Abstract: A structure of semiconductor device includes a substrate, having a dielectric layer on top. At least two metal elements are formed in the dielectric layer, wherein an air gap is between adjacent two of the metal elements. A cap layer is disposed over the substrate, wherein a portion of the cap layer above the adjacent two of the metal elements has a hydrophilic surface. An inter-layer dielectric layer is disposed on the cap layer. The inter-layer dielectric layer seals the air gap between the two metal elements. The air gap remains and extends higher than a top surface of the metal elements.

Abstract: A near-memory computation system includes a plurality of computation nodes. Each computation node receives a plurality of input signals and outputs a computing result signal. The computation node includes a plurality of non-volatile memory cells and a processing element. Each non-volatile memory cell stores a weighting value during a program operation and outputs a weighting signal according to the weighting value during a read operation. The processing element is coupled to the plurality of non-volatile memory cells. The processing element receives the plurality of input signals and generates the computing result signal by perform computations with the plurality of input signals and a plurality of weighting signals generated by the plurality of non-volatile memory cells. The plurality of non-volatile memory cells and the processing element are manufactured by different or the same processes.

Abstract: A button assembly of the present invention is configured in a communication equipment. The button assembly includes a button, a tray and at least an elastic arm. A side of the button is recessed inward to form a holding space. At least an inner side wall of the holding space is recessed to form a clamping groove. The tray is disposed in the holding space. The elastic arm has a fixing portion mounted on a side wall of the tray. The fixing portion is extended frontward and is protruded outward to form a contact part. The contact part is extended frontward and outward to form a clamping part disposed in the clamping groove. The clamping groove and the elastic arm are disposed to provide the button and the tray to be fixed or disengaged, achieving an effect of saving space in assembling of internal components of the communication equipment.

Abstract: A button assembly includes a pressing element, a tray, and a locking structure fastened between the pressing element and the tray. One side surface of the pressing element is recessed inward to form an accommodating space. The pressing element opens at least one first upper fixing hole. A bottom surface of the pressing element is recessed upward to form a first accommodating slot. The first accommodating slot opens at least one first opening. The tray of which one side is connected with the pressing element. The one side of the tray has a base portion mounted in the accommodating space. The base portion opens at least one second opening. A bottom surface of a peripheral wall of the at least one second opening is recessed upward to form at least one locking slot. The locking structure includes at least one locking element and an elastic arm.

Abstract: An electromagnetic wave charge management circuit includes: an antenna to receive an electromagnetic wave signal; a filtering unit electrically connected to the antenna to filter the electromagnetic wave signal received by the antenna; a converting unit electrically connected to the filtering unit to convert the filtered electromagnetic wave signal by the filtering unit into a direct current voltage; a charging unit electrically connected to the converting unit to provide the direct current voltage generated by the converting unit to an internal power supplier of the receiver device; and a controlling unit electrically connected to the filtering unit and the charging unit to transmit a first control signal that is for controlling the filtering unit to filter the electromagnetic wave signal, and a second control signal that is for controlling the charging unit to provide the direct current voltage generated by the converting unit to the internal power supplier.

Abstract: Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked. An electronic package employing the substrate structure is also provided.

Abstract: An electricity management method of wireless charging includes: detecting a charging request signal sent by a receiver device; selecting a transmitter device according to a location of the receiver device; detecting the location of the receiver device and a plurality of micro-electrometric wave charging environmental parameters thereof; collecting a strength distribution of a micro-electrometric wave signal frequency band in an area where the transmitter device is located, and transmitting area charging performance information based on the strength distribution of the micro-electrometric wave signal frequency band and area information of the area where the transmitter device is located; selecting one of the plurality of charging modes based on the charging request signal and the micro-electrometric wave charging environmental parameters; and based on the selected charging mode, controlling the transmitter device to turn on a charging function corresponding to the receiver device to charge the receiver device.

Abstract: A memory structure includes a substrate, a gate electrode, a first isolation layer, a thin metal layer, indium gallium zinc oxide (IGZO) particles, a second isolation layer, an IGZO channel layer, and a source/drain electrode. The gate electrode is located on the substrate. The first isolation layer is located on the gate electrode. The thin metal layer is located on the first isolation layer, and has metal particles. The IGZO particles are located on the metal particles. The second isolation layer is located on the IGZO particles. The IGZO channel layer is located on the second isolation layer. The source/drain electrode is located on the IGZO channel layer.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: A method for making a redistribution circuit structure provides a substrate and forms a peelable layer on the substrate. A metal layer is formed on a surface of the peelable layer, the metal layer including a controlling circuit including at least two spaced units. A first photoresist layer is formed on a portion of the surface of the peelable layer and an insulating layer is applied to completely cover the first photoresist layer and the controlling circuit. Through holes are defined in the insulating layer to partially expose the controlling circuit and a seed layer applied on the insulating layer. A block layer is laid to divide the seed layer into multiple sections and electroplating in each section on a portion of the seed layer is applied to form a plating layer with better uniformity of thickness across all sections.

Abstract: A semiconductor package structure and a method for forming the same are disclosed. The semiconductor package structure includes a semiconductor die, a molding layer and an inductor. The semiconductor die includes an active surface, a back surface and a sidewall surface between the active surface and the back surface. The molding layer covers the back surface and the sidewall surface of the semiconductor die. The inductor is in the molding layer. The sidewall surface of the semiconductor die faces toward the inductor.

Abstract: A mouse includes a pressure detector, a top housing, a first button, a first position limiter, and a second position limiter. The top housing is disposed on the pressure detector and has a first hole, a second hole, and a third hole. The second hole is located between the first hole and third holes. A first button is disposed on the top housing and has a first protruding portion, a second protruding portion, and a third protruding portion protruding toward the top housing. The first, second and third protruding portions are respectively aligned with the first, second and third holes. The second protruding portion extends toward the pressure detector through the second hole. The first position limiter is connected to the first protruding portion. The second position limiter is connected to the third protruding portion. The top housing is located between the first button and the second position limiter.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.

Abstract: A laser preheating control method is applied to a laser preheating control device. When a cutter processes a workpiece along a process path, a laser source of the device is provided to output a laser beam to the workpiece for selectively forming a laser spot on the workpiece surface. And according to a movement direction of the cutter, a laser controller of the device is provided to form the laser spot only on a preheating region of the workpiece, where in front of the cutter in the process path, for preheating the workpiece in the preheating region. As a result, the laser spot will not repeatedly heat the workpiece behind the cutter in the process path, and the qualitative change of the workpiece caused by repeating heating is preventable.

Abstract: An apparatus for cleaning an electrostatic reticle holder used in a lithography system includes a chamber for providing a low pressure environment for the electrostatic reticle holder and an ultrasound transducer configured to apply ultrasound waves to the electrostatic reticle holder. The apparatus further includes a controller configured to control the ultrasound transducer and a gas flow controller. The gas flow controller is configured to enable pressurizing or depressurizing the chamber.

Abstract: A multiplexer circuit includes a first switch unit and a second switch unit. The first switch unit is electrically connected to a first data line and a first pixel circuit, and configured to turn on according to a first signal in a first time duration. The second switch unit is electrically connected to the first data line and a second pixel circuit, and configured to turn on according to a second signal in a second time duration. The first time duration and the second time duration substantially start or end at a same time, so that the first time duration and the second time duration have overlap.

Abstract: A solar assisted water heating system for an electric water heater is provided to include a water guiding unit, a solar conversion unit, a radiant energy collection unit, and a pump. When electrical energy from the solar conversion unit is being applied to the pump, the water is driven by the pump to flow into the water guiding unit so as to be heated by the radiant energy collection unit which absorbs sunlight.

Abstract: A button assembly of the present invention is configured in a communication equipment, characterized in that: the button assembly includes a button, a tray and at least an elastic arm. A surface of the button is recessed to form a holding groove. The tray is disposed with a locking hole and a locking groove. The elastic arm has a pedestal arranged in the holding groove. The pedestal is protruded outward to form an elastic bar. A free end of the elastic bar forms a bump corresponding to the locking hole. An outer edge of the free end of the elastic bar forms a locking block corresponding to the locking groove. Hence, the locking hole and the elastic arm are disposed to provide the button and the tray to be fixed or disengaged, so as to achieve an effect of saving space in assembling of internal components of the communication equipment.

Abstract: A proximity sensor includes a substrate, a light source, a finger electrode, an active layer, and a transparent electrode layer. The substrate has opposite top and bottom surfaces. The light source faces toward the bottom surface of the substrate. The finger electrode is located on the top surface of the substrate, and has finger portions and gaps between every two adjacent finger portions. The active layer covers the finger electrode, and is located in the gaps. The transparent electrode layer is located on the active layer. When the light source emits light, the light through the gaps sequentially passes through the active layer and the transparent electrode layer onto a reflective surface. The light is reflected by the reflective surface to form reflected light, and the reflected light passes through the transparent electrode layer and is received by the active layer.

Abstract: A touch display panel includes a pixel array, a touch module, and a multiplexer circuit. The pixel array includes a plurality of pixels, a plurality of gate lines, and a plurality of source lines. The pixels are electrically coupled to the source lines and the gate lines. The touch module and the pixel array are overlapped. The multiplexer circuit is coupled between all of the source lines and a source driver and has a plurality of multiplexers. The multiplexers are respectively coupled to n source lines and respectively include a plurality of switches and a bypass trace. The switches are respectively coupled between the first source line to the (n?1)th source line of the n source lines and the source drivers. The bypass trace is coupled between the nth source line of the n source lines and the source driver.