Abstract: An electrical connector comprises a base having a plurality of passageways for receiving a number of contacts, a cover mounted to the base and including a plurality of through holes corresponding to the passageways, and a lid having two opposite edges. One edge is mounted upon the cover to drive the cover to move relative to the base, and the other edge locks the base when the lid is located at a close position relative to the base.

Abstract: Glass-ceramic sealant is disclosed for planar solid oxide fuel cells. The glass-ceramic sealant includes 0 to 40 mol % of silicon oxide, 0 to 15 mol % boron oxide, 0 to 10 mol % of aluminum oxide, 0 to 40 mol % of barium oxide, 0 to 15 mol % of calcium oxide, 0 to 15 mol % of lanthanum oxide and 0 to 5 mol % of zirconium dioxide. At 0° C. to 600° C., the thermal expansion coefficient of the sealant is 8 to 10 ppm/° C.

Abstract: A method of calibrating a digital-to-analog converter (DAC) is provided. The DAC includes a least-significant bit (LSB) block, and dummy LSB block adjacent to the LSB block. The DAC has a most-significant bit (MSB) block, which includes MSB thermometer macros. The method includes measuring the dummy LSB block to obtain a dummy LSB sum; and calibrating the MSB block so that each of the MSB thermometer macros provides a substantially same current as the dummy LSB sum.

Abstract: Mechanisms to calibrate a digital to analog converter (DAC) of an SDM (sigma delta modulator) are disclosed. An extra DAC element in addition to the DAC is used to function in place of a DAC element under calibration. A signal (e.g., a random sequence of ?1 and +1) is injected to the DAC element under calibration, and the estimated error and compensation are acquired.

Abstract: An analog to digital convertor (ADC) includes a plurality of comparators one of which is referred to as an auxiliary comparator (e.g., comparator “Aux”). This comparator Aux is calibrated in the background while other comparators function as usual. Once having been calibrated, the comparator Aux replaces a first comparator, which becomes a new comparator Aux, is calibrated, and replaces the second comparator. This second comparator becomes the new comparator Aux, is calibrated, and replaces the third comparator, etc., until all comparators are calibrated. In effect, at any one point in time, a comparator may be calibrated as desire while other comparators and thus the ADC are operating as usual.

Abstract: This invention relates to a method for making an electrolyte composition of a dye-sensitized solar cell comprising utilizing exfoliated clay nanoplatelets and the method for rapidly encapsulating cations. The electrolyte composition mainly includes exfoliated clay nanoplatelets, an ionic liquid and iodine. The method for rapidly encapsulating cation comprises adding the exfoliated clay nanoplatelets into a cationic solution, wherein the exfoliated clay nanoplatelets encapsulates cations and recovers into a layered structure such that phase separation of the solution occurs; and filtrating the solution to separate the clay nanoplatelets encapsulating the cations. The exfoliated clay nanoplatelets have a unique property of encapsulation for the cations, is suitable for use in an electrolyte composition for dye-sensitized solar cells, cationic drug encapsulation and environmental protection.

Abstract: The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.

Abstract: The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.

Abstract: A touch control apparatus includes a touch panel and a sensing control apparatus. The touch panel includes a plurality of sensing lines, and the sensing control apparatus includes a plurality of pins that are respectively coupled to the sensing lines. The sensing control apparatus adaptively controls a sequence for scanning the pins according to connection relationships between the pins and the sensing lines.

Abstract: A method for determining a displacement of a touch point is applied to a touch panel to reduce noise interfering with determination of the displacement. The method includes obtaining a displacement according to a movement of a touch point on the touch panel; checking whether the displacement is within a predetermined range; and determining that the movement is valid when the displacement is within the predetermined range.

Abstract: A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.

Abstract: A window covering is provided that includes a first rail and window covering material positioned adjacent to the first rail. One or more telescoping tubes are attached to the headrail and extend to the window covering material or to a bottom rail. The one or more telescoping tubes retract when the window covering material is retracted and extend when the window covering material is extended. Some embodiments of the window covering may include one or more lift cords. Portions of the one or more lift cords may extend from a lift mechanism through the telescoping tubes.

Abstract: An electrical contact (100) comprises an upper contact (1), a lower contact (3) and a spring (2) located between the upper contact (1) and the lower contact (3), the upper contact (1) comprises a base portion (11) and an additional portion (15) bending from the base portion (11) and overlapping each other, the base portion (11) has a first contact portion (111) at a top end thereof, the lower contact (3) comprises a body portion (32) and a pair of arms (33) extending from the body portion (32), the body portion (32) has a second contact portion (321) at a bottom end thereof, the arms (33) contact with the base portion (11) and the additional portion (15).

Abstract: An electrical contact (1) includes an upper extending portion (11), a lower extending portion (12) and a bridge portion (13). The upper extending portion includes a first contact portion (111), a C-shaped connecting portion (1121) connecting with the first contact portion and a tail portion (1122) extending downwardly from a free end of the C-shaped connecting portion. The lower extending portion includes a second contact portion (121), a vertical portion (1222) and an inclined portion (1221) connecting with the second contact portion and the vertical portion. The bridge portion is integrally formed between the tail portion and the vertical portion. One of the upper extending portion and the lower extending portion is rotated around the bridge portion to form an angular relationship between the planes of the upper and lower portions.

Abstract: A method and a system for navigating data and a storage medium using the method are provided. In the method, a search condition is received to search data conforming to the search condition from a database. If the number of the data conforming to the search condition is greater than a threshold, the data are grouped into a plurality of groups according to a grouping rule. A grouping result is displayed, so as to display a name of each of the groups and a specific number of the data in the each of the groups and not display the other data in the each of the groups.

Abstract: A method of operating an analog-to-digital converter (ADC) includes providing the ADC including a plurality of stages, each including an operational amplifier, and a first capacitor and a second capacitor including a first input end and a second input end, respectively. Each of the first capacitor and the second capacitor includes an additional end connected to a same input of the operational amplifier. The method further includes performing a plurality of signal conversions. Each of the signal conversions includes, in an amplifying phase of one of the plurality of stages, applying a first voltage to the first input end of the one of the plurality of stages, randomly selecting a second voltage from two different voltages; and applying the second voltage to the second input end of the one of the plurality of stages.

Abstract: An electrical contact (1) comprises an upper contact (10), a lower contact (12) and a spring (14) located between the upper contact (10) and the lower contact (12). The upper contact (10) comprises a first contacting portion (104) at one end thereof and a first mating end (108) comprising two contacting sheets overlapped at an opposite end thereof, and a lower contact comprises a second contacting portion and a second mating end defining a channel, the channel providing a space to allow movement of the first mating end.

Abstract: An electrical connector (100) comprises an insulative housing (1) defining a number of passageways (10) and shielding holes (14) arranged among the passageways, a conductive covering (5, 6) provided on a top surface of the insulative housing, a dielectric covering (7, 8) provided on a top surface of the conductive covering, a number of electrical contacts (2) receiving in the passageways and comprising a number of signal contacts (22) and grounding contacts (21), and a plurality of conductive elements (3) received in the shielding holes (14) and electrically connected to the grounding contacts (21) through the conductive covering (5, 6), the conductive elements (3) being insulated from the signal contacts (22).

Abstract: An optical fiber connector assembly includes a first connector and a second connector. The first connector includes two pairs of first convex lenses projecting from a front mating face thereof and a pair of cone-shaped positioning posts at sides of the pairs of convex lenses respectively. The second connector includes two pairs of second convex lenses projecting from a second front mating face thereof to couple with the first convex lenses and a pair of positioning holes to be inserted with the positioning posts of the first connector. Each of the positioning holes includes a retention section and a guiding section in front of the retention section, and the retention sections is same to the positioning posts while the guiding sections is larger than the position posts in dimension.

Abstract: A heat-dissipating structure and a heat-dissipating semiconductor package having the same are disclosed in the present invention. The heat-dissipating semiconductor package includes a chip carrier, a flip chip semiconductor chip attached and electrically connected to the chip carrier, and a heat sink bonded to the flip chip semiconductor chip via a thermal interface material, such as a solder material, wherein a groove is formed on the heat sink around the bonding area of the thermal interface material, and a blocking layer, such as a metal oxide layer, is formed on the surface of the groove to reduce the wetting capability of the thermal interface material, thus further prevents the thermal interface material from wetting the groove in the fusion process performed the thermal interface material, therefore, it ensures the thermal interface material has sufficient thickness for forming solder bonding between the heat sink and the flip chip semiconductor chip.