Abstract: The present invention provides a flyback power converter with a programmable output and a control circuit and a control method thereof. The flyback power converter converts an input voltage to a programmable output voltage according to a setting signal, wherein the programmable output voltage switches between different levels. The flyback power converter includes: a transformer circuit, a power switch circuit, a current sense circuit, an opto-coupler circuit, and a control circuit. The control circuit adaptively adjusts an operation signal according to a level of the programmable output voltage, to maintain a same or relatively higher operation frequency of the operation signal when the programmable output voltage switches to a relatively lower level, so as to maintain a phase margin while supplying the same output current.

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.

Abstract: The disclosure provides a substrate construction applicable to a 3D package, including a silicon substrate for carrying a chip on an upper side thereof, and a circuit structure formed underneath the silicon substrate for being connected to solder balls via conductive pads of the circuit structure, thereby obtaining the same specification of the conductive pads as ball-planting pads of conventional package substrates and avoiding the manufacturing and use of conventional package substrates.

Abstract: A flyback power converter circuit converting an input voltage to an output voltage includes a transformer, a power switch, a synchronous rectifier (SR) switch, and a secondary side control circuit. The secondary side control circuit controls the SR switch to be ON when the power switch is OFF. The secondary side control circuit includes a driving switch for controlling the SR switch, a synchronous control circuit powered by a voltage related to the output voltage, which controls the driving switch to operate the SR switch, and a clamping circuit including a clamping switch and a clamping switch control circuit. The clamping switch control circuit controls the clamping switch according to a current inflow terminal voltage of the clamping switch and/or the voltage related to the output voltage, such that, during a secondary side power-on period, an equivalent impedance of the current inflow terminal of the clamping switch is smaller than a predetermined clamping impedance.

Abstract: A method for fabricating an electronic package is provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant on the carrier for encapsulating the electronic element and the package block; and removing the carrier so as to expose the electronic element and the conductive posts from a surface of the encapsulant. As such, the invention dispenses with formation of through holes in the encapsulant for forming the conductive posts as in the prior art, thereby saving the fabrication cost.

Abstract: The present invention provides a power switch control circuit and an open detection method thereof. The power switch control circuit is for generating an operation signal at an operation signal output pin according to an input signal, wherein the operation signal is for operating a power switch. The power switch control circuit includes: a current injection circuit, which is connected to the operation signal output pin, and provides a predetermined current to the operation signal output pin according to an enable signal; and an open detection circuit, which is coupled to the current injection circuit, and determines whether a connection between the operation signal output pin and the power switch is open according to a level of the operation signal output pin at a detection time point or according to a level variation of the operation signal output pin during a detection time period, whereby an open detection signal is generated.

Abstract: A charging system for an electric vehicle and an electric vehicle including the same are provided. The charging system includes: a power battery; a first charging interface and a second charging interface connected with an external power source respectively; a first charging control branch connected between the power battery and the first charging interface, and a second charging control branch connected between the power battery and the second charging interface; and a controller connected with the first charging interface and the second charging interface respectively.

Abstract: A package stack structure is provided, including a first substrate, a second substrate stacked on the first substrate, and an encapsulant formed between the first substrate and the second substrate. A through hole is formed to penetrate the second substrate and allow the encapsulant to be filled therein, thereby increasing the contact area and hence strengthening the bonding between the encapsulant and the second substrate.

Abstract: A mixed mode compensation circuit for a power converter generate a digital signal according to a reference signal and a feedback signal which is related to the output voltage of the power converter, convert the digital signal into a first analog signal, offset the first analog signal with a variable offset value to generate a second analog signal, and filter out high-frequency components of the second analog signal to generate a third analog signal for stable output voltage of the power converter. The mixed mode compensation does not require large capacitors, and thus the circuit can be integrated into an integrated circuit.

Abstract: An AC-to-DC power converter with a BJT as a power switch can set a base current of the BJT by a current setting resistor which is in the outside of a control integrated circuit. Since an output current and a recovery current of the BJT are injected into a sensing resistor, the AC-to-DC power converter can correctly detect an inductor current thereof from the sensing resistor.

Abstract: A system and a method for passivating a surface of a semiconductor. The method includes providing the surface of the semiconductor to a reaction chamber of a reactor, exposing the surface of the semiconductor to a gas-phase metal containing precursor in the reaction chamber and exposing the surface of the semiconductor to a gas-phase chalcogenide containing precursor. The methods also include passivating the surface of the semiconductor using the gas-phase metal containing precursor and the gas-phase chalcogenide containing precursor to form a passivated surface.

Abstract: In one exemplary embodiment, a wireless communication apparatus transmitting data by using several sub-carriers. The wireless communication apparatus comprises a signal modulator, a signal processor, a storage, a computing processor, and a transmitter. The signal modulator generates a modulated signal in time domain based on the data. The signal processor performs signal processing on the modulated signal, and comprises a window module and a filter module. The window module performs windowing operation on the modulated signal to generate a window-operated signal. The filter module performs filtering operation on the window-operated signal to generate a transmitting signal in time domain. The computing processor performs operations of setting up the window module and the filter module according to a window characteristic function and a filter characteristic function. The transmitter transmits the transmitting signal.

Abstract: In some aspects, methods of forming a metal sulfide thin film are provided. According to some methods, a metal sulfide thin film is deposited on a substrate in a reaction space in a cyclical process where at least one cycle includes alternately and sequentially contacting the substrate with a first vapor-phase metal reactant and a second vapor-phase sulfur reactant. In some aspects, methods of forming a three-dimensional architecture on a substrate surface are provided. In some embodiments, the method includes forming a metal sulfide thin film on the substrate surface and forming a capping layer over the metal sulfide thin film. The substrate surface may comprise a high-mobility channel.

Abstract: Improved methods and systems for passivating a surface of a high-mobility semiconductor and structures and devices formed using the methods are disclosed. The method includes providing a high-mobility semiconductor surface to a chamber of a reactor and exposing the high-mobility semiconductor surface to a gas-phase chalcogen precursor to passivate the high-mobility semiconductor surface.

Abstract: An electronic package is provided, which includes: a first substrate; a first electronic component disposed on the first substrate; a second substrate stacked on the first substrate through a plurality of first conductive elements and a plurality of second conductive elements and bonded to the first electronic component through a bonding layer; and a first encapsulant formed between the first substrate and the second substrate. The first conductive elements are different in structure from the second conductive elements so as to prevent a mold flow of the first encapsulant from generating an upward pushing force during a molding process and hence avoid cracking of the second substrate. The present disclosure further provides a method for fabricating the electronic package.

Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.

Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.

Abstract: Improved methods and systems for passivating a surface of a high-mobility semiconductor and structures and devices formed using the methods are disclosed. The method includes providing a high-mobility semiconductor surface to a chamber of a reactor and exposing the high-mobility semiconductor surface to a gas-phase sulfur precursor to passivate the high-mobility semiconductor surface.

Abstract: A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.

Abstract: A medical system includes an interaction interface and an analysis engine. The interaction interface is configured for receiving an initial symptom. The analysis engine is communicated with the interaction interface. The analysis engine includes a prediction module. The prediction module is configured for generating symptom inquiries to be displayed on the interaction interface according to a prediction model and the initial symptom. The interaction interface is configured for receiving responses corresponding to the symptom inquiries. The prediction module is configured to generate a result prediction according to the prediction model, the initial symptom and the responses.