Abstract: A method for efficient manufacture of a color or monochrome display panel by an masse transfer of a large number of light emitting elements includes providing crystal blocks, providing a driving substrate, transferring the crystal blocks to the driving substrate, patterning the crystal blocks, and applying wavelength-converting elements to each light source, for a monochrome or color display device.

Abstract: A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.

Abstract: A plug connector with a connector position assurance device adapted for being docked with a socket connector, includes a main body, a plurality of terminals, a plurality of cables connected with the plurality of the terminals, and a connector position assurance device. The main body has a plurality of terminal slots. A top of the main body is bent frontward to form a buckling portion. The main body is spaced from the buckling portion and the two locking portions to form a locating space among the main body, the buckling portion and the two locking portions. The plurality of the terminals are assembled in the plurality of the terminal slots. The connector position assurance device has an abutting block. When the plug connector with a connector position assurance device is inserted into the socket connector, the abutting block moves into the locating space.

Abstract: An ReRAM structure includes a dielectric layer. A first ReRAM and a second ReRAM are disposed on the dielectric layer. The second ReRAM is at one side of the first ReRAM. A trench is disposed in the dielectric layer between the first ReRAM and the second ReRAM. The first ReRAM includes a bottom electrode, a variable resistive layer and a top electrode. The variable resistive layer is between the bottom electrode and the top electrode. A width of the bottom electrode is smaller than a width of the top electrode. The width of the bottom electrode is smaller than a width of the variable resistive layer.

Abstract: A supervisory-level control system is provided and includes a summation unit receptive of first and second signals, an HVAC system to generate the second signal according to first set-point signals and to a second set-point signal and a supervisory controller. The supervisory controller includes a control unit, a set-point scheduler and a zone level set-point distribution unit. The control unit is receptive of an error signal representing a difference between the first and second signals from the summation unit. The set-point scheduler is receptive of a demand signal generated by the control unit according to the error signal. The set-point scheduler generates a set-point command signal and the second set-point signal according to the demand signal. The zone level set-point distribution unit is configured to generate the first set-point signals in accordance with the set-point command signal.

Abstract: A mouse device includes a casing, a button, a connecting rod assembly, an elastic member, and an optical switch. A pressing block of the button extends into the casing. The connecting rod assembly is disposed in the casing and is rotatably disposed on a shaft base of the casing. The elastic member is disposed in the casing and elastically abuts against the connecting rod assembly, so that the connecting rod assembly abuts against the pressing block to allow the button at an initial position. The optical switch is disposed in the casing and adjacent to the connecting rod assembly. The button can be moved from the initial position to a pressed position relative to the casing so as to drive the connecting rod assembly to rotate, so that the connecting rod assembly is moved relative to the optical switch to trigger the optical switch.

Abstract: A semiconductor arrangement includes a first well formed to a first depth and a first width in a substrate and a second well formed to a second depth and a second width in the substrate. The first well is formed in the second well, the first depth is greater than the second depth, and the second width is greater than the first width. A source region is formed in the second well and a drain region is formed in the substrate.

Abstract: An electronic package and a method for fabricating the same are provided. The electronic package includes a stepped recess formed at a peripheral portion of a packaging module to release stress of the electronic package.

Abstract: The present disclosure relates to a driver for driving a light emitting unit array of a display device, the driver including: a plurality of driving units, each of the plurality of driving units includes: a driving circuit configured to provide a driving current to a corresponding column of light emitting units in the light emitting unit array according to a pulse width modulation signal, during a turn-on period of a channel switch; a regulating circuit configured to be connected in parallel with the driving circuit and be turned on according to the pulse width modulation signal to form a path with the corresponding column of the light emitting units, such that a current associated with the light emitting units flows through the path.

Abstract: An ReRAM structure includes a dielectric layer. A first ReRAM and a second ReRAM are disposed on the dielectric layer. The second ReRAM is at one side of the first ReRAM. A trench is disposed in the dielectric layer between the first ReRAM and the second ReRAM. The first ReRAM includes a bottom electrode, a variable resistive layer and a top electrode. The variable resistive layer is between the bottom electrode and the top electrode. A width of the bottom electrode is smaller than a width of the top electrode. The width of the bottom electrode is smaller than a width of the variable resistive layer.

Abstract: An electronic package and a method for fabricating the same are provided. The electronic package includes a stepped recess formed at a peripheral portion of a packaging module to release stress of the electronic package.

Abstract: A substrate and a display panel using the substrate are disclosed. The substrate includes a base layer; a magnetic material layer on a side of the base layer; and a thin film transistor (TFT) array layer on a side of the magnetic material layer away from the base layer.

Abstract: An image capturing system is disclosed. The image capturing system includes a mainboard, a laser device, an image sensing device, and a data processing device. The laser device is electrically connected to the mainboard, and the laser device includes a laser source. The laser source is configured to emit a laser light. The image sensing device is electrically connected to the mainboard, and the image detecting device includes an aperture and an image sensor. The reflected or scattered light of the laser light passes through the aperture to form an image. The image sensor is configured to generate an image signal according to the image. The data processing device is electrically connected to the mainboard, and the data processing device is configured to generate a liveness detection signal according to the image signal.

Abstract: Provided is an electronic package, including a first substrate of a first conductive structure and a second substrate of a second conductive structure, where a first conductive layer, a bump body and a metal auxiliary layer of the first conductive structure are sequentially formed on the first substrate, and a metal pillar, a second conductive layer, a metal layer and a solder layer of the second conductive structure are sequentially formed on the second substrate, such that the solder layer is combined with the bump body and the metal auxiliary layer to stack the first substrate and the second substrate. Therefore, the arrangement of the bump body and the metal auxiliary layer allows complete reaction of the IMCs after reflowing the solder layer, and the volume of the conductive structures will not continue to shrink. As such, the problem of cracking of the conductive structures can be effectively averted.

Abstract: Provided is an improved mold structure, including a first mold base, a second mold base and two controllers. The first mold base and the second mold base are operably aligned. When the first mold base and the second mold base are in an aligned state, a mold cavity is jointly framed. Two gas passages, a first mold core and a second mold core are provided. The first mold base is provided with a runner. Two ends thereof are respectively connected to a material tube and a mold cavity of a molding machine. The first and second mold cores are made of porous material. Vent pipelines thereof are connected to the respective gas passages. The two controllers are respectively connected to the gas passages, and control the gas in and out such that the pressure in different areas in the mold cavity reaches a predetermined value, thereby controlling the flow direction of the raw material in the mold cavity.

Abstract: An adsorption device includes a substrate, a plurality of magnetic films, and a plurality of magnets. The substrate defines a plurality of receiving grooves spaced apart from each other. Each receiving groove defines a bottom wall and a side wall. Each magnetic film is in one receiving groove and covers the bottom wall and the side wall. The magnetic films are made of magnetic material. Each magnet is in one receiving groove. Each magnetic film is between the substrate and one magnet, a large number of magnetized LEDs of very small size are attracted on a one-to-one basis to the receiving grooves for transfer and placement of the LEDs onto a display panel which is in the course of being manufactured.

Abstract: A driver circuit configured to receive a display data and drive a display panel is provided. The display panel includes a plurality of light-emitting diode devices according to the display data. The driver circuit includes a data driver. The data driver is configured to output driving signals to drive the light-emitting diode devices according to the display data and operate in different operation modes according to a control signal. The data driver includes a plurality of output channels. The output channels output the driving signals to drive the light-emitting diode devices via respective output terminals of the driver circuit. An assignment relationship of the display data and the output channels is different in the different operation modes. A display apparatus including the driver circuit is also provided.

Abstract: A semiconductor device includes an oxide semiconductor layer, disposed over a substrate. A source electrode of a metal nitride is disposed on the oxide semiconductor layer. A drain electrode of the metal nitride is disposed on the oxide semiconductor layer. A metal-nitride oxidation layer is formed on a surface of the source electrode and the drain electrode. A ratio of a thickness of the metal-nitride oxidation layer to a thickness of the drain electrode or the source electrode is equal to or less than 0.2.

Abstract: An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

Abstract: A device for collecting and transferring light emitting elements of microscale size includes a non-magnetic plate, a plurality of magnetic probes, and a magnetic plate. The non-magnetic plate defines through holes. Each of the probes is fixed in one through holes. The magnetic plate is on a surface of the non-magnetic plate and closes one opening of each of the through holes. The magnetic plate generates a magnetic field, so that each of the probes magnetically attracts one light emitting element. A method for making the transfer device and a method for transferring light emitting elements using the transfer device are also disclosed.