Abstract: An example of the invention provides an electronic device. The electronic device includes a camera module, a control unit and a computing unit. The control unit controls the camera module to acquire a first image and a second image. The computing unit receives the first image and the second image to generate a third image, wherein the resolution of the third image is greater than the resolution of the first image and the resolution of the second image.

Abstract: The present invention provides a semiconductor structure, including a base, a patterned oxide semiconductor (OS) layer, two source/drain regions, a protective layer, a gate layer and a gate dielectric layer. The patterned OS layer is disposed on the base. Two source/drain regions are disposed on the patterned OS layer and are separated by a recess. Each source/drain region includes an inner sidewall facing the recess and an outer sidewall opposite to the inner sidewall. The protective layer is disposed on a sidewall of the patterned OS layer but is not on the inner sidewall of the source/drain region. The gate layer is disposed on the patterned OS layer, and the gate dielectric layer is disposed between the gate layer and the patterned OS layer.

Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, a third bonding pad structure, a first internal bonding wire, and a second internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The third bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the third bonding pad structure via the first internal bonding wire. The third bonding pad structure is electrically coupled to the second bonding pad structure via the second internal bonding wire.

Abstract: A thermal chemical vapor deposition (CVD) system includes a bottom chamber, an upper chamber, a workpiece support, a heater and at least one shielding plate. The upper chamber is present over the bottom chamber. The upper chamber and the bottom chamber define a chamber space therebetween. The workpiece support is configured to support a workpiece in the chamber space. The heater is configured to apply heat to the workpiece. The shielding plate is configured to at least partially shield the bottom chamber from the heat.

Abstract: An integrated circuit device including a semiconductor substrate, a first bonding pad structure, a second bonding pad structure, and an internal bonding wire is provided. The first bonding pad structure is disposed on a surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The second bonding pad structure is disposed on the surface of the semiconductor substrate and exposed outside of the semiconductor substrate. The first bonding pad structure is electrically coupled to the second bonding pad structure via the internal bonding wire. The integrated circuit device having a better electrical performance is provided by eliminating internal resistance drop in power supply trails or ground trails, and improving signal integrity of the integrated circuit device.

Abstract: An optical fiber module rack system includes a rack including multiple accommodation chambers, opposing first and second sliding grooves located in each accommodation chamber, and a stop block located at each of opposing front and rear ends of each first sliding groove, and optical fiber storage boxes each including a box body mounted in one respective accommodation chamber, a first optical fiber module and second optical fiber module mounted in opposing front and rear sides of box body and connected together, two guide rails located at two opposite lateral sidewalls of box body and respectively coupled to first sliding groove and second sliding groove of respective accommodation chamber, two elastic retainer strips respectively extended from opposite ends of one guide rail and provided with a respective hook block for engagement with one respective stop block, and elongated press member extended from other guide rail for pressing by external force to disengage hook blocks from respective stop blocks for allo

Abstract: A semiconductor device and a method of fabricating the same, the semiconductor device includes a substrate, an interconnect structure, and an oxide semiconductor structure. The substrate has a first region and a second region. The interconnect structure is disposed on the substrate, in the first region. The oxide semiconductor structure is disposed over a hydrogen blocking layer, in the second region of the substrate.

Abstract: A semiconductor device and a method of fabricating the same, the semiconductor device includes a substrate, an interconnect structure, and an oxide semiconductor structure. The substrate has a first region and a second region. The interconnect structure is disposed on the substrate, in the first region. The oxide semiconductor structure is disposed over a hydrogen blocking layer, in the second region of the substrate.

Abstract: The present disclosure illustrates to a fiber module rack system in which a rack includes receiving spaces which each is formed by two frame plates of a base panel. Shell bodies of fiber optic cassettes are mounted in the receiving spaces, and a fiber module is disposed at a front part of the shell body, and a resilient locking member is disposed between the sliding track and at least one side of the shell body, so that the user can quickly and easily dismount the fiber optic cassettes from the rack without using tool.

Abstract: Embodiments of the present invention provide methods for optimizing a lithographic projection apparatus including optimizing projection optics therein. The current embodiments include several flows including optimizing a source, a mask, and the projection optics and various sequential and iterative optimization steps combining any of the projection optics, mask and source. The projection optics is sometimes broadly referred to as “lens”, and therefore the optimization process may be termed source mask lens optimization (SMLO). SMLO may be desirable over existing source mask optimization process (SMO) or other optimization processes that do not include projection optics optimization, partially because including the projection optics in the optimization may lead to a larger process window by introducing a plurality of adjustable characteristics of the projection optics.

Abstract: The present invention provides a semiconductor device and a method of forming the same, and the semiconductor device including a substrate, an oxide semiconductor layer, two source/drain regions, a high-k dielectric layer and a bottom oxide layer. The oxide semiconductor layer is disposed on a first insulating layer disposed on the substrate. The source/drain regions are disposed on the oxide semiconductor layer. The high-k dielectric layer covers the oxide semiconductor layer and the source structure and the drain regions. The bottom oxide layer is disposed between the high-k dielectric layer and the source/drain regions, wherein the bottom oxide layer covers the source/drain regions and the oxide semiconductor layer.

Abstract: An optical fiber module rack system includes a rack including multiple accommodation chambers, opposing first and second sliding grooves located in each accommodation chamber, and a stop block located at each of opposing front and rear ends of each first sliding groove, and optical fiber storage boxes each including a box body mounted in one respective accommodation chamber, a first optical fiber module and second optical fiber module mounted in opposing front and rear sides of box body and connected together, two guide rails located at two opposite lateral sidewalls of box body and respectively coupled to first sliding groove and second sliding groove of respective accommodation chamber, two elastic retainer strips respectively extended from opposite ends of one guide rail and provided with a respective hook block for engagement with one respective stop block, and elongated press member extended from other guide rail for pressing by external force to disengage hook blocks from respective stop blocks for allo

Abstract: A data storage apparatus has a transmission interface, a nonvolatile memory and a controller. The controller records a non-completed flag. When the controller starts a card opening process, the nonvolatile memory is configured under card opening, and the non-completed flag is set non-completed status. When the controller receives a format command form the transmission interface, the nonvolatile memory is formatted and the non-completed flag is set as completed status. When the controller receives a write command, the write data are scrambled before being written to the nonvolatile memory. When in non-completed status, when the controller receives a read command from the transmission interface, no matter whether the data corresponding to the requested address are scrambled, the data are descrambled and descrambled are provided via the transmission interface.

Abstract: A physiology sensing device and an intelligent textile are provided. The physiology sensing device includes a fabric substrate and a conductive coating layer. The conductive coating layer is embedded from a side of the fabric substrate and leveled with the fabric body, and a thickness of the conductive coating layer is not larger than a thickness of the fabric substrate. The conductive coating layer includes a hydrophobic adhesive and a plurality of conductive particles distributing therein. The physiology sensing device receives variation of a signal of body potential on skin surface. Then a long range signal receiver receives the signal, the signal is shown on a monitory system so as to perform long distance monitoring.

Abstract: A ceramic cathode material of a solid oxide fuel cell and a manufacturing method thereof are disclosed. The method includes mixing a lanthanum-containing compound, a cobalt-containing compound, a nickel-containing compound, and a copper-containing compound, for preparing the ceramic cathode material of the solid oxide fuel cell of intermediate/low type. The ceramic cathode material of the solid oxide fuel cell is LaCozNiyCuxO3??, in which x ranges from 0.01 to 0.3, y ranges from 0 to 0.89, and z ranges from 0.1 to 0.99. The ceramic cathode material manufactured by mixing the lanthanum-containing compound, the cobalt-containing compound, the nickel-containing compound, and the copper-containing compound when operating within the temperature range from 500 to 800 degrees Celsius is of high electrical conductivity and reduced thermal expansion coefficient.

Abstract: The present disclosure illustrates to a fiber module rack system in which a rack includes receiving spaces which each is formed by two frame plates of a base panel. Shell bodies of fiber optic cassettes are mounted in the receiving spaces, and a fiber module is disposed at a front part of the shell body, and a resilient locking member is disposed between the sliding track and at least one side of the shell body, so that the user can quickly and easily dismount the fiber optic cassettes from the rack without using tool.

Abstract: The present invention provides a semiconductor structure, including a base, a patterned oxide semiconductor (OS) layer, two source/drain regions, a protective layer, a gate layer and a gate dielectric layer. The patterned OS layer is disposed on the base. Two source/drain regions are disposed on the patterned OS layer and are separated by a recess. Each source/drain region includes an inner sidewall facing the recess and an outer sidewall opposite to the inner sidewall. The protective layer is disposed on a sidewall of the patterned OS layer but is not on the inner sidewall of the source/drain region. The gate layer is disposed on the patterned OS layer, and the gate dielectric layer is disposed between the gate layer and the patterned OS layer. The present invention further provides a method of forming the same.

Abstract: A method for fabricating semiconductor device is disclosed. The method includes the steps of: providing a substrate; forming a gate structure on the substrate; forming a lightly doped drain in the substrate; and performing a first implantation process for implanting fluorine ions at a tiled angle into the substrate and part of the gate structure.

Abstract: A touch-sensitive display device includes a substrate, an OLED structure and a cover plate. The OLED structure is disposed on the substrate and includes a first electrode layer, a light-emitting layer and a second electrode layer. The first electrode layer is disposed on the substrate, the light-emitting layer is disposed on the first electrode layer, and the second electrode layer is disposed on the light-emitting layer and patterned to form a plurality of touch-sensing electrodes. The cover plate is disposed opposite the substrate and spaced at an interval from the substrate, and the OLED structure is sealed between the substrate and the cover plate.

Abstract: An optical fiber module rack system includes a rack including multiple accommodation chambers, opposing first and second sliding grooves located in each accommodation chamber, and a stop block located at each of opposing front and rear ends of each first sliding groove, and optical fiber storage boxes each including a box body mounted in one respective accommodation chamber, a first optical fiber module and second optical fiber module mounted in opposing front and rear sides of box body and connected together, two guide rails located at two opposite lateral sidewalls of box body and respectively coupled to first sliding groove and second sliding groove of respective accommodation chamber, two elastic retainer strips respectively extended from opposite ends of one guide rail and provided with a respective hook block for engagement with one respective stop block, and elongated press member extended from other guide rail for pressing by external force to disengage hook blocks from respective stop blocks for allo