Abstract: A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.

Abstract: A multi-layer cooling structure comprising a first substrate layer comprising an array of cooling channels, a second substrate layer comprising a nozzle structure that includes one or more nozzles, an outlet, and an outlet manifold, a third substrate layer comprising an inlet manifold and an inlet, and one or more TSVs disposed through the first substrate layer, second substrate layer, and third substrate layer. At least one of the one or more TSVs is metallized. The first substrate layer and the second substrate layer are directly bonded, and the second substrate layer and the third substrate layer are directly bonded.

Abstract: There are provided compounds of Formula I, and pharmaceutically acceptable salts and esters thereof, and pharmaceutical compositions thereof, used for inhibition or modulation of the activity of cyclin dependent kinases (CDK) and/or glycogen synthase kinase-3 (GSK-3), for the treatment of disease states or conditions mediated by cyclin dependent kinases and/or glycogen synthase kinase-3, including cancers.

Abstract: A shockproof nut kit includes an upper nut and a lower nut, in which an end surface of the upper nut is provided with a boss of elliptic cylinder; on the upper end surface of the elliptic cylinder at a longer planar extension side is provided an unfilled corner; in an end surface of the lower nut is concavely formed a cylindrical groove matching with the boss of elliptic cylinder, and in the assembly state, the boss of elliptic cylinder on the upper nut is in clearance fit with the cylindrical groove in the lower nut. The present invention avoids the slipping and displacement of nuts in the meshing process, and ensures the coaxiality of the upper and lower nuts during installation to the utmost. In terms of both safety and shockproof, the present invention achieves satisfactory results, the installation thereof is convenient and reliable, and the disassembly thereof is simple.

Abstract: A circuit board assembly includes a printed circuit board (PCB) substrate, a cooling assembly, an intermediate layer, one or more power devices, and a plurality of conductive layers arranged within the PCB substrate. The PCB substrate has a first surface and an opposite second surface that has a first electrical pattern. The cooling assembly is thermally coupled to the second surface of the PCB substrate. The intermediate layer is sandwiched between the PCB substrate and the cooling assembly. The one or more power devices are embedded within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices and thermally couple the one or more power devices to the cooling assembly. At least a portion of the intermediate layer has a second electrical pattern that is similarly patterned to the first electrical pattern of the second surface of the PCB substrate.

Abstract: Memory cells formed on upwardly extending fins of a semiconductor substrate, each including source and drain regions with a channel region therebetween, a floating gate extending along the channel region and wrapping around the fin, a word line gate extending along the channel region and wrapping around the fin, a control gate over the floating gate, and an erase gate over the source region. The control gates are a continuous conductive strip of material. First and second fins are spaced apart by a first distance. Third and fourth fins are spaced apart by a second distance. The second and third fins are spaced apart by a third distance greater than the first and second distances. The continuous strip includes a portion disposed between the second and third fins, but no portion of the continuous strip is disposed between the first and second fins nor between the third and fourth fins.

Abstract: A method for data management is provided. The method comprises: storing the plurality of items in a contiguous space within the memory, executing an instruction containing an address and a size that together identify the contiguous space to transmit the plurality of items from the main memory to a random-access memory (RAM) on a chip, and the chip includes a computing unit comprising a plurality of multipliers; and instructing the computing unit on the chip to: retrieve multiple of the plurality of items from the RAM; and perform a plurality of parallel operations using the plurality of multipliers with the multiple items to yield output data.

Abstract: A method for data management is provided. The method comprises: storing the plurality of items in a contiguous space within the memory, executing an instruction containing an address and a size that together identify the contiguous space to transmit the plurality of items from the main memory to a random-access memory (RAM) on a chip, and the chip includes a computing unit comprising a plurality of multipliers; and instructing the computing unit on the chip to: retrieve multiple of the plurality of items from the RAM; and perform a plurality of parallel operations using the plurality of multipliers with the multiple items to yield output data.

Abstract: The present invention relates to the technical field of biomedicine, particularly to a pyridine sulfonamide phosphate compound, a preparation method therefor, and a use thereof. The invention provides the following technical benefits: the pyridine sulfonamide phosphate compound has characteristics of high solubility, high stability, ease of being made into preparations, etc., which is easy to be industrially scaled up for medical use.

Abstract: The invention relates to modulators of Embryonic Ectoderm Development (EED) and/or Polycomb Repressive Complex 2 (PRC2) useful in the treatment of disorders and diseases associated with EEC and PRC2, being macrocyclic azolopyridine derivatives and compositions thereof of Formula I: or a pharmaceutically acceptable salt, prodrug, solvate, hydrate, enantiomer, isomer, or tautomer thereof, wherein X1, X2, X3, A1, A2, Y, R1, R2, R3, and R4 are as described herein.

Abstract: A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.

Abstract: The present application discloses a processing station and a cleaning system. The cleaning system includes a processing station and a cleaning robot, the processing station for evacuating trash collected in the cleaning robot, and including a body formed with a sealing surface, a base located below the sealing surface and configured for supporting a trash cassette having an opening at a top, a suction mechanism and a filter, and an adjustment member connected the body with the base; the adjustment member urges the base to be vertically adjacent to the sealing surface to clamp the trash cassette between the base and the sealing surface, such that the opening edge of the trash cassette abuts against the sealing surface.

Abstract: The present invention relates to the technical field of biomedicine, particularly to a selective dihydropyrrolopyrimidine JAK2 inhibitor or a pharmaceutically acceptable salt thereof. Compared with the prior art, the pyrrolopyrimidine compounds, stereoisomers and pharmaceutically acceptable salts thereof provided by the present invention exhibit better inhibitory activity for Janus Kinase and significantly better selectivity for JAK2 inhibitory targets. In addition, the preferred compounds of the present invention exhibit good pharmacokinetic properties and have the potential to be developed as selective JAK2 inhibitors.

Abstract: The present invention relates to a preparation process for a Cu-based catalyst and use of the Cu-based catalyst as the dehydrogenation catalyst in producing a hydroxyketone compound such as acetoin. Said Cu-based catalyst shows a high the acetoin selectivity as the dehydrogenation catalyst for producing acetoin.

Abstract: A power device embedded PCB includes a printed circuit board having a first major surface separated by a thickness and opposite a second major surface and an embedded power device. The embedded power device may include a power semiconductor device, an electrically and thermally conductive substrate bonded to the power semiconductor device along a first surface of the electrically and thermally conductive substrate and bonded to an electrical insulation layer on a second surface of the electrically and thermally conductive substrate opposite the first surface and a thermally conductive substrate bonded to the electrical insulation layer on a surface opposite the bonded electrically and thermally conductive substrate. The power semiconductor device, the electrically and thermally conductive substrate, the electrical insulation layer, and the thermally conductive substrate are disposed within the printed circuit board.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system includes a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of each power device stack, and a flat heat pipe having a first end embedded in the PCB stack and a second end extending outside the PCB stack, the power device stack being coupled to the flat heat pipe.