Abstract: A device for collecting and transferring light emitting elements of microscale size includes a non-magnetic plate, a plurality of magnetic probes, and a magnetic plate. The non-magnetic plate defines through holes. Each of the probes is fixed in one through holes. The magnetic plate is on a surface of the non-magnetic plate and closes one opening of each of the through holes. The magnetic plate generates a magnetic field, so that each of the probes magnetically attracts one light emitting element. A method for making the transfer device and a method for transferring light emitting elements using the transfer device are also disclosed.

Abstract: A disclosed computer-implemented method may include (1) selecting, from a video stream, a reference frame and a current frame, (2) collecting a reference histogram of the reference frame and a current histogram of the current frame, and (3) generating a smoothed reference histogram by applying a smoothing function to at least a portion of the reference histogram. In some examples, the computer-implemented method may also include (1) determining a similarity metric between the smoothed reference histogram and the current histogram and, (2) when the similarity metric is greater than a threshold value, applying weighted prediction during a motion estimation portion of an encoding of the video stream. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: The present invention discloses a semiconductor structure with an epitaxial layer, including a substrate, a blocking layer on said substrate, wherein said blocking layer is provided with predetermined recess patterns, multiple recesses formed in said substrate, wherein each of said multiple recesses is in 3D diamond shape with a centerline perpendicular to a surface of said substrate, a buffer layer on a surface of each of said multiple recesses, and an epitaxial layer comprising a buried portion formed on said buffer layer in each of said multiple recesses and only one above-surface portion formed directly above said blocking layer and directly above said recess patterns of said blocking layer, and said above-surface portion directly connects said buried portion in each of said multiple recesses, and a first void is formed inside each of said buried portions of said epitaxial layer in said recess.

Abstract: A semiconductor isolation structure includes a handle layer, a buried insulation layer, a semiconductor layer, a deep trench isolation structure, and a heavy doping region. The buried insulation layer is disposed on the handle layer. The semiconductor layer is disposed on the buried insulation layer and has a doping type. The semiconductor layer has a functional area in which doped regions of a semiconductor device are to be formed. The deep trench isolation structure penetrates the semiconductor layer and the buried insulation layer, and surrounds the functional area. The heavy doping region is formed in the semiconductor layer, is disposed between the functional area and the deep trench isolation structure, and is surrounded by the deep trench isolation structure. The heavy doping region has the doping type. A doping concentration of the heavy doping region is higher than that of the semiconductor layer.

Abstract: A molding system includes a frame device, a scooping device, a demolding device, a cutting device, an inspection device, a packaging device, and a conveying device. The frame device defines a scooping zone, a hot pressing zone, a cutting zone, an inspection zone, and a packaging zone. The scooping device includes a pulp tank that is adapted to contain a slurry, and a scooping mold that is adapted to scoop the slurry such that the slurry forms a blank unit thereon. The cutting device is adapted to cut the blank unit into a plurality of blank bodies. The conveying device is adapted to convey the blank bodies from the cutting zone to the packaging zone through the inspection zone.

Abstract: The present disclosure relates to a driving method for a display device and a display device. The display device includes a display driver, the display driver includes a plurality of driving channels each of which drives corresponding display unit according to display data in a pulse width modulation manner within one frame period, the method comprises: selectively enabling, in each sub-frame subset among a plurality of different sub-frame subsets of the frame period, different channel subset among a plurality of channel subsets of the plurality of driving channels to drive corresponding display unit, wherein each channel subset of the plurality of channel subsets includes two or more driving channels among the plurality of driving channels.

Abstract: An ReRAM structure includes a dielectric layer. A first ReRAM and a second ReRAM are disposed on the dielectric layer. The second ReRAM is at one side of the first ReRAM. A trench is disposed in the dielectric layer between the first ReRAM and the second ReRAM. The first ReRAM includes a bottom electrode, a variable resistive layer and a top electrode. The variable resistive layer is between the bottom electrode and the top electrode. A width of the bottom electrode is smaller than a width of the top electrode. The width of the bottom electrode is smaller than a width of the variable resistive layer.

Abstract: A random code generator includes a differential cell array, a power supply circuit, a first selecting circuit and a current judgment circuit. The power supply circuit receives an enrolling signal and a feedback signal. The first selecting circuit receives a first selecting signal. When the enrolling signal is activated and an enrollment is performed on the first differential cell, the power supply circuit provides an enrolling voltage, and the enrolling voltage is transmitted to a first storage element and a second storage element of the first differential cell through the first selecting circuit. Consequently, the cell current is generated. When a magnitude of the cell current is higher than a specified current value, the current judgment circuit activates the feedback signal, so that the power supply circuit stops providing the enrolling voltage.

Abstract: An automated testing machine with data processing function and an information processing method thereof are introduced. The automated testing machine includes a test head for testing more than one device under testing (DUT), and the test head further includes a test processing unit for providing more than one electrical test signal to the DUTs and conducting a processing and analyzing on more than one electrical feedback data fed back from the DUTs, so as to generate analysis result information. With the test processing unit capable of conducting data processing directly provided in the test head, signals obtained from the DUTs can be directly analyzed and processed to enable increased data processing efficiency, increased convenience in use and reduced costs of the automated test machine and the information processing method thereof.

Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate.

Abstract: An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate. Therefore, the first electronic component can be designed as a System on a Chip (SoC) with a smaller size to improve the process yield.

Abstract: A device for collecting and transferring light emitting elements of microscale size includes a non-magnetic plate, a plurality of magnetic probes, and a magnetic plate. The non-magnetic plate defines through holes. Each of the probes is fixed in one through holes. The magnetic plate is on a surface of the non-magnetic plate and closes one opening of each of the through holes. The magnetic plate generates a magnetic field, so that each of the probes magnetically attracts one light emitting element. A method for making the transfer device and a method for transferring light emitting elements using the transfer device are also disclosed.

Abstract: A waterproof socket connector includes an inner insulator, a plurality of terminals fastened in the inner insulator, at least one resistor, a conductive element, a grounding element, a shell, a sealing element and an outer insulator. The plurality of the terminals are a plurality of charging terminals and detection terminals. The at least one resistor is mounted to the detection terminals. The charging terminals are connected to the conductive element. The detection terminals are connected to the grounding element. The charging terminals are connected to the grounding element. The shell surrounds the inner insulator. A rear end of the shell is hollow to form an inner space. The sealing element is filled in the inner space. The outer insulator surrounds the inner insulator, the plurality of the terminals, the shell, the sealing element, the at least one resistor, the conductive element and grounding element.

Abstract: A method for transferring light emitting elements during manufacture of a display panel includes providing light emitting elements; providing a first electromagnetic plate defining adsorption positions; providing a receiving substrate defining receiving areas; energizing the first electromagnetic plate to magnetically adsorb one of the light emitting elements at each adsorption position; facing the first electromagnetic plate to the receiving substrate; and transferring the light emitting elements to one corresponding receiving area of the receiving substrate.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

Abstract: Semiconductor devices having flow controllers configured to reduce mitigation of mold material between stacked layers, and associated systems and methods, are disclosed herein. In some embodiments, the semiconductor device includes a package substrate that has first and second surfaces. First and second die stacks are formed on the first surface and are adjacent to each other. A portion of the first surface extends between the first and second die stacks. A layer of material is adhered to top surfaces of the first and second die stacks and extends at a distance above the package substrate to form a tunnel between the layer of material, opposing sidewalls of the die stacks, and the package substrate. The semiconductor device further includes a flow controller that is adhered to at least a portion of the first surface inside the tunnel that reduces a cross-sectional surface area of at least a portion of the tunnel.

Abstract: A capacitor structure comprises a substrate having a first side and a second side opposite to the first side; a plurality of first trenches formed on the first side of the substrate; a plurality of second trenches formed on the second side of the substrate; a first capacitor extending along the first side and into the first trenches; and a second capacitor extending along the second side and into the second trenches.

Abstract: A multifunctional shaft apparatus includes a shaft base, a spindle, a tool holder, an ultrasonic vibration assembly, a laser light source and a mirror assembly. The spindle is disposed in the shaft base. The spindle has a laser channel extending along the spindle. The tool holder is disposed on the spindle. The tool holder has a hollow passage, an inner space and a recessed portion. The hollow passage is communicated with the laser channel. An inner wall of the hollow passage has at least one through hole communicated with the inner space, and the recessed portion is disposed on a bottom surface of the tool holder. The bottom surface has a light outlet. The ultrasonic vibration assembly includes a vibration member disposed in the recessed portion. The mirror assembly is disposed in the tool holder and is configured to reflect the laser light beam generated by the laser light source.

Abstract: A case assembly includes a case body including a bottom panel, two side panels, a back panel higher than the side panels, a mounting structure located on the side panels, a first circuit board mounted on the bottom panel and a second circuit board mounted on the back panel and electrically connected to the first circuit board, and a cover including a top cover panel for covering the top open side of the case body, a front cover panel pivotally connected to the top cover panel for covering the front side of the case body and a positioning structure located on the bottom side of the top cover panel for detachably fastened to the mounting structure of the case body through a sliding action facilitating repair or replacement of the first circuit board or the second circuit board.