Abstract: Optical devices and methods of manufacture are presented in which optical interposers are embedded within interposers. In some embodiments a method includes embedding an optical interposer into an interposer with one or more waveguides, with or without other semiconductor devices, and then bonding one or more semiconductor devices onto the interposer.

Abstract: A health care device includes a health care body for positioning a body part of a user, so as to maintain a first specific positional relationship with the body part, wherein the body part has an acupoint; an acupoint work piece for performing a health care work onto the use through the acupoint; and a work piece holder having a first end connected to the health care body and a second end for fixing the acupoint work piece, so that under the first specific positional relationship, the acupoint work piece performs the health care work under the condition that the acupoint work piece has a second specific positional relationship with the acupoint. A health care body, method and system are also provided.

Abstract: An inspection apparatus for inspecting a semiconductor workpiece includes a testing stage, a first seal member, a testing clamp, a second seal member, a semiconductor workpiece, and a transducer. The testing stage has a cavity. The first seal member is disposed in the cavity. The first seal member is attached to a sidewall of the cavity. The testing clamp is movably coupled to the testing stage. The second seal member is attached to the testing clamp. The semiconductor workpiece is held between the testing stage and the testing clamp by the first seal member and the second seal member. The transducer is movably disposed above the testing stage.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: An electrical discharge machining equipment with equal-energy density comprises an electrode, a parameter database, a signal capturing device and a controller. The parameter database stores an equal-energy density sheet comprising a plurality of processing parameter sets. Each processing parameter set is corresponding to a material removed volume and comprises a discharge energy, a discharge parameter, a feed rate and an energy density. The signal capturing device detects a first discharge parameter of the electrode during machining a work piece. The controller selects a first feed rate to control the electrode. When the first discharge parameter changes to a second discharge parameter, the controller calculates a material volume of the workpiece according to the second discharge parameter and the equal-energy density sheet, and selects a second feed rate according to the material volume, the material removed volume and the equal-energy density sheet to control the electrode for processing the workpiece.

Abstract: An image sensor, including a photosensitive pixel array, a storage element, and a displacement processing element, is provided. The photosensitive pixel array includes a photosensitive pixel. The storage element is configured to store a first sensing result of the photosensitive pixel at a first time point. The displacement processing element is coupled to the storage element to receive the first sensing result. The displacement processing element is configured to generate displacement information, wherein an image frame with the displacement information is transmitted to the outside of the image sensor.

Abstract: An electrostatic discharge (ESD) circuit includes a first ESD detection circuit, a first discharging circuit and a first ESD assist circuit. The first ESD detection circuit is coupled between a first node having a first voltage and a second node having a second voltage. The first discharging circuit includes a first transistor. The first transistor has a first gate, a first drain, a first source and a first body terminal. The first gate is coupled to the first ESD detection circuit by a third node. The first drain is coupled to the first node. The first source and the first body terminal are coupled together at the second node. The first ESD assist circuit is coupled between the second and third node, and configured to clamp a third voltage of the third node at the second voltage during an ESD event at the first or second node.

Abstract: A semiconductor device includes a semiconductor die and a conductive structure disposed side-by-side and spaced apart from each other through an insulating encapsulant. The conductive structure includes a first conductor laterally covered by the insulating encapsulant, and a second conductor disposed over and separating from the first conductor. The second conductor includes a first portion laterally covered by the insulating encapsulant and a second portion protruded from the insulating encapsulant, where a ratio of a first standoff height of the first portion and a second standoff height of the second portion ranges from about 0.4 to about 1.5.

Abstract: An inductor driving device includes multiple switching elements and a control circuit, wherein an inductor is driven according to switching of the multiple switching elements. The control circuit is arranged to generate a control signal for controlling the multiple switching elements. In a first mode, the control signal has a constant frequency. In a second mode, the control circuit adjusts a frequency of the control signal and continuously changes a current direction of the inductor, to generate one of multiple audio signals through the inductor.

Abstract: The sum of torques: the torque of the sun gear and the torque of the internal gear, and the ratio of the torques are controlled within predetermined ranges.

Abstract: Systems and methods for fast merging of panelist activity are disclosed. The system can maintain a plurality of panelist identifiers each stored with a respective plurality of offline content events, and identify, from the plurality of panelist identifiers, a subset of panelist identifiers that are stored with a respective offline content event that matches a target offline content event. The system can map each of the subset to a respective plurality of unique identifiers corresponding to virtual devices having virtual device attributes. The system can reduce, for each of the subset, the respective plurality of unique identifiers to a sketch that represents the respective plurality of unique identifiers. The system can combine the sketch of each of the subset of panelist identifiers into an aggregated sketch, and transmit the aggregated sketch to a computing device for analysis with an aggregated sketch representing online content events.

Abstract: An electro-optical device includes a waveguide and a first electrode and a second electrode. The first electrode and the second electrode at first and second sides of the waveguide, wherein the first electrode and the second electrode directly contact and extend beyond the first and second sides of the waveguide respectively.

Abstract: A light string includes a housing, a light cap, and a light assembly. The light cap has a cap body, an upper tip at an upper end of the cap body, and a peripheral visibility ring extending outwardly from the cap body opposite the upper tip. The light cap is coupled to and extends from the housing such that the peripheral visibility ring seats adjacent to an end of the housing proximate the light aperture. The light assembly includes a light emitting source that is positioned such that when energized, light is emitted that is visible from outside the light cap. Moreover, the peripheral visibility ring reflects light in a direction different from the light emitted by the light emitting source such that the light emitted by the light emitting source is visible when an observer is looking at a side view of the cap body.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.

Abstract: A composite wafer may be provided by: forming a layer stack including a carrier layer, an ion implantation layer, and a transfer material layer by implanting ions into a donor wafer; forming intersecting trenches through the transfer material layer, the ion implantation layer, and an upper portion of the carrier layer; attaching the layer stack to an acceptor wafer including a stack of a handle substrate and a first dielectric oxide layer by bonding the layer stack to the first dielectric oxide layer; and cleaving the layer stack at the ion implantation layer, whereby a composite wafer including the acceptor wafer and patterned portions of the transfer material layer is formed.

Abstract: Optical devices and methods of manufacture are presented in which a multi-tier connector is utilized to transmit and receive optical signals to and from an optical device. In embodiments a multi-tier connection unit receives optical signals from outside of an optical device, wherein the optical signals are originally in multiple levels. The multi-tier connection unit then routes the optical signals into a single level of optical components.

Abstract: A device structure includes: an interposer including metal wiring structures and optical waveguides that are embedded in interlayer dielectric layers, wherein the interposer includes a stepped outer sidewall including an outermost vertical surface segment, a laterally-recessed sidewall segment that is laterally recessed relative to the outermost vertical surface segment, and a connecting horizontal surface segment that connects the outermost vertical surface segment and the laterally-recessed vertical sidewall segment; and a fiber access unit having a first end that is optically coupled to a subset of the optical waveguides through at least one optical glue portion that is interposed between the fiber access unit and the laterally-recessed sidewall segment of the stepped outer sidewall.

Abstract: An inductor driving device includes multiple switching elements and a control circuit, wherein an inductor is driven according to switching of the multiple switching elements. The control circuit is arranged to generate a control signal for controlling the multiple switching elements. In a first mode, the control signal has a constant frequency. In a second mode, the control circuit adjusts a frequency of the control signal and continuously changes a current direction of the inductor, to generate one of multiple audio signals through the inductor.