Patents by Inventor Fu Huang
Fu Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250248599Abstract: Provided is an otoscope that includes a sensing part. The sensing part includes a case, multiple light sources, and an optical sensing device. The optical sensing device is disposed in the case and sequentially includes a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element along an optical axis from an object side toward an image side. The first lens element, the third lens element and the fifth lens element have positive refracting power. The second lens element and the fourth lens element have refracting power. The otoscope has a total of five lens elements having refracting power, and the multiple light sources are configured to emit infrared light toward the object side.Type: ApplicationFiled: October 17, 2024Publication date: August 7, 2025Applicant: GUANGZHOU LUXVISIONS INNOVATION TECHNOLOGY LIMITEDInventors: Chih-Ju Lin, Chen-Fu Huang
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Publication number: 20250246488Abstract: A substrate circuit structure includes a substrate and a circuit layer. The substrate includes an active region and a peripheral region adjacent to the active region. The circuit layer is disposed on the substrate and includes an electrostatic test region disposed in at least one of the active region and the peripheral region. The electrostatic test region includes a first test pad and a second test pad. The first test pad corresponds to a first breakdown voltage. The second test pad is disposed adjacent to the first test pad and corresponds to a second breakdown voltage different from the first breakdown voltage.Type: ApplicationFiled: December 27, 2024Publication date: July 31, 2025Applicant: Innolux CorporationInventors: Shu-Ling Wu, Zhi-Fu Huang
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Publication number: 20250248126Abstract: A three dimensional semiconductor structure manufacturing method includes the following steps, providing a wafer, and the wafer includes a front side and a back side. A front side of the wafer is adhered to a supporting substrate, a photoresist layer is coated on the back side of the wafer, and the back side of the wafer is etched to form a plurality of grooves on the back side of the wafer. The wafer is diced to form a plurality of semiconductor devices.Type: ApplicationFiled: January 26, 2024Publication date: July 31, 2025Inventor: Sheng-Fu HUANG
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Patent number: 12353232Abstract: A regulator circuit module, a memory storage device, and a voltage control method are disclosed. The voltage control method includes: generating an output voltage according to an input voltage by a driving circuit; generating a feedback voltage according to the output voltage; and controlling the driving circuit by a first regulator circuit to adjust the output voltage in response to a current change caused by the feedback voltage.Type: GrantFiled: November 23, 2022Date of Patent: July 8, 2025Assignee: PHISON ELECTRONICS CORP.Inventors: Chien-Fu Huang, Bing-Wei Yi
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Publication number: 20250211219Abstract: A combo circuit with electrostatic discharge protection includes a pulse width modulation integrated circuit and a power integrated circuit. The pulse width modulation integrated circuit has an electrostatic discharge protection circuit and the electrostatic discharge protection circuit is installed between a source of the power integrated circuit and a reference ground potential of the combo circuit.Type: ApplicationFiled: December 2, 2024Publication date: June 26, 2025Inventors: Jhen-Hong Li, Chiung-Fu Huang, Chih-Yao Chang, Cheng-Sheng Kao, Chih-Wen Hsiung
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Publication number: 20250177967Abstract: A manufacturing method of a solid copper-carbon catalyst includes the following steps: providing a copper precursor solution, performing a spraying step, performing a drying step, and performing a calcining step. The copper precursor solution includes a copper precursor, a carbon carrier and a first solvent. In the spraying step, the copper precursor solution is dispersed to form a plurality of copper precursor drops. In the drying step, the copper precursor drops are dried to form a plurality of copper precursor powders. In the calcining step, the copper precursor powders are calcined to form a plurality of solid copper-carbon catalysts.Type: ApplicationFiled: June 11, 2024Publication date: June 5, 2025Inventors: De-Hao TSAI, Yung-Tin PAN, Yen-Te LEE, Dun-Zheng LIAO, Chien-Fu HUANG, Yi-Ta TSAI
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Publication number: 20250159916Abstract: A high electron mobility transistor includes a channel layer disposed on a substrate, a barrier layer disposed on the channel layer, a gate structure disposed on the barrier layer, a source contact structure and a drain contact structure disposed on the barrier layer at two sides of the gate structure, and extending through the barrier layer to directly contact the channel layer, and a gate contact structure disposed on the gate structure. The source contact structure, the drain contact structure, and the gate contact structure respectively include a liner and a metal layer directly disposed on the liner. The metal layer comprises a metal material doped with a first additive, and a weight percentage of the first additive in the metal layer is between 0% and 2%.Type: ApplicationFiled: January 13, 2025Publication date: May 15, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Ko-Wei Lin, Chun-Chieh Chiu, Chun-Ling Lin, Shu Min Huang, Hsin-Fu Huang
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Publication number: 20250149268Abstract: A key structure of electronic device including a substrate, a light source disposed on the substrate, an elastic member disposed on the substrate, and a key cap disposed on the elastic member is provided. The elastic member has a tunnel for passing light generated by the light source and projecting toward the key cap. An inner diameter of the tunnel gradually expands from the light source toward the key cap.Type: ApplicationFiled: November 29, 2023Publication date: May 8, 2025Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Chun-Han Chen, Tien-Fu Huang, Chih Wei Wang, Wan Hsiu Hsieh
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Patent number: 12279536Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a contact hole in the first IMD layer; forming a bottom electrode layer in the contact hole; forming a magnetic tunneling junction (MTJ) stack on the bottom electrode layer; and removing the MTJ stack and the bottom electrode layer to form a MTJ on a bottom electrode. Preferably, the bottom electrode protrudes above a top surface of the first IMD layer.Type: GrantFiled: March 19, 2024Date of Patent: April 15, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Jin-Yan Chiou, Wei-Chuan Tsai, Hsin-Fu Huang, Yen-Tsai Yi, Hsiang-Wen Ke
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Patent number: 12273280Abstract: A resource allocation method for a cloud environment includes steps performed by one or more servers. These steps include: obtaining an initial resource requirement, generating a first deployment parameter set according to the initial resource requirement by a first prediction model, configuring the cloud environment according to the first deployment parameter set by a resource allocator, obtaining and inputting the requests to a machine learning model in the cloud environment and generating a real resource requirement, generating a predicted resource requirement at least according to the real resource requirement by a second prediction model, when detecting that the cloud environment is in a busy state according to the predicted resource requirement by the resource allocator, generating a second deployment parameter set according to the real resource requirement by the first prediction model; and reconfiguring the cloud environment according to the second deployment parameter set by the resource allocator.Type: GrantFiled: June 6, 2023Date of Patent: April 8, 2025Assignee: WISTRON CORP.Inventor: Yuan Fu Huang
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Publication number: 20250090022Abstract: An eye detection physiological information capture device includes a first light plate assembly, and a second light plate assembly arranged in a housing. The first light plate assembly includes a first light source module, and a signal detection module. The signal detection module detects the reflection of light emitted from the first light source module towards an eye. The second light plate assembly includes a second light source module, a lens assembly, a first camera module, and a second camera module. The lens assembly is arranged to enable light rays from the second light source module to respectively irradiate the eye. The first camera module can capture a three-dimensional image of the eye and the second camera module can capture a fundus image of the eye by detecting the reflection of light emitted from the second light source module towards the eye.Type: ApplicationFiled: April 16, 2024Publication date: March 20, 2025Applicant: PolyVisions Technology Co., Ltd.Inventors: Chih-Ju Lin, Shih-Chieh Yen, Chen-Fu Huang
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Publication number: 20250093706Abstract: An electronic device includes a first substrate, a driving element, a first protrusion, a second protrusion and a plurality of third protrusions. The first substrate includes an edge, a first region, and a second region. The second region is disposed between the edge and the first region. The driving element is disposed in the first region. The first protrusion is disposed on the first substrate in the first region, and has a first thickness. The second protrusion is disposed on the first substrate in the second region, and has a second thickness. The third protrusions are disposed on the first substrate. The first protrusion is disposed between two of the third protrusions. At least one of the third protrusions has a third thickness. The first thickness is different from the second thickness, and the third thickness is less than the first thickness.Type: ApplicationFiled: December 5, 2024Publication date: March 20, 2025Inventors: Tang-Chin HUNG, Zhi-Fu HUANG
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Publication number: 20250097243Abstract: A detection method of network anomaly and an anomaly detection apparatus are disclosed. In the detection method, one or more request intervals within a detection period are determined, where each of the request intervals is a time interval of two network requests from a network source. A network request anomaly from the network source is determined according to the request interval within the detection period.Type: ApplicationFiled: November 16, 2023Publication date: March 20, 2025Applicant: Wistron CorporationInventor: Yuan Fu Huang
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Publication number: 20250066098Abstract: The invention discloses an automatic production equipment, which includes a folding part, a pair of opening parts, a transverse sealing part and a vertical sealing part. An opening is defined between a first edge of a film layer and a second edge of the film layer, and the pair of opening parts open the opening between the first edge of the film layer and the second edge of the film layer for an object to be inserted through the opening. The transverse sealing portion forms a first transverse heat-sealing edge and a second transverse heat-sealing edge on the folded film layer, and the vertical sealing part forms a vertical heat-sealing edge on the folded film layer.Type: ApplicationFiled: August 20, 2024Publication date: February 27, 2025Applicant: CHIENFU WRAPPING MATERIALS CO., LTD.Inventors: JUN-HAO LIAO, HSUAN-FU HUANG
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Patent number: 12237395Abstract: A high electron mobility transistor (HEMT) includes a substrate, a channel layer, a barrier layer and a passivation layer. A contact structure is disposed on the passivation layer and extends through the passivation layer and the barrier layer to directly contact the channel layer. The contact structure includes a metal layer, and the metal layer includes a metal material doped with a first additive. A weight percentage of the first additive in the metal layer is between 0% and 2%.Type: GrantFiled: February 20, 2022Date of Patent: February 25, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Ko-Wei Lin, Chun-Chieh Chiu, Chun-Ling Lin, Shu Min Huang, Hsin-Fu Huang
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Patent number: 12211888Abstract: A method for forming a thin film resistor with improved thermal stability is disclosed. A substrate having thereon a first dielectric layer is provided. A resistive material layer is deposited on the first dielectric layer. A capping layer is deposited on the resistive material layer. The resistive material layer is then subjected to a thermal treatment at a pre-selected temperature higher than 350 degrees Celsius in a hydrogen or deuterium atmosphere. The capping layer and the resistive material layer are patterned to form a thin film resistor on the first dielectric layer.Type: GrantFiled: January 27, 2021Date of Patent: January 28, 2025Assignee: UNITED MICROELECTRONICS CORP.Inventors: Kuo-Chih Lai, Chi-Mao Hsu, Shih-Min Chou, Nien-Ting Ho, Wei-Ming Hsiao, Li-Han Chen, Szu-Yao Yu, Hsin-Fu Huang
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Patent number: 12201316Abstract: A micro needle holder capable of cutting sutures, configured for holding needles and cutting sutures during microsurgeries, includes a needle holding unit and a suture cutting unit. The needle holding unit includes a pair of first plier bodies and a first shaft, where each of the first plier bodies has a needle holding end, a first shaft connecting part, and a first plier arm. The suture cutting unit includes a pair of second plier bodies and a second shaft, where each of the second plier bodies includes a suture cutting end, a second shaft connecting part, and a second plier arm. Moreover, the first plier arms are respectively connected with the second plier arms and are configured to elastically open and close corporately.Type: GrantFiled: June 27, 2022Date of Patent: January 21, 2025Inventors: Hui-Fu Huang, Shiuan-Tang Chang
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Patent number: 12189242Abstract: An electronic device includes a first substrate, a first protrusion, a second protrusion and a plurality of third protrusions. The first substrate includes an edge, a first region, and a second region. The first substrate includes a surface. The first protrusion is in the first region. A maximum distance from the surface to a top surface of the first protrusion is defined as a first distance. The second protrusion is in the second region. A maximum distance from the surface to a top surface of the second protrusion is defined as a second distance. The first protrusion is disposed between two of the third protrusions. A maximum distance from the surface to a top surface of the third protrusion is defined as a third distance. The first distance is different from the second distance, and the third distance is less than the first distance.Type: GrantFiled: January 30, 2024Date of Patent: January 7, 2025Assignee: INNOLUX CORPORATIONInventors: Tang-Chin Hung, Zhi-Fu Huang
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Publication number: 20240414640Abstract: Embodiments of the disclosure provides a cell selection method, including: during performing a cell selection operation on multiple reference base stations, obtaining a signal indicator and a network congestion indicator corresponding to each of the reference base stations; and selecting a serving base station from the reference base stations based on the signal indicator and the network congestion indicator corresponding to the each of the reference base stations.Type: ApplicationFiled: July 6, 2023Publication date: December 12, 2024Applicant: Wistron CorporationInventor: Yuan Fu Huang
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Publication number: 20240393187Abstract: An integrated circuit includes a memory and peripheral circuits with a temperature sensor used to automatically adjust operating voltages. The temperature sensor includes a reference circuit that generates a first reference with a first non-zero temperature coefficient and a second reference with a second temperature coefficient having a different magnitude than the first non-zero temperature coefficient. A detector circuit on the integrated circuit, having temperature and process variation compensation, converts a difference between the first and second references into a digital signal indicating temperature on the integrated circuit.Type: ApplicationFiled: July 8, 2024Publication date: November 28, 2024Applicant: MACRONIX INTERNATIONAL CO., LTD.Inventors: Chia-Ming HU, Chung-Kuang CHEN, Chia-Ching LI, Chien-Fu HUANG