Abstract: The present disclosure provides a signal processing device comprising: a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate, one side surface thereof being provided with at least an integrated circuit or an antenna; and a first connecting portion for connecting the first and second substrates; wherein the second and fourth contacts are electrically connected to the integrated circuit or antenna via the first connecting portion.

Abstract: Glass-ceramic sealant is disclosed for planar solid oxide fuel cells. The glass-ceramic sealant includes 0 to 40 mol % of silicon oxide, 0 to 15 mol % boron oxide, 0 to 10 mol % of aluminum oxide, 0 to 40 mol % of barium oxide, 0 to 15 mol % of calcium oxide, 0 to 15 mol % of lanthanum oxide and 0 to 5 mol % of zirconium dioxide. At 0° C. to 600° C., the thermal expansion coefficient of the sealant is 8 to 10 ppm/° C.

Abstract: An apparatus is disclosed for testing the performance of a sealant for solid oxide fuel cell packs. The apparatus includes an oven including a base, a platform provided on the base and a frame connected to the platform. An elevator is used to raise and lower the oven. A pressuring and testing chamber is provided on the platform. The pressuring and testing chamber includes a first body and a second body connected to the first body. A carrier is provided between the first and second bodies. The carrier includes a first plate and a second plate so that the sealant can be provided between the first and second plates. A pusher includes an end connected to the frame and another end for pushing the second plate. A pusher-driving unit is connected to the frame for raising and lowering the pusher.

Abstract: Three bonding materials are provided on a first plate. The first bonding material is located between the second and third bonding materials. The first bonding material is thicker than the other bonding materials. A second plate is provided on the first bonding material. All of the plates and the bonding materials are heated to the softening point of the first bonding material. A load is exerted on the first bonding material to reduce the thickness of the first bonding material to that of the second and third bonding materials and transfer the load to the second and third bonding materials from the first bonding material. The temperature is raised to and kept at the crystallization point of the first bonding material. The temperature is raised to the wetting point of the second and third bonding materials.

Abstract: Indolinone compounds of formula (I) or (II): wherein A, R1, R2, R3, R4, R5, R6, R7, and n are defined herein. Also disclosed are methods for decreasing the activity of a protein kinase and for treating a protein kinase-related disease, such as cancer, with these compounds.

Abstract: A method of calibrating a digital-to-analog converter (DAC) is provided. The DAC includes a least-significant bit (LSB) block, and dummy LSB block adjacent to the LSB block. The DAC has a most-significant bit (MSB) block, which includes MSB thermometer macros. The method includes measuring the dummy LSB block to obtain a dummy LSB sum; and calibrating the MSB block so that each of the MSB thermometer macros provides a substantially same current as the dummy LSB sum.

Abstract: An electrical fuse structure is disclosed. The electrical fuse structure includes a fuse element disposed on surface of a semiconductor substrate, a cathode electrically connected to one end of the fuse element, and an anode electrically connected to another end of the fuse element. Specifically, a compressive stress layer is disposed on at least a portion of the fuse element.

Abstract: A contact efuse structure includes a silicon layer and a contact contacting the silicon layer with one end. When a voltage is applied to the contact, a void is formed at the end of the contact, and thus the contact is open. Such structure may be utilized in an efuse device or a read only memory. A method of making a contact efuse device and a method of making a read only memory are also disclosed.

Abstract: A pseudo-differential switched-capacitor circuit using integrator-based common-mode stabilization technique is disclosed. A pseudo-differential switched-capacitor circuit with the differential floating sampling (DFS) technique has a common-mode gain value of one (1). An integrator is electrically coupled to the differential positive/negative outputs of the DFS circuit, and the integrator feeds back integrator output to the DFS circuit by detecting common-mode voltage disturbance at the differential positive output (Vout+) and negative output (Vout?), thereby stabilizing output common-mode level of the differential positive output (Vout+) and negative output (Vout?) at a desirable level.

Abstract: The present invention relates to a trimming apparatus operable in an auto mode or a manual mode. The trimming apparatus include a cutter frame, a transmission belt, a motor, a clamping element, a switch and a mode-switching unit. By adjusting the mode-switching unit to control clamping element to clamp or release the transmission belt, the trimming apparatus 100 is operated in either the auto mode or the manual mode.

Abstract: A window covering includes a plurality of lift cords extending from an upper rail and window covering material connected to the upper rail or the lift cords. A plurality of safety devices are attached to the window covering. Each safety device includes a male member and a female member. One of the members is attached to a respective lift cord and the other of the members is attached to a portion of the window covering material or a lower rail. The male and female members are configured to be attached together such that the male and female members separate from each other when a release force acts on at least one of the male member and female member.

Abstract: An IC socket, adapted for electrically connecting an IC package and a printed circuit board, includes a base, a socket body received in the base, a plurality of contacts received in the socket body, and an actuating mechanism moveably assembled on the base. The socket body includes a first insulative housing and a second insulative housing located under the first insulative housing. The actuating mechanism can actuate the first insulative housing and a second insulative housing to move in a horizontal direction relative to each other and drive the contact to stretch in a vertical direction.

Abstract: A Roman shade is provided with a child safety device that includes a plurality of release devices configured for attachment to the shade material of the Roman shade. Each release device includes a female member and a male member that releasably connect together such that one member is attached to the shade material and the other member has an opening through which a lift cord passes. The male member and female member of each release device are sized and configured to separate when a release force acts on at least one of the female members and male members. A kit for retrofitting Roman shades to include such safety devices is also disclosed.

Abstract: A window covering includes a plurality of lift cords extending from an upper rail and window covering material connected to the upper rail or the lift cords. A plurality of safety devices are attached to the window covering. Each safety device includes a male member and a female member. One of the members is attached to a respective lift cord and the other of the members is attached to an upper rail, a portion of the window covering material or a lower rail. The male and female members are configured to be attached together such that the male and female members separate from each other when a release force acts on at least one of the male member and female member.

Abstract: A window covering includes a plurality of lift cords extending from a headrail and window covering material connected to the headrail or the lift cords. At least one lift cord release device is attached to the window covering material. Each cord release device includes a clip portion, a first member and a second member. The clip portion is attached to the first and second members. The first and second members are sized and configured to releasably interconnect such that the first and second members at least partially define an opening sized to receive and releasably hold at least one lift cord when the first and second members are interconnected. The first and second members are also configured to separate and release the at least one lift cord when a release force exerted by any lift cord that is within the opening acts on the first or second member.

Abstract: A Roman shade is provided with a child safety device that includes a plurality of release devices configured for attachment to the shade material of the Roman shade. Each release device includes a female member and a male member that releasably connect together such that one member is attached to the shade material and the other member has an opening through which a lift cord passes. The male member and female member of each release device are sized and configured to separate when a release force acts on at least one of the female members and male members. A kit for retrofitting Roman shades to include such safety devices is also disclosed.

Abstract: A pseudo-differential switched-capacitor circuit using integrator-based common-mode stabilization technique is disclosed. A pseudo-differential switched-capacitor circuit with the differential floating sampling (DFS) technique has a common-mode gain value of one (1). An integrator is electrically coupled to the differential positive/negative outputs of the DFS circuit, and the integrator feeds back integrator output to the DFS circuit by detecting common-mode voltage disturbance at the differential positive output (Vout+) and negative output (Vout?), thereby stabilizing output common-mode level of the differential positive output (Vout+) and negative output (Vout?) at a desirable level.

Abstract: A touch sensing method and associated circuit are provided. In one aspect, a touch control circuit includes a first current source, a second current source, a plurality of switches, a hysteresis comparator, a frequency divider and a flip-flop. The switches are couple to a plurality of external contact points. The hysteresis comparator is coupled to a first reference comparison voltage and a second reference comparison voltage. Each of the external contact points is selectively coupled to an input terminal of the hysteresis comparator through the switches. The first current source and the second current source are coupled to the input terminal of the hysteresis comparator to generate a sensing voltage. The hysteresis comparator compares the sensing voltage with the first reference comparison voltage and the second reference comparison voltage to generate a hysteresis comparison output to control the first current source or the second current source.

Abstract: A programmable memory built-in self-test circuit and a clock switching circuit thereof are provided. The memory built-in self-test circuit is able to provide more self-test functions preset by a user, simplify the redundant circuit in the prior art and reduce chip area and lower the cost by means of an instruction decoder and a built-in self-test controller. The present invention also provides some peripheral control circuits of a memory. The control circuits occupies less area and enables the memory to be tested more flexibly. The present invention further provides a clock switching circuit enabling a chip to be correctly tested under different clock speeds, which benefits to advance the testability and the analyzability of the memory embedded in a chip and thereby increase fault coverage.

Abstract: A biochip package structure is provided. The biochip package structure includes a substrate, a biochip, at least one wire, and a molding compound. The substrate has a circuit unit electrically connected, by wiring, to the biochip defined with a sensing region. The molding compound covers the wire but leaves the sensing region of the biochip exposed, allowing a cavity to be formed in the sensing region. The cavity delivers a biomedical sample. The biomedical sample reacts in the sensing region. Thus, the biochip package structure is applicable to various medical and biochemical assays.