Abstract: A voltage controlled oscillator includes: a first merged device having a first bipolar transistor and a first MOS transistor, the first bipolar transistor having a collector sharing a common active area with a source/drain of the first MOS transistor, and an emitter sharing the common active area with another source/drain of the first MOS transistor, a second merged device having a second bipolar transistor and a second MOS transistor, the second bipolar transistor having a collector sharing a common active area with a source/drain of the second MOS transistor, and an emitter sharing the common active area with another source/drain of the second MOS transistor, and a first inductor connected to both the collector of the first bipolar transistor and a base of the second bipolar transistor.

Abstract: A static random access memory (SRAM) cell is disclosed which comprises a cross-couple inverter latch coupled between a positive supply voltage and ground, and having at least a first storage node, and a first and second switching device serially connected between the first storage node and a predetermined voltage source, wherein the first switching device is controlled by a word select signal, and the second switching device is controlled by a first bit select signal, wherein either the word select signal or the first bit select signal is only activated during a write operation.

Abstract: A system and method for calibrating a digital-to-analog converter (DAC) is disclosed, the method comprises providing a plurality of spare bits to each of a group of DAC bits that are designated for calibration, calibrating a first DAC bit of the group of DAC bits using its corresponding plurality of spare bits, and keeping a second DAC bit of the group of DAC bits unchanged while calibrating the first DAC bit.

Abstract: A voltage down converter for programming a one-time-programmable (OTP) memory comprising is disclosed, the voltage down converter comprises a bonding pad for coupling to a programming power supply, and at least one forward biased diode coupled between the bonding pad and the OTP memory, wherein a programming voltage received by the OTP memory is lowered from the programming power supply by the voltage drop across the forward biased diode.

Abstract: A bipolar device includes: an emitter of a first polarity type constructed on a semiconductor substrate; a collector of the first polarity type constructed on the semiconductor substrate; a gate pattern in a mesh configuration defining the emitter and the collector; an intrinsic base of a second polarity type underlying the gate pattern; and an extrinsic base constructed atop the gate pattern and coupled with the intrinsic base, for functioning together with the intrinsic base as a base of the bipolar device.

Abstract: A waveguide in semiconductor integrated circuit is disclosed, the waveguide comprises a horizontal first metal plate, a horizontal second metal plate above the first metal plate, separated by an insulation material, and a plurality of metal vias positioned in two parallel lines, running vertically through the insulation material in contacts with both the first and second metal plates, wherein the first and second metal plates and the plurality of metal vias form a metal enclosure in a cross-sectional view that can serve as a waveguide.

Abstract: A method for reading two or more magnetic tunnel junctions (MTJs) which are serially connected with a select transistor to form a memory string, the method comprises turning on the select transistor, measuring a first resistance of the memory string, storing the first resistance, toggling a predetermined one of the MTJs, measuring a second resistance of the memory string after the toggling, toggling back the predetermined one of the MTJs and comparing the first and second resistances with a plurality of predetermined resistance values, wherein the comparison result leads to a determination of the data stored in the MTJs.

Abstract: MEMS packaging schemes having a system-on-package (SOP) configuration and a system-on-board (SOB) configuration are provided. The MEMS package comprises one or more MEMS dies, a cap section having one or more integrated circuit (IC) dies, and a packaging substrate or a printed circuit board (PCB) arranged in a stacking manner. Vertical connectors, such as through-silicon-vias (TSVs), are formed to provide short electrical connections between the various components. The MEMS packaging schemes enable higher integration density, reduced MEMS package footprints, reduced RC delays and power consumption.

Abstract: The present invention discloses a bias circuit for a sense amplifier having a device under sensing, the device under sensing having an un-programmed state and a programmed state, the bias circuit comprises at least one first branch having at least one first device formed substantially the same as the device under sensing and remaining in the un-programmed state, and at least one second device formed also substantially the same as the device under sensing and being in the programmed state, wherein the at least one first device and the at least one second device are serially connected. A typical application of the present invention is an electrical fuse memory.

Abstract: A voltage controlled oscillator includes: a first merged device having a first bipolar transistor and a first MOS transistor, the first bipolar transistor having a collector sharing a common active area with a source/drain of the first MOS transistor, and an emitter sharing the common active area with another source/drain of the first MOS transistor, a second merged device having a second bipolar transistor and a second MOS transistor, the second bipolar transistor having a collector sharing a common active area with a source/drain of the second MOS transistor, and an emitter sharing the common active area with another source/drain of the second MOS transistor, and a first inductor connected to both the collector of the first bipolar transistor and a base of the second bipolar transistor.

Abstract: A verification system for verifying an integrated circuit design is provided. The verification system includes a functional block finding module configured to identify potential sensitive circuits in the integrated circuit design; and a search module. The search module is configured to find sensitive circuits from the potential sensitive circuits; and verify the sensitive circuits.

Abstract: A system for testing logic circuits for executing writing and reading operations in a one-time programmable (OTP) memory having an array of memory cells is disclosed, the system comprising a column of testing cells having the same number of cells as that of an entire column of the array of memory cells, a row of testing cells having the same number of cells as that of an entire row of the array of memory cells, wherein both the column and row of testing cells are first written to and then read out from during a testing operation, and can never be accessed during non-testing operations of the OTP memory.

Abstract: A method for reading two or more magnetic tunnel junctions (MTJs) which are serially connected with a select transistor to form a memory string, the method comprises turning on the select transistor, measuring a first resistance of the memory string, storing the first resistance, toggling a predetermined one of the MTJs, measuring a second resistance of the memory string after the toggling, toggling back the predetermined one of the MTJs and comparing the first and second resistances with a plurality of predetermined resistance values, wherein the comparison result leads to a determination of the data stored in the MTJs.

Abstract: A DAC cell comprising: two or more PMOS core devices coupled in series between a power supply and a steering node; a first core transistor coupled between the steering node and a complementary power supply line and controlled by a control signal; and a second core transistor coupled between the steering node and an output of the DAC cell and controlled by a logical inverse of the control signal, wherein the control signal and its logical inverse direct a current from the steering node to either the complementary power supply line or to the output of the DAC cell based on the control signal.

Abstract: The present invention discloses a bias circuit for a sense amplifier having a device under sensing, the device under sensing having an un-programmed state and a programmed state, the bias circuit comprises at least one first branch having at least one first device formed substantially the same as the device under sensing and remaining in the un-programmed state, and at least one second device formed also substantially the same as the device under sensing and being in the programmed state, wherein the at least one first device and the at least one second device are serially connected. A typical application of the present invention is an electrical fuse memory.

Abstract: A fuse circuit is disclosed, which comprises at least one electrical fuse element having a resistance that changes after being stressed in an electromigration mode, a switching device serially coupled with the electrical fuse element in a predetermined path between a fuse programming power supply (VDDQ) and a low voltage power supply (GND) for selectively allowing a programming current passing through the electrical fuse element during a programming operation, and at least one peripheral circuit coupled to the VDDQ, wherein the peripheral circuit is active and draws current from the VDDQ during a fuse programming operation.

Abstract: A system and method for calibrating a digital-to-analog converter (DAC) is disclosed, the method comprises providing a plurality of spare bits to each of a group of DAC bits that are designated for calibration, calibrating a first DAC bit of the group of DAC bits using its corresponding plurality of spare bits, and keeping a second DAC bit of the group of DAC bits unchanged while calibrating the first DAC bit.

Abstract: A DAC cell comprising: two or more PMOS core devices coupled in series between a power supply and a steering node; a first core transistor coupled between the steering node and a complementary power supply line and controlled by a control signal; and a second core transistor coupled between the steering node and an output of the DAC cell and controlled by a logical inverse of the control signal, wherein the control signal and its logical inverse direct a current from the steering node to either the complementary power supply line or to the output of the DAC cell based on the control signal.

Abstract: A resistor structure for an integrated circuit includes a first set of contacts connected between a semiconductor layer and a first conductive layer; and a second set of plugs connected between the first conductive layer and a second conductive layer, wherein the first set of contacts and the second set of plugs are coupled together as a first resistor segment to provide a predetermined resistance for the integrated circuit.

Abstract: A sense amplifier for detecting a logic state of a selected electrical fuse cell among a number of unselected electrical fuse cells includes a bias module coupled to a power supply for generating a first current, and a tracking module coupled to the bias module for generating a second current. A current supplier is coupled to the bias module and the tracking module for generating a third current substantially equal to a sum of the first and second currents scaled by a predetermined factor, the third current being diverted into a first sub-current flowing through the selected electrical fuse cell and a second sub-current leaking through the unselected electrical fuse cells. The tracking module is so configured that the second current scaled by the predetermined factor is substantially equal to the second sub-current, thereby avoiding the first sub-current to be reduced by the second sub-current.