Abstract: A mixed mode compensation circuit for a power converter generate a digital signal according to a reference signal and a feedback signal which is related to the output voltage of the power converter, convert the digital signal into a first analog signal, offset the first analog signal with a variable offset value to generate a second analog signal, and filter out high-frequency components of the second analog signal to generate a third analog signal for stable output voltage of the power converter. The mixed mode compensation does not require large capacitors, and thus the circuit can be integrated into an integrated circuit.

Abstract: In some aspects, methods of forming a metal sulfide thin film are provided. According to some methods, a metal sulfide thin film is deposited on a substrate in a reaction space in a cyclical process where at least one cycle includes alternately and sequentially contacting the substrate with a first vapor-phase metal reactant and a second vapor-phase sulfur reactant. In some aspects, methods of forming a three-dimensional architecture on a substrate surface are provided. In some embodiments, the method includes forming a metal sulfide thin film on the substrate surface and forming a capping layer over the metal sulfide thin film. The substrate surface may comprise a high-mobility channel.

Abstract: A frequency jittering control circuit for a PFM power supply includes a pulse frequency modulator to generate a frequency jittering control signal to switch a power switch to generate an output voltage. The frequency jittering control circuit jitters an input signal or an on-time or off-time of the pulse frequency modulator to jitter the switching frequency of the power switch to thereby improve EMI issue.

Abstract: An AC-to-DC power converter with a BJT as a power switch can set a base current of the BJT by a current setting resistor which is in the outside of a control integrated circuit. Since an output current and a recovery current of the BJT are injected into a sensing resistor, the AC-to-DC power converter can correctly detect an inductor current thereof from the sensing resistor.

Abstract: In some embodiments, an MIS-type contact structure is formed by passivating the semiconductor surface of a source/drain region with a chalcogen, and subsequently depositing an tunnel layer by first exposing the chalcogen-passivated surface to a metal-organic precursor. Subsequently, deposition of the tunnel layer continues to a desired thickness. Preferably, the metal-organic precursor is part of a first set of ALD precursors and a second set of ALD precursors, which include one or more metal or semimetal precursors, are subsequently used to continue the deposition. For example, the metal-organic precursor may be used to deposit a first portion of the tunnel layer, and an inorganic metal or inorganic semimetal precursor or a different organic metal or organic semimetal precursor may be used to deposit a second portion of the tunnel layer. A metal is subsequently deposited on the tunnel layer, e.g., to form a metal electrode or electrical contact.

Abstract: An apparatus and a method for implementing a multiple function pin in a boundary conduction mode power supply, uses a same pin to switch a power switch and to achieve zero current detection to reduce pin count and save cost of a control integrated circuit. A first voltage is applied to the multiple function pin to turn on the power switch, and then a second voltage is applied to the multiple function pin after the power switch has been turned on for a first time, to thereby turn off the power switch. After the power switch has been turned off for a second time, a third voltage is applied to the multiple function pin keep the power switch off. Preferably, a tristate output driver is used to provide the first and second voltages, and a clamping circuit is used to provide the third voltage.

Abstract: A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have, a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion d having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.

Abstract: In some embodiments, an oxide layer is grown on a semiconductor substrate by oxidizing the semiconductor substrate by exposure to hydrogen peroxide at a process temperature of about 500° C. or less. The exposure to the hydrogen peroxide may continue until the oxide layer grows by a thickness of about 1 ? or more. Where the substrate is a germanium substrate, while oxidation using H2O has been found to form germanium oxide with densities of about 4.25 g/cm3, oxidation according to some embodiments can form an oxide layer with a density of about 6 g/cm3 or more (for example, about 6.27 g/cm3). In some embodiments, another layer of material is deposited directly on the oxide layer. For example, a dielectric layer may be deposited directly on the oxide layer.

Abstract: In some aspects, methods of forming a metal sulfide thin film are provided. According to some methods, a metal sulfide thin film is deposited on a substrate in a reaction space in a cyclical process where at least one cycle includes alternately and sequentially contacting the substrate with a first vapor-phase metal reactant and a second vapor-phase sulfur reactant. In some aspects, methods of forming a three-dimensional architecture on a substrate surface are provided. In some embodiments, the method includes forming a metal sulfide thin film on the substrate surface and forming a capping layer over the metal sulfide thin film. The substrate surface may comprise a high-mobility channel.

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.

Abstract: A control circuit of a power converter includes: an input signal detection circuit, configured to operably detect a magnitude of an input signal to generate a detection signal; a clock generation circuit, configured to operably generate a clock signal; an error detection circuit, configured to operably generate an error signal according to a reference signal and a feedback signal; a control signal generation circuit, coupled with the clock generation circuit and the error detection circuit, configured to operably control a switching frequency of a power switch according to the clock signal and the error signal; and a reverse adjusting circuit, coupled with the input signal detection circuit, configured to operably adjust the clock generation circuit or the control signal generation circuit according to the detection signal to configure the switching frequency of the power switch to be inversely proportional to the magnitude of the input signal.

Abstract: The present invention provides a semiconductor structure and a method of fabricating the same. The method includes: providing a chip having conductive pads, forming a metal layer on the conductive pads, forming a passivation layer on a portion of the metal layer, and forming conductive pillars on the metal layer. Since the metal layer is protected by the passivation layer, the undercut problem is solved, the supporting strength of the conductive pillars is increased, and the product reliability is improved.

Abstract: A power system for an electric vehicle, an electric vehicle and a motor controller for an electric vehicle are provided. The power system includes: a power battery (10); a charge-discharge socket (20); a three-level bidirectional DC-AC module (30); a motor control switch (40); a charge-discharge control module (50) having a first terminal connected with an AC terminal of the three-level bidirectional DC-AC module (30) and a second terminal connected with the charge-discharge socket (20); and a control module (60) connected with a third terminal of the charge-discharge control module (50) and a third terminal of the motor control switch (40), and configured to control the charge-discharge control module (50) and the motor control switch (40) according to a current working mode of the power system.

Abstract: The present invention discloses a flyback power supply circuit with a programmable function and a control method thereof. The flyback power supply circuit includes: a transformer circuit, a power switch circuit, a primary side control circuit, an opto-coupler circuit, and a secondary side control circuit. The primary side control circuit determines whether an over voltage condition occurs, and further determines whether to generate an over voltage protection signal to turn OFF a power switch of the power switch circuit according to a rate of increase of a feedback signal and a control level, or according to the rate of increase of the feedback signal and a rate of change of a target control signal.

Abstract: A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion and having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.

Abstract: A semiconductor package is provided, which includes: a first semiconductor device having a first top surface and a first bottom surface opposite to the first top surface; a plurality of conductive balls formed on the first top surface of the first semiconductor device; a second semiconductor device having a second top surface and a second bottom surface opposite to the second top surface; and a plurality of conductive posts formed on the second bottom surface of the second semiconductor device and correspondingly bonded to the conductive balls for electrically connecting the first semiconductor device and the second semiconductor device, wherein the conductive posts have a height less than 300 um. Therefore, the present invention can easily control the height of the semiconductor package and is applicable to semiconductor packages having fine-pitch conductive balls.

Abstract: A package substrate is provided, which includes: a body having opposite first and second surfaces, each having adjacent first and second regions defined thereon; first and second circuit layers formed on the first and second surfaces of the body, respectively; a first insulating layer formed on the first surface of the body and having a plurality of first openings formed in the first insulating layer and positioned in the first and second regions; and a second insulating layer formed on the second surface of the body and having a plurality of second openings formed in the second insulating layer and positioned in the second region. Further, at least a third opening is formed in the second insulating layer and positioned in the first region to reduce the volume of the second insulating layer, thereby facilitating even distribution of thermal stresses through the first and second insulating layers during thermal cycling and hence preventing warpage of the package substrate.

Abstract: A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy.

Abstract: The present invention provides a flyback power converter with a programmable output and a control circuit and a control method thereof. The flyback power converter converts an input voltage to a programmable output voltage according to a setting signal, wherein the programmable output voltage switches between different levels. The flyback power converter includes: a transformer circuit, a power switch circuit, a current sense circuit, an opto-coupler circuit, and a control circuit. The control circuit adaptively adjusts an operation signal according to a level of the programmable output voltage, to maintain a same or relatively higher operation frequency of the operation signal when the programmable output voltage switches to a relatively lower level, so as to maintain a phase margin while supplying the same output current.

Abstract: A package structure is provided, including: a board having a plurality of conductive traces; a plurality of conductive pads formed on the board and each having a height greater than a height of each of the conductive traces; and an electronic component disposed on and electrically connected to the conductive pads via a plurality of conductive elements, wherein at least one of the conductive traces is positioned in proximity of at least one of the conductive pads. Therefore, the conductive elements are prevented from being in contact with the conductive traces, and the problem that the conductive pads and the conductive traces are shorted is solved. The present invention further provides a method for fabricating the packaging substrate.