Abstract: A method of making a suspension of particles in a first fluid of a size suitable for responding to ultrasound, by forcing a second fluid (2) through an array of pores (30) into the first fluid (1), the pores being of substantially uniform diameter, and the pressure of the second fluid and a flow rate of the first fluid across the pores being arranged so that shear forces at the pores cause the second fluid to be suspended as substantially monodisperse particles in the first fluid. This can enable a more monodisperse suspension. The array of pores can be an etched silicon array. The suspension can be used as a contrast agent, or can be an emulsion to make droplets of a precursor material, which can be formed into capsules with a core and a shell. A liquid core can be converted to a gas to provide hollow shells.

Abstract: The present invention relates to an electronic device (300) comprising at least one trench capacitor (302) that can also take the form of an inverse structure, a pillar capacitor. An alternating layer sequence (308) of at least two dielectric layers (312, 316) and at least two electrically conductive layers (314, 318) is provided in the trench capacitor or on the pillar capacitor, such that the at least two electrically conductive layers are electrically isolated from each other and from the substrate by respective ones of the at least two dielectric layers. A set of internal contact pads (332, 334, 340) is provided, and each internal contact pad is connected with a respective one of the electrically conductive layers or with the substrate. By providing an individual internal contact pad for each of the electrically conductive layers, a range of switching opportunities is opened up that allows tuning the specific capacitance of the capacitor to a desired value.

Abstract: The present invention relates to a method for producing a substrate with at least one covered via that electrically and preferably also thermally connects a first substrate side with an opposite second substrate side. The processing involves forming a trench on a the first substrate side remains and covering the trench with a permanent layer on top of a temporary, sacrificial cap-layer, which is decomposed in a thermal process step. The method of the invention provides alternative ways to remove decomposition products of the sacrificial cap-layer material without remaining traces or contamination even in the presence of the permanent layer This is, according to a first aspect of the invention, achieved by providing the substrate trench with an overcoat layer that has holes. The holes in the overcoat layer leave room for the removal of the decomposition products of the cap-layer material.

Abstract: The invention relates to a method of manufacturing an electrochemical energy source comprising the steps of providing a first electrode that is at least partially formed by a conducting substrate, depositing a lithium ion solid-state electrolyte on the substrate; and depositing a second electrode on the substrate. The lithium ion solid-state electrolyte layer is obtained from a dual metal lithium alkoxide precursor Further an electrochemical energy source is disclosed as well as an electronic device provided with such an electrochemical energy source.

Abstract: A monolithically integrated optical network device (20). The device comprises: a bipolar transistor (10) realized in a silicon substrate (11) that can be biased into an avalanche condition to emit photons; and a photonic bandgap (PBG) structure (22) monolithically integrated with the bipolar transistor (10) to act as an optical wave guide (16) for the photons generated by the bipolar transistor (10).

Abstract: The electronic device comprises a network of at least one thin-film capacitor and at least one inductor on a first side of a substrate of a semiconductor material. The substrate has a resistivity sufficiently high to limit electrical losses of the inductor and being provided with an electrically insulating surface layer on its first side. A first and a second lateral pin diode are defined in the substrate, each of the pin diodes having a doped p-region, a doped n-region and an intermediate intrinsic region. The intrinsic region of the first pin diode is larger than that of the second pin diode.

Abstract: In the method, semiconductor substrates are etched to provide nanowires, said substrates comprising a first layer of a first material and a second layer of a second material with a mutual interface, which first and second materials are different. They may be different in the doping type. Alternatively, the main constituent of the material may be different, for example SiGe or SiC versus Si, or InP versus InAs. In the resulting nanowires, the interface is atomically sharp. The electronic devices having nanowires between a first and second electrode accordingly have very good electroluminescent and optoelectronic properties.

Abstract: The invention relates to an electrochemical energy source comprising at least one assembly of: a first electrode, a second electrode, and an intermediate solid-state electrolyte separating said first electrode and said second electrode. The invention also relates to an electronic module provided with such an electrochemical energy source. The invention further relates to an electronic device provided with such an electrochemical energy source. Moreover, the invention relates to a method of manufacturing such an electrochemical energy source.

Abstract: ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal remains attached to the carrier e.g. at the crossing of rows and columns. The separate crystals may contain TFTs (simple AM addressing) but also more complicated electronics (address of pixel in memory+identification).

Abstract: A semiconductor substrate comprises both vertical interconnects and vertical capacitors with a common dielectric layer. The substrate can be suitably combined with further devices to form an assembly. The substrate can be made in etching treatments including a first step on the one side, and then a second step on the other side of the substrate.

Abstract: In the method, semiconductor substrates are etched to provide nanowires, said substrates comprising a first layer of a first material and a second layer of a second material with a mutual interface, which first and second materials are different. They may be different in the doping type. Alternatively, the main constituent of the material may be different, for example SiGe or SiC versus Si, or InP versus InAs. In the resulting nanowires, the interface is atomically sharp. The electronic devices having nanowires between a first and second electrode accordingly have very good electroluminescent and optoelectronic properties.

Abstract: ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal remains attached to the carrier e.g. at the crossing of rows and columns. The separate crystals may contain TFTs (simple AM addressing) but also more complicated electronics (address of pixel in memory+identification).

Abstract: ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal remains attached to the carrier e.g. at the crossing of rows and columns. The separate crystals may contain TFTs (simple AM addressing) but also more complicated electronics (address of pixel in memory+identification).

Abstract: A robust Giant Magneto Resistive effect type multilayer sensor comprising a free and a pinned ferromagnetic layer, which can withstand high temperatures and strong magnetic fields as required in automotive applications. The GMR multi-layer has an asymmetric magneto-resistive curve and enables sensors with complementary output signals so that a Wheatstone bridge is possible. The improvement is obtained by a combination of measures including the use of a combination of an Artificial Anti Ferromagnet as the pinned layer and an IrMn exchange-biasing layer, the latter preferably arranged at the bottom of the layer stack on top of a buffer layer.

Abstract: ICs are attached to a carrier e.g. in a bus structure or at the crossing of rows and columns. The separate crystals may contain complicated electronics (address of pixel in memory+identification).

Abstract: ICs (20) are nearly separated from the semiconductor substrate (10) on/in which they are formed. Subsequently, the substrate is positioned upside down on a substrate (carrier) (3) which is provided with glue (21) at the location of a crystal. After attachment of the crystal to the carrier, the semiconductor substrate is removed and the crystal remains attached to the carrier e.g. at the crossing of rows and columns. The separate crystals may contain TFTs (simple AM addressing) but also more complicated electronics (address of pixel in memory+identification).

Abstract: Magnetic head having a head face (5) and comprising a head structure composed of thin layers and provided with a transducing element (E11), in which different materials occurring in different areas are present in the head face. The head face is provided with a first layer (31) of a material which is more sensitive to corrosion than other materials in the head face, and the first layer is provided with a second layer (33) of a wear-resistant material which is more insensitive to corrosion than the material of the first layer. The second layer constitutes a contact face (35) for cooperation with a magnetic tape (7).

Abstract: Magnetic head having a head face (5) and comprising a head structure composed of thin layers and provided with a transducing element (E11), in which different materials occurring in different areas are present in the head face. The head face is provided with a first layer (31) of a material which is more sensitive to corrosion than said materials in the head face, and the first layer is provided with a second layer (33) of a wear-resistant material which is more insensitive to corrosion than the material of the first layer. The second layer constitutes a contact face (35) for cooperation with a magnetic tape (7).

Abstract: A Method (1) for Rapid Thermal Processing of a wafer (7), wherein the wafer (7) is heated by lamps (9), and the heat radiation is reflected by an optical switching device (15,17) which is in the reflecting state during the heating stage. During the cooling stage of the wafer (7), the heat is absorbed by the switching device (15,17), which is in the heat-absorbing state. The switching device includes a switching film of a trivalent metal, such as gadolinium, which is capable of forming hydrides by an exchange of hydrogen. Dependent on the hydrogen concentration of the hydrides, the film reflects or absorbs heat. The hydrogen content in the switching film can be changed by varying the partial pressure of hydrogen, or, preferably, by varying the potential of the switching film forming part of a stack of layers in an electrochemical cell.

Abstract: A description is given of an optical switching device (1) comprising a transparent substrate (3), a switching film (5) of a hydride compound of a trivalent transition or rare earth metal having a thickness of 300 nm, and a palladium capping layer (7) having a thickness of 30 nm. The capping layer is in contact with hydrogen. An electric current through the switching film (5) can be switched on and off between the terminals (9, 11). Joule heating of the switching film (5) causes a rapid transition from the transparent trihydride state to the absorbing dihydride state. By switching off the current, the switching film (5) cools down, which results in the formation of the absorbing dihydride state. The conversion between both states is reversible and can be repeated many times. The device can be used for controlling light beams, or it can be used in or for a display. Optionally, cooling of the switching film (5) is obtained with a Peltier element in thermal contact with the switching film (5).