On Chui
  • Publication number: 20230282494
    Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.
    Type: Application
    Filed: May 15, 2023
    Publication date: September 7, 2023
    Inventors: Cheng-Fei YU, Chang-Chen Tsao, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai