Abstract: Methods, apparatuses and systems to provide for technology to that includes a plurality of transistors including first transistors and second transistors. The first transistors are disposed opposite the second transistors in a lateral direction with a first space between the first transistors and the second transistors in the lateral direction. A gate driver is electrically connected to the plurality of transistors to operate the plurality of transistors. The gate driver has a first portion disposed between the first transistors and the second transistors in the first space.

Abstract: A cold plate includes a first cooling surface comprising a first cooling structure bonded to an inner surface of the first cooling surface, a second cooling surface comprising a second cooling structure bonded to an inner surface of the second cooling surface, a manifold comprising an internal cavity defined by a first length, a first width, and a first height, and a flow divider defined by a second length, a second width, and a second height. The manifold is enclosed by the first cooling surface and the second cooling surface on opposing surfaces of the manifold separated by the first height. The flow divider is positioned within the internal cavity of the manifold. The flow divider supports and separates the first cooling structure and the second cooling structure by a portion of the second height of the flow divider.

Abstract: A configurable, double sided, manifold micro-channel cold plate includes a one or more manifold micro-channel cold plate cells. Each cold plate cell includes a manifold body, a manifold insert, a plurality of heat sinks, and a plurality of longitudinal openings configured for fluidic communication with the fluid channels. The manifold body has fluid channels to permit flow of a fluid coolant. The manifold insert has a plurality of manifold insert fluid channels, and is configured for receipt in the one of the modular body recesses. The heat sinks are configured for receipt in the modular body recesses, and include an impingement surface configured for fluidic communication with the manifold insert fluid channels, and a heat transfer surface for thermal communication with one or more heat generating devices.

Abstract: Disclosed are compounds of Formula (1), tautomers thereof, and pharmaceutically acceptable salts of the compounds or tautomers, wherein L, R1, R2, R3, R4 and R5 are defined in the specification. This disclosure also relates to materials and methods for preparing compounds of Formula (1), to pharmaceutical compositions which contain them, and to their use for treating diseases, disorders or conditions associated with MRGX2.

Abstract: Disclosed are an inter-core data processing method and system, a system on chip, and an electronic device. The method includes: a first core sends, by means of a command transmission module, to a second core a first command indicating that the first core is ready to perform a data processing operation corresponding to a target address; the second core acquires a mutex corresponding to the target address in response to the first command and returns a second command to the first core by means of the command transmission module; and the first core performs the data processing operation corresponding to the target address by means of a bus module in response to the second command.

Abstract: A package structure comprises a metal plate (20) where a slot is formed, a ceramic piece (60), and a metal heat sink (70) welded onto the back surface of the ceramic piece (60). The ceramic piece (60) and the metal heat sink (70) are vertically inserted into the slot and welded to the metal plate (20). A semiconductor and a matching circuit may be disposed on the metal heat sink (70). The ceramic piece (60) replaces a glass seal; metalized interconnection is provided inside the ceramic piece (60) for fabricating a metalized pattern having complex connection relations, and the electrical interconnection is more flexible. In the package structure, metalized wiring is carried out by using the ceramic piece. Compared with round lead machining, higher precision is achieved.

Abstract: Methods, apparatuses and systems provide for technology that includes a transistor assembly for a power electronics apparatus having a plurality of transistor pairs arranged in a common plane, where for each pair of transistors one transistor is flipped relative to the other transistor. The technology further includes a first lead frame arranged parallel to and electrically coupled to the first transistor in each transistor pair, a second lead frame coplanar to the first lead frame and arranged parallel to and electrically coupled to the second transistor in each transistor pair, and a plurality of output lead frames arranged coplanar to each other, where each respective output lead frame is arranged parallel to and electrically coupled to a respective one pair of the plurality of transistor pairs.

Abstract: The present disclosure relates to a backlight module, a display module and an assembling method thereof. The backlight module includes: a backplane; a fixing member fixedly connected to the backplane; and an insertion clamp including a mounting portion fixedly connected to the fixing member, and a clamping portion for clamping to a circuit board inserted between the fixing member and the insertion clamp.

Abstract: Embodiments described herein disclose a vapor chamber including a thermally-conductive evaporator wall, a thermally-conductive condenser wall and a volume therebetween defining a vapor core for transporting a vapor of a working fluid from the evaporator wall to the condenser wall. The outer surfaces of the evaporator wall and the condenser wall are configured to be in thermal contact with a plurality of heat sources and a heat sink respectively. The vapor chamber further includes a porous wick structure for holding and pumping the working fluid towards the plurality of heat sources. The wick structure comprises an evaporator-feeding wick having an inner surface in thermal contact with an inner surface of the evaporator wall. The evaporator-feeding wick comprises a first region having a higher permeability than at least a second region to form a permeability gradient, such that the working fluid has a uniform flow to the plurality of heat sources.

Abstract: A driver board assembly includes first and second substrates, one or more power device assemblies and a cooling manifold. At least one jet impingement assembly is formed on a first surface of the first substrate and includes an impingement receiving portion that is at least partially circumferentially surrounded by a plurality of fluid microchannels that extend radially from the impingement receiving portion along the first surface. The second substrate is bonded onto the first substrate. The second substrate surface has a recess. The plurality of receiving contours are etched within the first surface of the first substrate. The one or more power device assemblies are bonded into the recess of the second substrate. A first cooling surface of the cooling manifold is bonded to the first surface such that the first cooling surface bonds within the plurality of receiving contours within the first surface of the first substrate.

Abstract: A floor washing machine includes a handle assembly; a control unit provided at the handle assembly; a power supply unit electrically connected to the control unit; a rod assembly connected to the handle assembly; a base assembly connected to a lower portion of the rod assembly; a sweeping/scrubbing assembly provided at the base assembly and having a motor controlled by the control unit and a scrubbing roller to be driven into forward or reverse rotation by the motor; and a water supply assembly having a water outlet pipe, wherein the water outlet pipe has a water outlet opening and can be rotated in order to point the water outlet opening to a forward-of-roller direction or a rearward-of-roller direction of the sweeping/scrubbing assembly.

Abstract: An oscillator circuit includes a core stage having a voltage controlled oscillator arranged to output an output oscillation signal, and an input stage coupled to the output stage via an induction coupling, and arranged to receive an input oscillation signal; wherein the output oscillation signal includes an output oscillation frequency substantially equals to a multiplication of an input oscillation frequency of the input oscillation signal.

Abstract: Modular cooling assemblies are provided for simultaneously cooling both a power module and a vehicle motor. Each cooling assembly may include a first cooling structure defining at least one major surface in thermal communication with the vehicle motor. A second cooling structure may be provided, defining at least one major surface in thermal communication with a power module. An interlayer structure may be provided, configured to couple the first cooling structure to the second cooling structure. The first cooling structure, the second cooling structure, and the interlayer structure are positioned in a stacked arrangement and configured to provide a flow of coolant fluid from a fluid inlet defined in first cooling structure, through the interlayer structure, and to at least one heat sink feature of the second cooling structure. The coolant fluid is then directed through a fluid outlet defined in the second cooling structure.

Abstract: A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces.

Abstract: The present invention relates to a Cu-based catalyst, a preparation process thereof and its use as the dehydrogenation catalyst in producing a hydroxyketone compound such as acetoin. Said Cu-based catalyst contains copper, at least one auxiliary metal selected from metal of Group IIA, non-noble metal of Group VIII, metal of Group VIB, metal of Group VIIB, metal of Group IIB and lanthanide metal of periodic table of elements, and an alkali metal, and further contains at least one ketone additive selected from a ketone represented by formula (II) and a ketone represented by formula (II?). Said Cu-based catalyst shows a high the acetoin selectivity as the dehydrogenation catalyst for producing acetoin. R1-C(?O)—CH(OH)—R2??(II) R1-C(?O)—CH(?O)—R2??(II?) In formulae (II) and (II?), each group is defined as in the description.

Abstract: A motor stator anti-interference structure includes: a silicon steel sheet assembly, the silicon steel sheet assembly including multiple silicon steel sheets held between an insulation support assembly; a winding assembly wound on the silicon steel sheet assembly and the insulation support assembly; and a connection member inlaid in the silicon steel sheet assembly to contact all the silicon steel sheets. All the silicon steel sheets are connected to a grounding end of a circuit board through the connection member so as to increase contact area between the connection member and the silicon steel sheet assembly. The electromagnetic interference is conducted through the connection member to the grounding end of the circuit board.

Abstract: A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.

Abstract: A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. An embedded cooling system includes a PCB having a first major surface opposite a second major surface and power device stacks embedded within the PCB between the first major surface and the second major surface. Each power device stack includes a first substrate and a second substrate, and an electrical insulation layer disposed between the first substrate and the second substrate. The embedded cooling system further includes a power device coupled to the first substrate of each power device stack and heat pipes having a first end and a second end spaced a distance apart from the first end. The first end is embedded within the PCB substrate and the second end extends outside of the PCB substrate. The second substrate of the one or more power device stacks is coupled to the one or more heat pipes.

Abstract: Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.