Abstract: A method of direct bonding comprising the following steps: supplying a first substrate and a second substrate, the first substrate being covered by a first hydrophilic surface and the second substrate being covered by a second hydrophilic surface, deposition of a specific molecule on the first hydrophilic surface and/or on the second hydrophilic surface, the specific molecule comprising a hydrophilic functional group and a basic functional group, separated by at least one atom, contacting the first hydrophilic surface with the second hydrophilic surface, whereby the two hydrophilic surfaces are bonded one with the other, and the first substrate and the second substrate are assembled, optionally, application of a bonding annealing heat treatment, preferably at a temperature less than or equal to 500° C.

Abstract: A device for regrowth of a thick structure lattice-matched with InP comprising: a Si substrate, an interface layer of SiO2 on the Si substrate, a bonding layer on the interface layer, said bonding layer being made of a III-V material consisting of an alloy of the AlGaInAs family, and a regrowth layer on the bonding layer, said regrowth layer being made of InP.

Abstract: A method for transferring an adhesive layer of thermoplastic polymer(s) from a first substrate to a second substrate including: depositing an antiadhesive layer on a first substrate, this layer being deposited on the periphery of the top face of said substrate, referred to as peripheral layer, thus providing on said top face a zone devoid of said layer, referred to as central zone; depositing an adhesive layer of thermoplastic polymer(s) on said central zone; depositing an antiadhesive layer on a second substrate, this layer being deposited on the top face of the second substrate excluding its periphery, said periphery being thus devoid of said antiadhesive layer; bonding the first substrate and the second substrate consisting of thermocompressing the top face of the first substrate onto the top face of the second substrate; removing the first substrate, whereby the second substrate remains, of which the top face is coated by the adhesive layer of thermoplastic polymer(s).

Abstract: A method for manufacturing a paved structure comprising: a) providing a vignetted structure comprising a rigid frame, vignettes bonded in a spaced manner on the rigid frame provided with an UV-sensitive adhesive film, b) bonding the vignettes to a support substrate through a mineral-based paste so as to form a stack, c) applying a pressure on the stack so that the mineral-based paste fills the space between the vignettes, d) insolating the UV-sensitive adhesive film, e) separating the rigid frame and the vignettes integral with the support substrate, and f) applying a thermal treatment so as to transform the mineral-based paste into a cohesive mineral material to obtain the paved structure.

Abstract: A manufacturing method of a structure intended for assembly with another structure by self-aligning bonding by hydrophilic contrast, including the following successive steps: a) definition of pads on the side of the first face of a first substrate; b) transfer of a second substrate on the side of the first face of the first substrate; c) formation on the sides and/or on a peripheral part of the upper face of the pads, of a material more hydrophobic than a material of the upper face of the pads; and d) removal of the second substrate.

Abstract: A method for manufacturing a multilayer structure by direct bonding between a first substrate and a second substrate includes the steps of: a) providing a first substrate and a second substrate respectively including a first bonding surface and a second bonding surface, b) bringing the first bonding surface and the second bonding surface into contact so as to create a direct bonding interface between the first substrate and the second substrate, c) disposing at least the direct bonding interface in a basic environment, and d) applying a thermal treatment at a temperature of between 20° C. and 350° C. so as to obtain the multilayer structure.

Abstract: A method for manufacturing a multilayer structure by direct bonding between a first substrate and a second substrate, the method including the steps of: providing a first substrate and a second substrate respectively including a first bonding surface and a second bonding surface, contacting the first bonding surface and the second bonding surface so as to create a direct bonding interface between the first substrate and the second substrate, placing at least the direct bonding interface in a cationic aqueous solution including deionized water and cationic species originating from at least one element of the first and/or of the second column of the periodic table of elements, and applying a heat treatment at a temperature comprised between 20° C. and 350° C. so as to obtain the multilayer structure.

Abstract: A direct bonding method between two substrates includes the steps of: providing a first substrate and a second substrate respectively including a first hydrophilic bonding surface and a second hydrophilic bonding surface; depositing on the first and/or on the second hydrophilic bonding surface a basic solution consisting of strong base molecules and deionized water; drying the first and/or the second hydrophilic bonding surface until a concentration with between approximately 109 atom/cm2 and 1015 atom/cm2 of cations resulting from the strong base molecules on the first and/or on the second hydrophilic bonding surface; contacting the first and the second hydrophilic bonding surface so as to obtain a spontaneous direct bonding and an assembly of the first substrate with the second substrate including a direct bonding interface.

Abstract: Temporary bonding method comprising the following steps: a) providing a stack comprising successively a substrate of interest, a thermoplastic adhesive and a first temporary substrate, b) positioning a second temporary substrate on the substrate of interest, the first temporary substrate and the second temporary substrate each having a surface area greater than the surface area of the substrate of interest, c) applying a heat treatment at a temperature greater than or equal to the glass transition temperature of the thermoplastic adhesive, by means of which the thermoplastic adhesive forms a lateral band around the substrate of interest and adheres to the first temporary substrate and to the second temporary substrate, d) removing the second temporary substrate, e) attaching the substrate of interest to a frame, by means of an adhesive sheet, f) removing the first temporary substrate and the thermoplastic adhesive.

Abstract: A method for bonding a first substrate to a second substrate, the first substrate including, prior to bonding, a support layer, the method including removing the support layer to free a first surface substrate, thereby forming an elastic nanotopology on the first surface; stripping the first surface with rare gas atoms or depositing a thin film of metal or semiconductor onto the first surface; thermocompression bonding the first substrate to the second substrate, the contact between the first substrate and the second substrate being made at the first surface and a second surface of the second substrate, this bonding being carried out using an atomic diffusion bonding technique or a surface activation bonding technique. The stripping or deposition and the bonding step are performed under ultra-high vacuum. The pressure is between 1 and 100 kN and the temperature is between 200° C. and 600° C. in the thermocompression bonding.

Abstract: A surface activated bonding method by ion or atom bombardment of a first surface of a first substrate to a second surface of a second substrate, the material of the first substrate at the first surface including at least two chemical species, one of which, called the species of interest, becomes depleted upon activation by ion or atom bombardment, the method including depositing a layer of the species of interest onto the first surface of the first substrate; activating the first surface by bombarding the first surface with an ion or atom beam so as to consume the entire previously deposited layer of species; and activating the second surface by bombarding the second surface with an ion or atom beam; and contacting the first surface of the first substrate with the second surface of the second substrate.

Abstract: A method of treatment of an electronic circuit including at a location at least one electrically-conductive test pad having a first exposed surface. The method includes the at least partial etching of the test pad from the first surface, and the forming on the electronic circuit of an interconnection level covering said location and including, on the side opposite to said location, a second planar surface adapted for the performing of a hybrid molecular bonding.

Abstract: Manufacturing a handle substrate includes: providing a support substrate having a receiving face; depositing an anti-adherent formulation including a first solvent over the receiving face of the support substrate so as to form a film; depositing a liquid formulation over a face of the film, before the complete evaporation of the first solvent, the liquid formulation being intended to form an adhesive layer; and evaporating the first solvent so as to obtain an anti-adherent film from the film in order to obtain the handle substrate and to obtain a bonding energy between the anti-adherent film and the adhesive layer lower than about 1.2 J/m2. The step of depositing of a liquid formulation is carried out when the face of the film has a water drop angle smaller than 65 degrees, so as to avoid any risk of dewetting of the liquid formulation.

Abstract: A method for transferring at least one chip, from a first support to a second support, includes forming, while the chip is assembled to the first support, an interlayer in the liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support and a solidification of the interlayer. Then, the chip is detached from the first support while maintaining the interlayer in the solid state.

Abstract: A method of preparation of a first surface of an electronic component, the first surface being intended to be bonded to another electronic component by a direct bonding and the first surface having previously been submitted to a surface treatment in an atmosphere including nitrogen, for example, a treatment in a nitrogen plasma or an ozone UV treatment, the preparation method including: placing into contact the first surface with an aqueous solution including at least 90% water, for a contacting duration longer than or equal to 30 minutes; and then drying the first surface.

Abstract: The invention relates to a method for fabricating a thermal detector (1), comprising the following steps: forming a first stack (10), comprising a thermal detector (20), a mineral sacrificial layer (15) and a thin encapsulation layer (16) having a lateral vent (17.1); forming a second stack (30), comprising a thin sealing layer (33) and a getter portion (34); eliminating the mineral sacrificial layer (15); assembling by direct bonding the thin sealing layer (33), brought into contact with the thin encapsulation layer (16) and blocking the lateral vent (17.1), the getter portion (34) being located in the lateral vent (17.1).

Abstract: A method of temporary bonding of an object having first and second opposite surfaces successively including bonding the object to a handle on the side of the first surface, bonding the object to a first adhesive film on the side of the second surface, bonding the first adhesive film to a second adhesive film on the side opposite to the object, and removing the handle from the object.

Abstract: A process for bonding chips to a substrate by direct bonding includes providing a support with which the chips are in contact, the chips in contact with the support being separate from one another. This bonding process also includes forming a liquid film on one face of the substrate, bringing the chips into contact with the liquid film, where the action of bringing the chips into contact with the liquid film causes attraction of the chips toward the substrate, and evaporating the liquid film in order to bond the chips to the substrate by direct bonding.

Abstract: A method for transferring a thin layer onto a destination substrate having a face with an adhesive layer includes formation of a polymer material interface layer on a second face of a thin layer, opposite a first face on which an adhesive is present. The method also includes assembly by gluing the interface layer and the adhesive layer and separation of the thin layer relative to a temporary support.

Abstract: A method includes transferring a layer onto a flexible substrate, the layer being located in a stack on the front face of the substrate. The substrate includes at least one supplementary stack interposed between the stack and the bulk layer of the substrate. This supplementary stack includes at least two layers with thicknesses decreasing in the direction of the front face. The method makes provision, after bonding the flexible substrate on the front face, for successively and gradually removing the various layers of the substrate. Such gradualness makes it possible to transfer a thin layer of silicon, with a thickness of less than 50 nm, onto a flexible substrate.