Abstract: A content addressable memory (CAM) includes first and second memory circuits and a comparison circuit. The first memory circuit includes first and second sets of transistors for the storage of first and second compare data. The second memory circuit includes first and second sets of transistors for the storage of enabling or disabling data. The comparison circuit includes first and second sets of comparison transistors which respectively provide for the comparison of the first and second compare data with first and second input data under the control of an output signal from the second memory circuit. The transistors of the first and second sets of transistors of the memory circuits each includes a transistor of a first conductivity type and a transistor of a second conductivity type. The transistors of the second conductivity type are formed on the same first active zone of the semiconductor substrate.

Abstract: An SRAM memory cell includes first and second inverters (14, 16) interconnected between first and second data nodes. Each inverter is formed from complementary MOS transistors (18, 20, 18?, 20?) connected in series between a DC voltage supply source and a grounding circuit (22). A circuit (28, 30) programs the MOS transistors by causing an irreversible degradation of a gate oxide layer of at least some of the transistors (18, 18?).

Abstract: An integrated circuit memory including at least two banks each provided with an array of storage elements having at least one redundancy column and each associated with specific sense amplifiers, a row of input/output buffer circuits common to the memory banks, and for each memory bank, a circuit for assigning the redundancy column to an input/output line connected to one of said buffers. The assigning can be performed, for a line of current rank, towards the columns of preceding rank and towards the columns of following rank.

Abstract: A DRAM including an array of storage elements arranged in lines and columns, and for each column: write means adapted to biasing at least a selected one of the elements to a charge level chosen from among a first predetermined high level and a second predetermined low level, combined with read circuitry adapted to determining whether the stored charge level is greater or smaller than a predetermined charge level; and isolation circuitry adapted to isolating the array from the read and/or write means, each column further including refreshment means, distinct from the read and write circuit, for increasing, beyond the first and second predetermined levels, the charge stored in a storage element.

Abstract: The multivibrator is protected against current or voltage spikes and includes a first data transfer port that receives, as input, multivibrator input data, and a first/master latch cell connected on the output side of the first transfer port. A second/slave latch cell is included, and a second data transfer port is placed between the first and second latch cells. Each latch cell includes a set of redundant data storage nodes. The transfer ports each circuits/devices for writing data separately into each storage node.

Abstract: Bit lines (BL0, BL0R, BL1, BL1R, . . . ) of a ROM memory array with differential detection reading are arranged within two overlaid metallization levels so as to increase the read reliability of binary values stored in the array. The ROM array is divided into matrix segments (100, 101, . . . ) aligned parallel to the bit lines. The bit lines are shifted horizontally and/or vertically within transition regions (T) located between the segments of matrix, by effecting circular permutations between the positions of the bit lines that are divided up into groups of four.

Abstract: A component of an integrated circuit comprises a first capacitor and a second capacitor series-connected between a first node and a second node of the component. This has application to logic circuits and bistable circuits, for example, SRAM type memories, flip-flop trigger circuits, etc.

Abstract: A RAM memory integrated circuit, in particular a SRAM memory integrated circuit, includes a matrix of memory cells that are arranged between two bit lines via two access transistors. The bit lines are intended in one case to be discharged and in the other case to be maintained at a high precharge potential during a read operation. The bit line of each column of the matrix that is intended to be maintained at the high precharge potential is produced in the form of at least two partial bit lines. The memory cells of each column are implanted in the form of groups of cells which are alternately connected to one or the other of the partial bit lines, respectively.

Abstract: A Content Addressable Memory (CAM) circuit includes memory cells preferably formed as two memory cells each having internal nodes. A compare circuit is operative with the memory cells. A common terminal (VPL) exists for the memory cells. Capacitors are added between the internal nodes of each of the memory cells and common terminal for memory cell stability.

Abstract: A memory circuit includes a plurality of storage cells (100) arranged in rows and columns thus forming a storage matrix. The storage cells (100) corresponding to the same bit line (21-23) are divided into several groups (60-61) of cells for the same column, these groups having their own biasing circuit (200) in order to act on the difference between the logic level low voltage and the substrate voltage of the link transistors. When a storage cell is not selected, the biasing circuit makes the voltage between source/drain and substrate equal to a negative voltage in order to minimize the leakage current. During a read operation, the substrate voltage and the source/drain voltage are brought back to the same level such that a maximum current will flow when the link transistor is conducting.

Abstract: A sense amplifier connected to first and second bit lines, comprising means for precharging said bit lines to a high voltage, means for connecting one or the other of the bit lines to a memory cell, said connection causing according to the state of the memory cell a maintaining of the bit line at the high voltage or a voltage reduction, first and second transistors respectively controlled by the first and second bit lines, and, in series with the first and second transistors, a controllable means for the current through the transistor controlled by the bit line connected to the memory cell to be greater than the current through the other transistor when the voltages of the two bit lines are at the high voltage.

Abstract: A memory cell is protected against current or voltage spikes. The cell includes a group of redundant data storage nodes for the storage of information in at least one pair of complementary nodes. The cell further includes circuitry for restoring information to its initial state following a current or voltage spike which modifies the information in one of the nodes of the pair using the information stored in the other node. The data storage nodes of each pair in the cell are implanted on opposite sides of an opposite conductivity type well from one another within a region of a substrate defining the boundaries of the memory cell.

Abstract: A multivibrator circuit includes a first data transfer port that receives, as input, multivibrator input data, a first, master, latch cell connected on the output side of the first transfer port, a second, slave, latch cell, and a second data transfer port placed between the first and second latch cells, each latch cell comprising a set of redundant data storage nodes. The transfer ports each include circuitry for writing data separately into each storage node.

Abstract: A multivibrator includes a first data transfer port that receives, as input, multivibrator input data. A first, master, latch cell is connected on the output side of the first transfer port. A second, slave, latch cell is connected thereto through a second data transfer port placed between the first and second latch cells. Each latch cell includes a set of redundant data storage nodes for storing information in at least one pair of complementary nodes and circuitry for restoring information in its initial state, after a current or voltage spike has modified the information in one of the nodes of the said pair, on the basis of the information stored in the other node. The nodes of each pair are implanted opposite one another in a zone of a substrate defining the latch cell.

Abstract: A bistable circuit includes a first inverter and a capacitive inversion circuit having one input coupled to an output of the first inverter. The capacitive inversion circuit includes a second inverter and a capacitive circuit parallel-coupled to the input and an output of the capacitive inversion circuit. The bistable circuit also includes a switch to isolate the output of the capacitive inversion circuit from an input of the first inverter when the switch receives an active validation signal or, if not, to couple the output of the capacitive inversion circuit to the input of the first inverter.

Abstract: An integrated dynamic random access memory element includes two cells for the storage of two respective bits. A source region and a drain region are included. Each cell comprises a field-effect transistor having a gate and an intermediate portion which extend between the source and drain regions. A channel is provided in the intermediate portion of the transistor for each cell. A polarization electrode is placed between the respective intermediate portions of the two transistors. This polarization electrode is capacitively coupled to the intermediate portion of each transistor and is used to store the first and second bits.

Abstract: A DRAM including an array of storage elements arranged in lines and columns, and for each column: write means adapted to biasing at least a selected one of the elements to a charge level chosen from among a first predetermined high level and a second predetermined low level, combined with read circuitry adapted to determining whether the stored charge level is greater or smaller than a predetermined charge level; and isolation circuitry adapted to isolating the array from the read and/or write means, each column further including refreshment means, distinct from the read and write circuit, for increasing, beyond the first and second predetermined levels, the charge stored in a storage element.

Abstract: An integrated circuit memory including at least two banks each provided with an array of storage elements having at least one redundancy column and each associated with specific sense amplifiers, a row of input/output buffer circuits common to the memory banks, and for each memory bank, a circuit for assigning the redundancy column to an input/output line connected to one of said buffers. The assigning can be performed, for a line of current rank, towards the columns of preceding rank and towards the columns of following rank.

Abstract: An SRAM memory cell includes first and second inverters (14, 16) interconnected between first and second data nodes. Each inverter is formed from complementary MOS transistors (18, 20, 18′, 20′) connected in series between a DC voltage supply source and a grounding circuit (22). A circuit (28, 30) programs the MOS transistors by causing an irreversible degradation of a gate oxide layer of at least some of the transistors (18, 18′).

Abstract: A sense amplifier connected to first and second bit lines, comprising means for precharging said bit lines to a high voltage, means for connecting one or the other of the bit lines to a memory cell, said connection causing according to the state of the memory cell a maintaining of the bit line at the high voltage or a voltage reduction, first and second transistors respectively controlled by the first and second bit lines, and, in series with the first and second transistors, a controllable means for the current through the transistor controlled by the bit line connected to the memory cell to be greater than the current through the other transistor when the voltages of the two bit lines are at the high voltage.