Abstract: A cooling assembly includes a housing defining a fluid chamber, wick structures arranged on an interior surface of the fluid chamber such that one or more flow channels are present therebetween, and a divider. The divider includes an outer frame comprising a first side and a second side and one or more bridging supports extending between and connecting the first side and the second side of the outer frame. The one or more bridging supports are aligned with the one or more flow channels between the wick structures. Each one of the one or more bridging supports define a plurality of vapor flow paths extending therethrough. The one or more bridging supports further define a plurality of vapor spaces between the one or more bridging supports that are aligned with the wick structures. The plurality of vapor flow paths are fluidly coupled to the vapor spaces.

Abstract: The present invention relates to a Cu-based catalyst, a preparation process thereof and its use as the dehydrogenation catalyst in producing a hydroxyketone compound such as acetoin. Said Cu-based catalyst contains copper, at least one auxiliary metal selected from metal of Group IIA, non-noble metal of Group VIII, metal of Group VIB, metal of Group VIIB, metal of Group IIB and lanthanide metal of periodic table of elements, and an alkali metal, and further contains at least one ketone additive selected from a ketone represented by formula (II) and a ketone represented by formula (II?). Said Cu-based catalyst shows a high the acetoin selectivity as the dehydrogenation catalyst for producing acetoin. R1-C(?O)—CH(OH)—R2??(II) R1-C(?O)—CH(?O)—R2??(II?) In formulae (II) and (II?), each group is defined as in the description.

Abstract: A motor stator anti-interference structure includes: a silicon steel sheet assembly, the silicon steel sheet assembly including multiple silicon steel sheets held between an insulation support assembly; a winding assembly wound on the silicon steel sheet assembly and the insulation support assembly; and a connection member inlaid in the silicon steel sheet assembly to contact all the silicon steel sheets. All the silicon steel sheets are connected to a grounding end of a circuit board through the connection member so as to increase contact area between the connection member and the silicon steel sheet assembly. The electromagnetic interference is conducted through the connection member to the grounding end of the circuit board.

Abstract: A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.

Abstract: A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. An embedded cooling system includes a PCB having a first major surface opposite a second major surface and power device stacks embedded within the PCB between the first major surface and the second major surface. Each power device stack includes a first substrate and a second substrate, and an electrical insulation layer disposed between the first substrate and the second substrate. The embedded cooling system further includes a power device coupled to the first substrate of each power device stack and heat pipes having a first end and a second end spaced a distance apart from the first end. The first end is embedded within the PCB substrate and the second end extends outside of the PCB substrate. The second substrate of the one or more power device stacks is coupled to the one or more heat pipes.

Abstract: Systems and methods for providing heating and cooling to a cabin of an autonomous or semiautonomous electric vehicle. A system includes one or more autonomous or semiautonomous electric vehicle components generating thermal energy as a byproduct of operation, a radiator fluidly coupled to the one or more vehicle components and positioned downstream from the one or more vehicle components such that the radiator receives at least a portion of the thermal energy, a thermoelectric cooler thermally coupled to and located downstream from the radiator, and one or more bypass valves that control fluid flow from the radiator such that fluid flows directly to a cabin of the vehicle or flows through the thermoelectric cooler before flowing into the cabin.

Abstract: A method and an apparatus for generating vehicle damage information are provided. The method includes: acquiring a damage area image of a target vehicle; performing image segmentation on the damage area image to obtain a first suspected damage area; inputting the damage area image to a pre-trained detection model to obtain a second suspected damage area, the detection model being configured to detect a location of the suspected damage area in the image; determining a damage image feature based on the first suspected damage area and the second suspected damage area; and inputting the damage image feature to a pre-trained classification model to generate a damage type, the classification model being configured to characterize a corresponding relationship between the image feature and the damage type.

Abstract: A method of manufacturing a driver board assembly includes embedding one or more power device assemblies within a first PCB material layer, forming one or more cooling channels within a surface of the first PCB material layer such that the one more cooling channels extend proximate to the one or more power device assemblies, forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels, and bonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.

Abstract: A driver board assembly includes first and second substrates, one or more power device assemblies and a cooling manifold. At least one jet impingement assembly is formed on a first surface of the first substrate and includes an impingement receiving portion that is at least partially circumferentially surrounded by a plurality of fluid microchannels that extend radially from the impingement receiving portion along the first surface. The second substrate is bonded onto the first substrate. The second substrate surface has a recess. The plurality of receiving contours are etched within the first surface of the first substrate. The one or more power device assemblies are bonded into the recess of the second substrate. A first cooling surface of the cooling manifold is bonded to the first surface such that the first cooling surface bonds within the plurality of receiving contours within the first surface of the first substrate.

Abstract: A driver board assembly includes first and second substrates, one or more power device assemblies and a cooling manifold. At least one jet impingement assembly is formed on a first surface of the first substrate and includes an impingement receiving portion that is at least partially circumferentially surrounded by a plurality of fluid microchannels that extend radially from the impingement receiving portion along the first surface. The second substrate is bonded onto the first substrate. The second substrate surface has a recess. The plurality of receiving contours are etched within the first surface of the first substrate. The one or more power device assemblies are bonded into the recess of the second substrate. A first cooling surface of the cooling manifold is bonded to the first surface such that the first cooling surface bonds within the plurality of receiving contours within the first surface of the first substrate.

Abstract: Disclosed are a light module and a mobile terminal. The light module includes: a support body, substrate, and light-transmitting element. The support body has a light path channel. The substrate is connected to the support body, is located at one end of the light path channel, and has a light source located in the light path channel. The light-transmitting element is connected to the support body, to seal an opening at the other end of the light path channel. A side face of the light-transmitting element that faces the light source has first and second electrical contact points, and a photosensitive coating capable of converting light energy into electrical energy; the first and second electrical contact points are electrically connected by the photosensitive coating, and are configured to connect to a detection module, so that the detection module detects a voltage across the first and second electrical contact points.

Abstract: An oscillator circuit includes a core stage having a voltage controlled oscillator arranged to output an output oscillation signal, and an input stage coupled to the output stage via an induction coupling, and arranged to receive an input oscillation signal; wherein the output oscillation signal includes an output oscillation frequency substantially equals to a multiplication of an input oscillation frequency of the input oscillation signal.

Abstract: A driver board assembly includes a printed circuit board (PCB) substrate, one or more power devices embedded within the PCB substrate, and a plurality of conductive layers arranged within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.

Abstract: There are provided compounds of Formula I, and pharmaceutically acceptable salts and esters thereof, and pharmaceutical compositions thereof, used for inhibition or modulation of the activity of cyclin dependent kinases (CDK) and/or glycogen synthase kinase-3 (GSK-3), for the treatment of disease states or conditions mediated by cyclin dependent kinases and/or glycogen synthase kinase-3, including cancers.

Abstract: Methods, systems, and apparatuses for a power card for use in a vehicle. The power card includes an N lead frame and a P lead frame, each having a body portion and a terminal portion. The power card includes an O lead frame having a body portion and a cooling portion. The power card includes a first power device located between the body portion of the N lead frame and the body portion of the O lead frame. The power card includes a second power device located between the body portion of the O lead frame and the body portion of the P lead frame, the O lead frame configured to receive heat from the first power device and the second power device by the body portion of the O lead frame and transfer the heat to the cooling portion of the O lead frame for heat dissipation.

Abstract: The present application relates to the technical field of biological medicine, in particular to a torsemide phosphate prodrug, a preparation method and a composition thereof. The torsemide prodrug N-hydroxymethyl-torsemide phosphate, and/or a pharmaceutical salt thereof provided by the present application have a better solubility than torsemide, and have the advantage of high druggability.

Abstract: A power device embedded PCB includes a printed circuit board having a first major surface separated by a thickness and opposite a second major surface and an embedded power device. The embedded power device may include a power semiconductor device, an electrically and thermally conductive substrate bonded to the power semiconductor device along a first surface of the electrically and thermally conductive substrate and bonded to an electrical insulation layer on a second surface of the electrically and thermally conductive substrate opposite the first surface and a thermally conductive substrate bonded to the electrical insulation layer on a surface opposite the bonded electrically and thermally conductive substrate. The power semiconductor device, the electrically and thermally conductive substrate, the electrical insulation layer, and the thermally conductive substrate are disposed within the printed circuit board.

Abstract: A method for measuring dynamic movement of a joint, the method comprising the steps of: measuring relative rotation of the joint using pair of Inertia measurement units, each attached to the skin on either side of said joint; capturing a plurality ultrasound images of a bone proximate to a first of said IMU's; identifying markers on said bone; tracking displacement of the markers; correlating said displacement with the relative rotation of the joint, and so; measuring the dynamic movement of the joint.

Abstract: A shockproof nut kit includes an upper nut and a lower nut, in which an end surface of the upper nut is provided with a boss of elliptic cylinder; on the upper end surface of the elliptic cylinder at a longer planar extension side is provided an unfilled corner; in an end surface of the lower nut is concavely formed a cylindrical groove matching with the boss of elliptic cylinder, and in the assembly state, the boss of elliptic cylinder on the upper nut is in clearance fit with the cylindrical groove in the lower nut. The present invention avoids the slipping and displacement of nuts in the meshing process, and ensures the coaxiality of the upper and lower nuts during installation to the utmost. In terms of both safety and shockproof, the present invention achieves satisfactory results, the installation thereof is convenient and reliable, and the disassembly thereof is simple.