Abstract: A built-in self-test circuit for testing a voltage controlled oscillator comprises a voltage controlled oscillator, a buffer having an input coupled to an output of the voltage controlled oscillator and a radio frequency peak detector coupled to the output of the buffer. The radio frequency peak detector is configured to receive an ac signal from the voltage controlled oscillator and generate a dc value proportional to the ac signal at an output of the radio frequency peak detector. Furthermore, the output of the radio frequency peak detector generates a dc value proportional to an amplitude of the ac signal from the voltage controlled oscillator when the voltage controlled oscillator functions correctly. On the other hand, the output of the radio frequency peak detector is at zero volts when the voltage controlled oscillator fails to generate an ac signal.

Abstract: A system comprises a voltage controlled oscillator comprising an inductor and a variable capacitor and a switched capacitor array connected in parallel with the variable capacitor. The switched capacitor array further comprises a plurality of capacitor banks wherein a thermometer code is employed to control each capacitor bank. In addition, the switched capacitor array provides N tuning steps for the oscillation frequency of the voltage controlled oscillator when the switched capacitor array is controlled by an n-bit thermometer code.

Abstract: A first terminal and a second terminal of a FinFET transistor are used as two terminals of an anti-fuse. To program the anti-fuse, a gate of the FinFET transistor is controlled, and a voltage having a predetermined amplitude and a predetermined duration is applied to the first terminal to cause the first terminal to be electrically shorted to the second terminal.

Abstract: An ESD protection circuit includes a signal pad, a short circuited shunt stub on-chip with and coupled to the signal pad, an open circuited shunt stub on-chip and coupled to the signal pad.

Abstract: A method of forming a semiconductor device is provided. The method includes forming a first fin above a substrate, forming a first emitter region in a first portion of the first fin, forming a first collector region in a second portion of the first fin, and forming a first base region in a third portion of the first fin. The third portion of the first fin is disposed underneath a first gate electrode. The method further includes forming a second fin adjacent to the first fin and above the substrate. The second fin is composed of a semiconductor material. The method also includes forming a first base contact over the second fin. The first base contact is coupled to the first base region through the second fin, the substrate, and the first fin.

Abstract: A method of designing an integrated circuit includes providing a cell library including a first and second cell structures. The cell structures each include a dummy gate electrode disposed on a boundary. An edge gate electrode is disposed adjacent to the dummy gate electrode. An oxide definition (OD) region has an edge disposed between the edge gate electrode and the dummy gate electrode. The method includes determining if the cell structures are to be abutted with each other. If so, the method includes abutting the cell structures. If not so, the method includes increasing areas of portions of the OD regions between the edge gate electrodes and the dummy gate electrodes.

Abstract: A low-noise amplifier (LNA) includes a first cascode gain stage coupled to an input node for increasing an amplitude of an RF input signal. A first variable gain network is coupled to the first cascode gain stage and includes a first inductor for boosting a gain of the first cascode gain stage, a first capacitor coupled to the first inductor for blocking a direct current (DC) voltage, and a first switch coupled to the first inductor and to the first capacitor. The first switch is configured to selectively couple the first inductor to the first cascode gain stage in response to a first control signal.

Abstract: A method for programming a multi-level electrical fuse system comprises providing a fuse box with an electrical fuse and providing one of at least two fuse writing voltages to the electrical fuse to program the electrical fuse to one of at least two resistance states. The fuse box comprises at least one electrical fuse, a programming device serially coupled to the electrical fuse, and a variable power supply coupled to the fuse box and configured to generate two or more voltage levels.

Abstract: A clock and data recovery (CDR) circuit includes an inductor-capacitor voltage controlled oscillator (LCVCO) configured to generate a clock signal with a clock frequency. A delay locked loop (DLL) is configured to receive the clock signal from the LCVCO and generate multiple clock phases. A charge pump is configured to control the LCVCO. A phase detector is configured to receive a data input and the multiple clock phases from the DLL, and to control the first charge pump in order to align a data edge of the data input and the multiple clock phases.

Abstract: A circuit includes an oscillator circuit including a first oscillator and a second oscillator. The first and the second oscillators are configured to generate signal having a same frequency and different phases. A transmission line is coupled between the first and the second oscillators.

Abstract: A quadrature oscillator includes a first oscillator having a first second-order harmonic node, a second oscillator having a second second-order harmonic node, and at least one capacitor coupling the first second-order harmonic node and the second second-order harmonic node. The first oscillator is configured to supply an in-phase signal and the second oscillator is configured to supply a quadrature signal.

Abstract: Design and methods for fabricating bipolar junction transistors are described. In one embodiment, a semiconductor device includes a first fin comprising a first emitter region, a first base region, and a first collector region. The first emitter region, the first base region, and the first collector region form a bipolar junction transistor. A second fin is disposed adjacent and parallel to the first fin. The second fin includes a first contact to the first base region.

Abstract: A method of forming an integrated circuit includes forming at least one transistor over a substrate. The at least one transistor includes a first gate dielectric structure disposed over a substrate. A work-function metallic layer is disposed over the first gate dielectric structure. A conductive layer is disposed over the work-function metallic layer. A source/drain (S/D) region is disposed adjacent to each sidewall of the first gate dielectric structure. At least one resistor structure is formed over the substrate. The at least one resistor structure includes a first doped semiconductor layer disposed over the substrate. The at least one resistor structure does not include any work-function metallic layer between the first doped semiconductor layer and the substrate.

Abstract: An integrated circuit includes a digital-to-analog converter (DAC) circuit including at least one first channel type DAC and at least one second channel type DAC. The integrated circuit includes a plurality of sample and hold (S/H) circuits. Each of the S/H circuits is coupled with the DAC circuit. The S/H circuits are capable of receiving signals from the DAC circuit and outputting the signals in parallel.

Abstract: An integrated circuit includes an inductor-capacitor (LC) tank circuit coupled with a feedback loop. The LC tank circuit is configured to output an output signal having a peak voltage that is substantially equal to a direct current (DC) voltage level plus an amplitude. The feedback loop is capable of determining if the peak voltage of the output signal falls within a range between a first voltage level and a second voltage level for adjusting the amplitude of the output signal.

Abstract: A representative level-shifter comprises a dynamically biased current source circuit that receives a first voltage, a first and a second unidirectional current-conducting devices, a first and a second pull-down devices, and a pull-up device. The first and second unidirectional current-conducting devices are coupled to the dynamically biased current source circuit. A voltage output of the level-shifter is located at a first node that is located between the current-constant circuit and the second unidirectional current-conducting device. The first and second pull-down devices are coupled to the first and second unidirectional current-conducting devices, respectively. The pull-up device receives a second voltage and is coupled to the dynamically biased current source circuit and the first unidirectional current-conducting device.

Abstract: A millimeter-wave wideband frequency doubler stage for use in a distributed frequency doubler includes: a differential input pair of transistors, each transistor having respective gate, drain and source terminals, wherein the source terminals are coupled together to a first power supply node and the drain terminals are coupled together at a first node to a second power supply node; first and second pairs of bandpass gate lines coupled to the gate terminals of the transistors; and a pair of bandpass drain lines coupled to the drain terminals of the transistors.

Abstract: Methods and apparatuses for time to digital conversion (TDC) are disclosed. A timing circuit comprises a TDC circuit, a calibration module, and a correction module. The TDC circuit is configured to provide a timing signal indicative of a timing difference between edges of a periodic reference clock signal and a variable feedback signal. The TDC circuit is also configured to provide a delay signal that is variably delayed relative to the reference clock signal. The calibration module is configured to provide a calibration signal to increase and decrease a total delay of the TDC circuit based on a time delay of the calibration signal plus a time delay of a correction signal. The correction module, which is configured to receive the timing signal and provide the correction signal, minimizes harmonic spurs in a frequency response of the timing signal by operating at a frequency of the reference clock signal.

Abstract: A circuit includes an oscillator circuit including a first oscillator and a second oscillator. The first and the second oscillators are configured to generate signal having a same frequency and different phases. A transmission line is coupled between the first and the second oscillators.

Abstract: A circuit and method for a digital process monitor is disclosed. Circuits for comparing a current or voltage to a current or voltage corresponding to a device having process dependent circuit characteristics are disclosed, having converters for converting current or voltage measurements proportional to the process dependent circuit characteristic to a digital signal and outputting the digital signal for monitoring. The process dependent circuit characteristics may be selected from transistor threshold voltage, transistor saturation current, and temperature dependent quantities. Calibration is performed using digital techniques such as digital filtering and digital signal processing. The digital process monitor circuit may be formed as a scribe line circuit for wafer characterization or placed in an integrated circuit die as a macro. The process monitor circuit may be accessed using probe pads or scan test circuitry. Methods for monitoring process dependent characteristics using digital outputs are disclosed.