Abstract: An electronic package is provided, which is disposed with a second electronic component and a third electronic component on a first electronic component as a carrier structure, such that there is no need to match a layout size of the conventional package substrate. Therefore, the first electronic component can be designed as a System on a Chip (SoC) with a smaller size to improve the process yield.

Abstract: The present disclosure relates to a driving method for a display device and a display device. The display device includes a display driver, the display driver includes a plurality of driving channels each of which drives corresponding display unit according to display data in a pulse width modulation manner within one frame period, the method comprises: selectively enabling, in each sub-frame subset among a plurality of different sub-frame subsets of the frame period, different channel subset among a plurality of channel subsets of the plurality of driving channels to drive corresponding display unit, wherein each channel subset of the plurality of channel subsets includes two or more driving channels among the plurality of driving channels.

Abstract: A driver circuit configured to receive a display data and drive a display panel is provided. The display panel includes a plurality of light-emitting diode devices according to the display data. The driver circuit includes a data driver. The data driver is configured to output driving signals to drive the light-emitting diode devices according to the display data and operate in different operation modes according to a control signal. The data driver includes a plurality of output channels. The output channels output the driving signals to drive the light-emitting diode devices via respective output terminals of the driver circuit. An assignment relationship of the display data and the output channels is different in the different operation modes. A display apparatus including the driver circuit is also provided.

Abstract: A torque output device includes a body with an opening in the top. A top toothed part is located beneath the opening and includes a bore located corresponding to the opening. The top toothed part includes multiple top teeth. A drive shaft secured in the body and includes a central hole in which a rod is located. A driving portion is formed to the lower end of the drive shaft. The drive shaft and the top toothed part are freely rotated relative to each other. A bottom toothed part is mounted to the drive shaft and freely moves up and down relative to the drive shaft. A resilient member is mounted to the drive shaft and biases the bottom toothed part. A pressure collar is threadedly connected to the lower end of the body to set the torque between the engagement of the top and bottom teeth.

Abstract: An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.

Abstract: A wireless radio frequency conversion system is disclosed. The wireless radio frequency conversion system includes a wireless radio frequency transmit-receive device, a first conversion device, at least one optical fiber, a second conversion device, and a wireless radio frequency transmission device. The wireless radio frequency transmit-receive device performs a conversion and a transmit-receive manner to at least one radio frequency signal and at least one data signal. The first conversion device performs a conversion to the at least one data signal and at least one optical signal. The optical fiber transmits the at least one optical signal. The second conversion device performs a conversion to the at least one optical signal and the at least one data signal. The wireless radio frequency transmission device performs a conversion and a transmit-receive manner to the at least one data signal and the at least one terminal signal.

Abstract: An integrated circuit package, a die carrier, and a die are provided. The die carrier includes at least one die pad and a plurality of leads. The at least one die pad is suitable for carrying the die. The leads surround the at least one die pad. The leads are disposed on four sides of the die carrier. A length of a long side among the four sides is twice or more a length of a short side among the four sides. The die carrier is suitable for a QFN package or a QFP package.

Abstract: An integrated circuit package, a die carrier, and a die are provided. The die carrier includes at least one die pad and a plurality of leads. The at least one die pad is suitable for carrying the die. The leads surround the at least one die pad. The leads are disposed on four sides of the die carrier. A length of a long side among the four sides is twice or more a length of a short side among the four sides. The die carrier is suitable for a QFN package or a QFP package.

Abstract: A system comprises a source block buffer and a plurality of hardware motion estimation search processing units in communication with the source block buffer. The source block buffer is configured to store at least a portion of a source block of a source frame of a video. The plurality of hardware motion estimation search processing units are configured to perform at least a portion of a motion estimation for the source block at least in part in parallel across a plurality of different reference frames of the video. Each of the hardware motion estimation search processing units is configured to be assigned a different one of the plurality of different reference frames and is configured to compare at least the portion of the source block with a portion of the assigned one of the different reference frames.

Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.

Abstract: A proximity sensor includes a substrate, a light source, a finger electrode, an active layer, and a transparent electrode layer. The substrate has opposite top and bottom surfaces. The light source faces toward the bottom surface of the substrate. The finger electrode is located on the top surface of the substrate, and has finger portions and gaps between every two adjacent finger portions. The active layer covers the finger electrode, and is located in the gaps. The transparent electrode layer is located on the active layer. When the light source emits light, the light through the gaps sequentially passes through the active layer and the transparent electrode layer onto a reflective surface. The light is reflected by the reflective surface to form reflected light, and the reflected light passes through the transparent electrode layer and is received by the active layer.

Abstract: A SIM card connector includes an insulating body, a plurality of first terminals and a plurality of second terminals. The insulating body has a plurality of first slots and a plurality of second slots. Each side wall of each first slot has a limiting slot. The plurality of the first terminals are inserted into the plurality of the first slots. Each first terminal has a first base portion, a first soldering portion connected with a lower end of the first base portion, and a first contacting portion connected with an upper end of the first base portion. The plurality of the second terminals are inserted into the plurality of the second slots. Each second terminal has a second contacting portion slantwise extended towards a rear end of the insulating body and exposed beyond a top surface of the insulating body.

Abstract: A cyclical epitaxial deposition system and a gas distribution module are provided. The gas distribution module includes an inflow element having a plurality of inlet holes, a guide assembly, and an outflow element. The guide assembly disposed between the inflow and outflow elements includes a plurality of guide channels separate from one another and a plurality of temporary gas retention trenches respectively corresponding to the guide channels. Each of the guide channels is in fluid communication with the corresponding inlet hole. The outflow element has a plurality of diffusion regions respectively corresponding to the gas retention trenches, and a plurality of outlet channels respectively corresponding to the diffusion regions. Each of the diffusion regions has a plurality of diffusion apertures, and each of the temporary gas retention trenches is in fluid communication with the corresponding outlet channel through the diffusion apertures in the corresponding diffusion region.

Abstract: The present invention provides a source driver for driving a light emitting diode panel. The source driver includes a buffer including an output terminal; and a plurality of driving circuits coupled to the buffer. Each of the plurality of driving circuits includes a constant current transistor including a gate controlled by a node voltage of the output terminal of the buffer; and a compensation unit for compensating the node voltage of the output terminal of the buffer.

Abstract: Building response systems and methods of building responses are described. The building response systems include a building monitoring system configured to detect the presence of a harmful agent within an enclosed space, a building management system configured to monitor a building status and control building systems, a middleware system configured to receive information from each of the building monitoring system and the building management system, wherein the information from the building monitoring system comprises an alarm status and the information from the building management system comprises building status information, and a decision engine configured to receive information from the middleware system and to determine a mitigation action in response to receiving a positive alarm status.

Abstract: A method for making an adsorption device includes: providing and etching a substrate to form a plurality of receiving grooves spaced apart from each other; forming a magnetic film in each of the plurality of receiving grooves; and forming a magnet in each of the plurality of receiving grooves. Each receiving groove includes a bottom wall and a side wall coupling the bottom wall. The magnetic film covers the bottom wall and the side wall of each of receiving groove.

Abstract: The present invention provides a source driver for driving a light emitting diode panel. The source driver includes a buffer including an output terminal; and a plurality of driving circuits coupled to the buffer. Each of the plurality of driving circuits includes a constant current transistor including a gate controlled by a node voltage of the output terminal of the buffer; and a compensation unit for compensating the node voltage of the output terminal of the buffer.

Abstract: A semiconductor device includes an oxide semiconductor layer, disposed over a substrate. A source electrode of a metal nitride is disposed on the oxide semiconductor layer. A drain electrode of the metal nitride is disposed on the oxide semiconductor layer. A metal-nitride oxidation layer is formed on a surface of the source electrode and the drain electrode. A ratio of a thickness of the metal-nitride oxidation layer to a thickness of the drain electrode or the source electrode is equal to or less than 0.2.

Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.

Abstract: The present invention provides a method of controlling a display panel. The display panel includes a plurality of subpixels and a plurality of scan lines coupled to the plurality of subpixels. The method includes steps of: scanning a first scan line among the plurality of scan lines to turn on at least one of the plurality of subpixels coupled to the first scan line during a subframe period among a display frame period; and discharging a second scan line among the plurality of scan lines during a non-display period following the subframe period. Wherein, the second scan line is different from the first scan line.