Abstract: An electrical connector includes an insulative housing and a plurality of contacts. The insulative housing have a top surface, a bottom surface, and a plurality of passageways extending through the top and the bottom surfaces. Each contact includes an upper terminal mounted into the passageway form the top surface and a lower terminal mounted into the passageway from the bottom surface. The upper terminal is configured with an upper retention portion and an upper spring arm extending beyond the top surface of the insulative housing. The lower terminal is configured with a lower retention portion, a lower spring arm extending beyond the bottom surface of the insulative housing, and a lower engaging portion extending upwardly from the lower retention portion to elastically contact with the upper terminal.

Abstract: An electrical connector includes an insulative housing and a plurality of contacts. The insulative housing have a top surface, a bottom surface, and a plurality of passageways extending through the top and the bottom surfaces. Each contact includes an upper terminal mounted into the passageway form the top surface and a lower terminal mounted into the passageway from the bottom surface. The upper terminal is configured with an upper retention portion and an upper spring arm extending beyond the top surface of the insulative housing. The lower terminal is configured with a lower retention portion, a lower spring arm extending beyond the bottom surface of the insulative housing, and a lower engaging portion extending upwardly from the lower retention portion to elastically contact with the upper terminal.

Abstract: A chip structure comprising a semiconductor substrate, a plurality of dielectric layers, a plurality of circuit layers, a passivation layer, a metal layer and at least a bump. The semiconductor substrate has a plurality of electronic devices positioned on a surface layer of the semiconductor substrate. The dielectric layers are sequentially stacked on the semiconductor substrate and have a plurality of via holes. The circuit layers are disposed on one of the dielectric layers, wherein the circuit layers are electrically connected with each other through the via holes and are electrically connected to the electronic devices. The passivation layer is disposed over the circuit layers and the dielectric layers, wherein the passivation layer comprises an opening that exposes one of the metal layers. The metal layer is disposed over the passivation layer, wherein the metal layer comprises at least a bump pad and at least a testing pad, the bump pad electrically connecting with the testing pad.

Abstract: An apparatus is disclosed for testing the performance of a sealant for solid oxide fuel cell packs. The apparatus includes an oven including a base, a platform provided on the base and a frame connected to the platform. An elevator is used to raise and lower the oven. A pressuring and testing chamber is provided on the platform. The pressuring and testing chamber includes a first body and a second body connected to the first body. A carrier is provided between the first and second bodies. The carrier includes a first plate and a second plate so that the sealant can be provided between the first and second plates. A pusher includes an end connected to the frame and another end for pushing the second plate. A pusher-driving unit is connected to the frame for raising and lowering the pusher.

Abstract: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.

Abstract: An IC socket, adapted for electrically connecting an IC package and a printed circuit board, includes a base, a socket body received in the base, a plurality of contacts received in the socket body, and an actuating mechanism moveably assembled on the base. The socket body includes a first insulative housing and a second insulative housing located under the first insulative housing. The actuating mechanism can actuate the first insulative housing and a second insulative housing to move in a horizontal direction relative to each other and drive the contact to stretch in a vertical direction.

Abstract: A window covering is disclosed that has a safety device that includes a first cord segment having stops spaced along the first cord segment, and a second cord segment having stops spaced along the second cord segment. The first cord segment and the second cord segment extend from respective end caps. The end caps are configured to connect to the ends of a bottom rail. A first anchor is connected to the first cord segment, and a second anchor is connected to the second cord segment. At least one of the first end cap and the first anchor is configured to releasably connect to the first cord segment at a selected stop on the first cord segment and at least one of the second anchor and the second end cap is configured to releasably connect to the second cord segment at a selected stop on the second cord segment.

Abstract: A window covering is disclosed that has a safety device that includes a first cord segment having stops spaced along the first cord segment, and a second cord segment having stops spaced along the second cord segment. The first cord segment and the second cord segment extend from respective end caps. The end caps are configured to connect to the ends of a bottom rail. A first anchor is connected to the first cord segment, and a second anchor is connected to the second cord segment. At least one of the first end cap and the first anchor is configured to releasably connect to the first cord segment at a selected stop on the first cord segment and at least one of the second anchor and the second end cap is configured to releasably connect to the second cord segment at a selected stop on the second cord segment.

Abstract: The electrolytic capacitor has an insulating casing, at least one capacitor element and multiple external terminals. The casing has multiple through holes and mounting protrusions. The at least one capacitor element is mounted in the casing and has multiple inner conductive pins connecting to a coil. Each external terminal is attached to a bottom panel of the insulating casing, connects to a corresponding inner conductive pin and has a main body, a connecting portion and two fixing portions. The connecting portion is formed on and extends from a side of the main body and has a conducting hole attached to a corresponding conductive pin. The fixing portions respectively extend from two ends of the main body and engage with the mounting protrusions. Each external terminal provides a soldering surface being flat and having large soldering area, therefore the electrolytic capacitor can be firmly soldered on a circuit board.

Abstract: A frame (1) for engaging with a connector (2) includes a first pair of opposite retaining walls (13), a second pair of opposite retaining walls (12) and an opening (11). The opening (11) is surrounded by the first and the second retaining walls. The frame is detachable from the connector and at least one pair of the first and second pairs (13, 12) of opposite retaining walls are fixed on the lateral sides of the electrical connector. Wherein at least one retaining wall which is fixed to the electrical connector, defines a cutout (120, 130), and the cutout (120, 130) is disposed on middle portion of the retaining wall and communicates with the opening (11).

Abstract: A burn-in socket for electrical connecting with package having solder balls, includes a base and a number of contacts received in the base. Each contact has a spring section movable in the base, a contact section extending upwardly from the spring section and a retention section extending downwardly from the spring section. The contact section includes three tips at a top end thereof for contacting with the solder balls of the package thereby supporting the solder balls.

Abstract: The present invention discloses a power supply system for reducing reverse current, the system comprising a primary side circuit, for receiving alternating current; a transformer circuit, for transforming voltage; a secondary side rectifier circuit, for rectifying voltage; a secondary side filter circuit, for filtering voltage and providing direct current to a device; a first voltage division circuit, for providing a first voltage division signal; a switch circuit, for deciding the conducting condition based on the first voltage division signal and a reference voltage signal; a second voltage division circuit, for providing a second voltage division signal; and a control circuit, for deciding the charging condition based on the second voltage division signal; wherein the second voltage division circuit comprising a rectifier component and a filter component, for rectifying and filtering the source of the second voltage division signal.

Abstract: This invention describes the process for fabrication of a high conductivity and low resistance solid oxide fuel cell. An anode substrate is mainly prepared via tape casting technique and modified by abrasion and polish process. Electrolyte is fabricated onto the polished side by thin film technologies and can attach well in the cross section. Grinding surface of anode side about 10-30 ?um after finish of MEA combination can get a high conductivity and low resistance unit cell and enhance cell performance effectively.

Abstract: The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.

Abstract: A digital apparatus includes a timing control circuit, a period counter, a phase digitizer and a calculation circuit. The timing control circuit generates a first control signal according to a square wave signal and a predetermined value. The period counter generates a first digital value according to a reference clock signal and the first control signal. The phase digitizer generates a second digital value according to a phase difference between the square wave signal and the reference clock signal. The calculation circuit generates an output digital value according to the first digital value and the second digital value. An object of obtaining a high-resolution digitization with a reasonable sampling clock is realized by effectively combining the period counter with the phase digitizer.

Abstract: An instruction-based programmable memory built-in self test (P-MBIST) circuit and an address generator thereof are provided. The P-MBIST circuit generates control signals according to the decoding of compact test instructions provided by an external automatic test equipment (ATE). The address generator generates memory addresses according to the control signals. The control signals and the memory addresses are sent to an embedded memory to perform the MBIST. The algorithm-specific design of the P-MBIST circuit and the address generator enables them to support multiple test algorithms at full clock speed and occupy smaller chip area.

Abstract: An electrical contact (100) comprises an upper contact (1), a lower contact (3) and a spring (2) located between the upper contact (1) and the lower contact (3), the upper contact (1) comprises a base portion (11) and an additional portion (15) bending from the base portion (11) and overlapping each other, the base portion (11) has a first contact portion (111) at a top end thereof, the lower contact (3) comprises a body portion (32) and a pair of arms (33) extending from the body portion (32), the body portion (32) has a second contact portion (321) at a bottom end thereof, the arms (33) contact with the base portion (11) and the additional portion (15).

Abstract: Through protrusion on channel area, a fuel flows higher to have a better reaction with a power generating plate of an SOFC. A material is selected for stacks to reduce the number of stacks and to simplify an assembling process of the stacks.

Abstract: A differential to single ended converting circuit includes a transconductance circuit having input terminals for receiving differential input voltages and having a first current output terminal for outputting a first current and a second current output terminal for outputting a second current; an offset cancellation circuit having a first controllable current source connected to the first current output terminal and a second controllable current source connected to the second current output terminal; a first transimpedance circuit having an input terminal connected to the first current output terminal and an output terminal for outputting a first voltage; a second transimpedance circuit having an input terminal connected to the second current output terminal and an output terminal for outputting a second voltage; and a first inverter having an input terminal connected to the output terminal of the first transimpedance circuit and an output terminal for outputting a first single ended output voltage.

Abstract: A tool for making the semiconductor package accurately contact with the terminals of a electrical connector, comprises a body with a through hole for passing through the semiconductor package thereof, a plurality of the latching members mounted on the body and a guiding member, the guiding member is received in the body and could move up and down relative to the body. The guiding member of the invention is a floatable model to decrease the damage of the semiconductor package while loading.