Abstract: A method of manufacturing a driver board assembly includes embedding one or more power device assemblies within a first PCB material layer, forming one or more cooling channels within a surface of the first PCB material layer such that the one more cooling channels extend proximate to the one or more power device assemblies, forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels, and bonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.

Abstract: A driver board assembly includes first and second substrates, one or more power device assemblies and a cooling manifold. At least one jet impingement assembly is formed on a first surface of the first substrate and includes an impingement receiving portion that is at least partially circumferentially surrounded by a plurality of fluid microchannels that extend radially from the impingement receiving portion along the first surface. The second substrate is bonded onto the first substrate. The second substrate surface has a recess. The plurality of receiving contours are etched within the first surface of the first substrate. The one or more power device assemblies are bonded into the recess of the second substrate. A first cooling surface of the cooling manifold is bonded to the first surface such that the first cooling surface bonds within the plurality of receiving contours within the first surface of the first substrate.

Abstract: A driver board assembly includes first and second substrates, one or more power device assemblies and a cooling manifold. At least one jet impingement assembly is formed on a first surface of the first substrate and includes an impingement receiving portion that is at least partially circumferentially surrounded by a plurality of fluid microchannels that extend radially from the impingement receiving portion along the first surface. The second substrate is bonded onto the first substrate. The second substrate surface has a recess. The plurality of receiving contours are etched within the first surface of the first substrate. The one or more power device assemblies are bonded into the recess of the second substrate. A first cooling surface of the cooling manifold is bonded to the first surface such that the first cooling surface bonds within the plurality of receiving contours within the first surface of the first substrate.

Abstract: Disclosed are a light module and a mobile terminal. The light module includes: a support body, substrate, and light-transmitting element. The support body has a light path channel. The substrate is connected to the support body, is located at one end of the light path channel, and has a light source located in the light path channel. The light-transmitting element is connected to the support body, to seal an opening at the other end of the light path channel. A side face of the light-transmitting element that faces the light source has first and second electrical contact points, and a photosensitive coating capable of converting light energy into electrical energy; the first and second electrical contact points are electrically connected by the photosensitive coating, and are configured to connect to a detection module, so that the detection module detects a voltage across the first and second electrical contact points.

Abstract: An oscillator circuit includes a core stage having a voltage controlled oscillator arranged to output an output oscillation signal, and an input stage coupled to the output stage via an induction coupling, and arranged to receive an input oscillation signal; wherein the output oscillation signal includes an output oscillation frequency substantially equals to a multiplication of an input oscillation frequency of the input oscillation signal.

Abstract: A driver board assembly includes a printed circuit board (PCB) substrate, one or more power devices embedded within the PCB substrate, and a plurality of conductive layers arranged within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.

Abstract: There are provided compounds of Formula I, and pharmaceutically acceptable salts and esters thereof, and pharmaceutical compositions thereof, used for inhibition or modulation of the activity of cyclin dependent kinases (CDK) and/or glycogen synthase kinase-3 (GSK-3), for the treatment of disease states or conditions mediated by cyclin dependent kinases and/or glycogen synthase kinase-3, including cancers.

Abstract: Methods, systems, and apparatuses for a power card for use in a vehicle. The power card includes an N lead frame and a P lead frame, each having a body portion and a terminal portion. The power card includes an O lead frame having a body portion and a cooling portion. The power card includes a first power device located between the body portion of the N lead frame and the body portion of the O lead frame. The power card includes a second power device located between the body portion of the O lead frame and the body portion of the P lead frame, the O lead frame configured to receive heat from the first power device and the second power device by the body portion of the O lead frame and transfer the heat to the cooling portion of the O lead frame for heat dissipation.

Abstract: The present application relates to the technical field of biological medicine, in particular to a torsemide phosphate prodrug, a preparation method and a composition thereof. The torsemide prodrug N-hydroxymethyl-torsemide phosphate, and/or a pharmaceutical salt thereof provided by the present application have a better solubility than torsemide, and have the advantage of high druggability.

Abstract: A power device embedded PCB includes a printed circuit board having a first major surface separated by a thickness and opposite a second major surface and an embedded power device. The embedded power device may include a power semiconductor device, an electrically and thermally conductive substrate bonded to the power semiconductor device along a first surface of the electrically and thermally conductive substrate and bonded to an electrical insulation layer on a second surface of the electrically and thermally conductive substrate opposite the first surface and a thermally conductive substrate bonded to the electrical insulation layer on a surface opposite the bonded electrically and thermally conductive substrate. The power semiconductor device, the electrically and thermally conductive substrate, the electrical insulation layer, and the thermally conductive substrate are disposed within the printed circuit board.

Abstract: A method for measuring dynamic movement of a joint, the method comprising the steps of: measuring relative rotation of the joint using pair of Inertia measurement units, each attached to the skin on either side of said joint; capturing a plurality ultrasound images of a bone proximate to a first of said IMU's; identifying markers on said bone; tracking displacement of the markers; correlating said displacement with the relative rotation of the joint, and so; measuring the dynamic movement of the joint.

Abstract: A shockproof nut kit includes an upper nut and a lower nut, in which an end surface of the upper nut is provided with a boss of elliptic cylinder; on the upper end surface of the elliptic cylinder at a longer planar extension side is provided an unfilled corner; in an end surface of the lower nut is concavely formed a cylindrical groove matching with the boss of elliptic cylinder, and in the assembly state, the boss of elliptic cylinder on the upper nut is in clearance fit with the cylindrical groove in the lower nut. The present invention avoids the slipping and displacement of nuts in the meshing process, and ensures the coaxiality of the upper and lower nuts during installation to the utmost. In terms of both safety and shockproof, the present invention achieves satisfactory results, the installation thereof is convenient and reliable, and the disassembly thereof is simple.

Abstract: Provided is an insulating coating device for an electric wire, including a pressing pipe. The pressing pipe includes two first pressing parts which are configured to divide the pressing pipe into two parts along a longitudinal cross section of the pressing pipe, an inner wall of the pressing pipe is provided with an air bag, and the air bag is provided with an air pipe joint which penetrates to an outside of the pressing pipe. In the insulating coating device for the electric wire, a self-curing insulating material is coated on joints of the electric wires, the air bag is used to squeeze the self-curing insulating material such that the self-curing insulating material is shaped and compacted, so that cavities generated in a coating process is reduced, and the self-curing insulating material is uniformly attached to the joints of the electric wires.

Abstract: Embodiments described herein a method for controlling operating frequency for a wireless power charging system. Specifically, a transmitter coil at a wireless power transmitter is driven under an operating frequency and an input voltage. Deadtime information at the wireless power receiver is received, from a wireless power receiver having a receiver coil that receives wireless power from the transmitter coil. A microcontroller then determines, based on the received deadtime information or the operating frequency, whether the operating frequency deviates from a target operating frequency range. Based on the determination, one or both of the operating frequency or the input voltage are adjusted thereby causing the operating frequency to fall within the target operating frequency range.

Abstract: A motor stator anti-interference structure includes: a silicon steel sheet assembly, the silicon steel sheet assembly including multiple silicon steel sheets held between an insulation support assembly; a winding assembly wound on the silicon steel sheet assembly and the insulation support assembly; and a connection member inlaid in the silicon steel sheet assembly to contact all the silicon steel sheets. All the silicon steel sheets are connected to a grounding end of a circuit board through the connection member so as to increase contact area between the connection member and the silicon steel sheet assembly. The electromagnetic interference is conducted through the connection member to the grounding end of the circuit board.

Abstract: The present disclosure relates to the technical field of cable processing, and discloses a method for processing a reaction force cone of a cable main insulating layer. The method includes: two ends of a cable are clamped through a clamping device, and the cable is enabled to pass through a cutting device; a cutting depth of the cutting device in a radial direction and a cutting position of the cutting device in an axial direction are adjusted; the cutting device is started, and the cable is cut by the cutting device to form the reaction force cone.

Abstract: An exercise device configured to obtain, from an exercise device server corresponding to the exercise device, user information correspponding to a user that uses the exercise device, wherein the user information has been entered and recorded by the user on an application client on a user terminal, has synchronized to an application server corresponding to the application client, and has sent from the application server to the exercise device server based on triggering by the application client, and process, based on the user information, a collected exercise parameter of the user to obtain exercise consumption data of the user.

Abstract: Provided is a device for processing an antistress cone of a main insulation layer of a cable. The device includes a support, a clamping unit, a cutting unit and an infeed unit. The clamping unit is mounted on the support and configured to clamp a cable. The cutting unit is slidably disposed on the support, capable of cutting the cable in the radial direction of the cable, and capable of performing feeding in the radial direction of the cable to adjust the cutting depth. The infeed unit is connected to and capable of driving the cutting unit and configured to drive the cutting unit to slide in the axial direction of the cable so that the cutting unit performs feeding and cutting in the axial direction of the cable.

Abstract: The present disclosure relates to the field of cable processing apparatus and discloses a cable radial cutting system and a reaction force cone processing apparatus with the cable radial cutting system. The cable radial cutting system includes a cutting bracket, a planetary gear set, a first driving piece and a second driving piece which are mounted on the cutting bracket, and a cutting tool driven by the planetary gear set to rotate and move radially, where the first driving piece and the second driving piece jointly drive the planetary gear set to rotate.

Abstract: A panel light has an isolated low voltage direct current auxiliary power supply audio interface. The LED panel light has a DC power supply supplying the LED panel light. The DC power supply dim control is formed on the DC power supply supplying the LED panel light. The DC power supply dim control is configured as an input that adjusts the voltage or current of the LED panel light. A DC isolator circuit is connected to the DC power supply dim control. A low-voltage and dim power supply is connected to the DC isolator circuit. The low-voltage and dim power supply has an audio interface connection. The audio interface connects to the audio interface connection. The audio interface connection has an audio interface positive 12 V line, an audio interface ground line, and an audio interface dim line. A sensor connects to the audio interface at a sensor output.