Abstract: An electronic package is provided and includes an electronic element, an intermediary structure disposed on the electronic element, and a heat dissipation element bonded to the electronic element through the intermediary structure. The intermediary structure has a flow guide portion and a permanent fluid combined with the flow guide portion so as to be in contact with the electronic element, thereby achieving a preferred heat dissipation effect and preventing excessive warping of the electronic element or the heat dissipation element due to stress concentration.

Abstract: A case assembly includes a case body including a bottom panel, two side panels, a back panel higher than the side panels, a mounting structure located on the side panels, a first circuit board mounted on the bottom panel and a second circuit board mounted on the back panel and electrically connected to the first circuit board, and a cover including a top cover panel for covering the top open side of the case body, a front cover panel pivotally connected to the top cover panel for covering the front side of the case body and a positioning structure located on the bottom side of the top cover panel for detachably fastened to the mounting structure of the case body through a sliding action facilitating repair or replacement of the first circuit board or the second circuit board.

Abstract: A method for transferring a large number of light emitting elements in a single operation during display panel manufacture includes providing a receiving substrate with light emitting elements; orienting the light emitting elements on a first platform by a first electromagnetic plate; transferring the light emitting elements on the first platform to a second platform by a second electromagnetic plate; and transferring the light emitting elements on the second platform to the receiving substrate by a third electromagnetic plate. Each light emitting element undergoes a coarse positioning and finer positionings during the transfer process, so an accuracy of the light emitting elements is high.

Abstract: Provided is an electronic package, including a multi-chip packaging body with a plurality of electronic elements and a stress buffer layer disposed on the multi-chip packaging body. The stress buffer layer is in contact with the plurality of electronic elements so as to cause stresses to be evenly distributed in the stress buffer layer instead of being concentrated in specific areas, thereby preventing structural stresses from being concentrated in corners of the electronic elements.

Abstract: A method for transferring light emitting elements precisely during manufacture of display panels includes providing light emitting elements; providing a first electromagnetic plate defining magnetic adsorption positions; providing a receiving substrate defining receiving areas; providing a second electromagnetic plate; energizing the first electromagnetic plate to magnetically adsorb one light emitting element at one adsorption position; providing a second electromagnetic plate; and transferring the light emitting elements to one receiving area of the receiving substrate.

Abstract: A memory structure includes a substrate, a gate electrode, a first isolation layer, a thin metal layer, indium gallium zinc oxide (IGZO) particles, a second isolation layer, an IGZO channel layer, and a source/drain electrode. The gate electrode is located on the substrate. The first isolation layer is located on the gate electrode. The thin metal layer is located on the first isolation layer, and has metal particles. The IGZO particles are located on the metal particles. The second isolation layer is located on the IGZO particles. The IGZO channel layer is located on the second isolation layer. The source/drain electrode is located on the IGZO channel layer.

Abstract: A unidirectional transmission device includes at least one substrate, at least one light source, and at least one light-sensing element. The at least one substrate includes at least one recess. The at least one light source is configured to transform an electrical signal into an optical signal, and transmit the optical signal. The at least one light-sensing element is configured to receive the optical signal, and transform the optical signal into the electrical signal, wherein the at least one recess is configured to dispose the at least one light source, or configured to dispose the at least one light-sensing element, or configured to reflect the optical signal.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.

Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.

Abstract: A method for transferring light emitting elements precisely during manufacture of display panels includes providing light emitting elements; providing a first electromagnetic plate defining magnetic adsorption positions; providing a receiving substrate defining receiving areas; energizing the first electromagnetic plate to magnetically adsorb one light emitting element at one adsorption position; facing the first electromagnetic plate to the receiving substrate; and transferring the light emitting elements to one receiving area of the receiving substrate.

Abstract: The present invention discloses a semiconductor structure with an epitaxial layer, including a substrate, a blocking layer on said substrate, wherein said blocking layer is provided with predetermined recess patterns, multiple recesses formed in said substrate, wherein each of said multiple recesses is in 3D diamond shape with a centerline perpendicular to a surface of said substrate, a buffer layer on a surface of each of said multiple recesses, and an epitaxial layer comprising a buried portion formed on said buffer layer in each of said multiple recesses and only one above-surface portion formed directly above said blocking layer and directly above said recess patterns of said blocking layer, and said above-surface portion directly connects said buried portion in each of said multiple recesses, and a first void is formed inside each of said buried portions of said epitaxial layer in said recess.

Abstract: The present disclosure provides an exhaust system for discharging from semiconductor manufacturing equipment a hazardous gas. The exhaust system includes: a main exhaust pipe having a top surface and a bottom surface; a first branch pipe including an upstream end coupled to a source of a gas mixture containing the hazardous gas and a downstream end connected to the main exhaust pipe through the top surface; a second branch pipe including a downstream end connected to the main exhaust pipe through the bottom surface; and a detector configured to detect presence of the hazardous gas in the second branch pipe.

Abstract: An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.

Abstract: A liveness detection device comprising a light source unit, image sensor unit, and data processing module and authentication method thereof are provided. The light source unit comprises a substrate having a first inclined surface, whereby emitted light is reflected light from the first inclined surface. An application triggers an authentication process, which is indicated to a user. The light source unit begins illumination having a specific pattern and for a specific period and image signals are generated. Liveness detection signals are generated, via calculation of interference patterns, each, from more than one image signal, in sequence, for determination of liveness. When a liveness threshold is met, feature recognition data is generated, via calculation of interference patterns, each, from more than one image signal, in sequence, for matching. Then, the features are compared with previously enrolled data for locking or unlocking of the liveness detection device and/or system coupled thereto.

Abstract: A near-memory computation system includes a plurality of computation nodes. Each computation node receives a plurality of input signals and outputs a computing result signal. The computation node includes a plurality of non-volatile memory cells and a processing element. Each non-volatile memory cell stores a weighting value during a program operation and outputs a weighting signal according to the weighting value during a read operation. The processing element is coupled to the plurality of non-volatile memory cells. The processing element receives the plurality of input signals and generates the computing result signal by performing computations with the plurality of input signals and a plurality of weighting signals generated by the plurality of non-volatile memory cells. The plurality of non-volatile memory cells and the processing element are manufactured by different or the same processes.

Abstract: A plug connector with a connector position assurance device adapted for being docked with a socket connector, includes a main body, a plurality of terminals, a plurality of cables connected with the plurality of the terminals, and a connector position assurance device. The main body has a plurality of terminal slots. A top of the main body is bent frontward to form a buckling portion. The main body is spaced from the buckling portion and the two locking portions to form a locating space among the main body, the buckling portion and the two locking portions. The plurality of the terminals are assembled in the plurality of the terminal slots. The connector position assurance device has an abutting block. When the plug connector with a connector position assurance device is inserted into the socket connector, the abutting block moves into the locating space.

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

Abstract: An apparatus for cleaning an electrostatic reticle holder used in a lithography system includes a chamber for providing a low pressure environment for the electrostatic reticle holder and an ultrasound transducer configured to apply ultrasound waves to the electrostatic reticle holder. The apparatus further includes a controller configured to control the ultrasound transducer and a gas flow controller. The gas flow controller is configured to enable pressurizing or depressurizing the chamber.

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.