Abstract: A device is disclosed herein. The device includes a bias generator, an ESD driver, and a logic circuit. The bias generator includes a first transistor. The ESD driver includes a second transistor and a third transistor coupled to each other in series. The logic circuit is configured to generate a logic control signal. When the first transistor is turned on by a detection signal, the first transistor is turned off.

Abstract: A control circuit arranged to detect an initial rotor position of a brushless DC motor includes: a voltage integrator circuit, arranged to perform integration upon an input voltage, to generate a plurality of integrated voltages; a PWM generating circuit, arranged to generate and output a plurality of PWM signals to the brushless DC motor through a drive circuit, and stop outputting a PWM signal that is any of the plurality of PWM signals to the brushless DC motor according to an integrated voltage corresponding to the PWM signal; a current receiving circuit, arranged to receive a plurality of feedback currents from the brushless DC motor; a comparison circuit, arranged to perform comparison upon the plurality of feedback currents, to generate a comparison result; and a decision circuit, arranged to detect the initial rotor position according to the comparison result.

Abstract: Methods and devices are provided herein for enhancing robustness of a bipolar electrostatic discharge (ESD) device. The robustness of a bipolar ESD device includes providing an emitter region and a collector region adjacent to the emitter region. An isolation structure is provided between the emitter region and the collector region. A ballasting characteristic at the isolation structure is modified by inserting at least one partition structure therein. Each partition structure extends substantially abreast at least one of the emitter and the collector regions.

Abstract: An image sensor, including a photosensitive pixel array, a storage element, and a displacement processing element, is provided. The photosensitive pixel array includes a photosensitive pixel. The storage element is configured to store a first sensing result of the photosensitive pixel at a first time point. The displacement processing element is coupled to the storage element to receive the first sensing result. The displacement processing element is configured to generate displacement information, wherein an image frame with the displacement information is transmitted to the outside of the image sensor.

Abstract: A semiconductor device includes a semiconductor die and a conductive structure disposed side-by-side and spaced apart from each other through an insulating encapsulant. The conductive structure includes a first conductor laterally covered by the insulating encapsulant, and a second conductor disposed over and separating from the first conductor. The second conductor includes a first portion laterally covered by the insulating encapsulant and a second portion protruded from the insulating encapsulant, where a ratio of a first standoff height of the first portion and a second standoff height of the second portion ranges from about 0.4 to about 1.5.

Abstract: A device is disclosed herein. The device includes a bias generator, an ESD driver, and a logic circuit. The bias generator includes a first transistor. The ESD driver includes a second transistor and a third transistor coupled to each other in series. The logic circuit is configured to generate a logic control signal. A first terminal of the first transistor is configured to receive a reference voltage signal, a control terminal of the first transistor is configured to receive a detection signal in response to an ESD event being detected, a second terminal of the first transistor is coupled to a control terminal of the third transistor, and a control terminal of the second transistor is configured to receive the logic control signal.

Abstract: Embodiments provide a precutting technique to cut parallel openings at a front surface of a device wafer, then flipping the device wafer over and completing the cut from the back side of the device wafer to singulate a die from the wafer. The precutting technique and back side cutting technique combined provides an indentation in the side surface(s) of the device.

Abstract: A computer system for failing a secure boot in a case tampering event comprises a trusted platform module (TPM), for generating a plurality of random bytes for a secure boot of the computer system; a bootloader, for storing information in at least one hardware of the computer system and performing the secure boot, wherein the information comprises the plurality of random bytes, and the TPM is comprised in the bootloader; an operating system (OS), for performing the secure boot; and at least one sensor, for detecting a case tampering event in the computer system, and transmitting a signal for triggering a deletion of the plurality of random bytes, if the case tampering event happens in the computer system. The bootloader or the OS performs the operation of deleting the plurality of random bytes stored in the at least one hardware to fail the secure boot, in response to the signal.

Abstract: A remote virtual system for remote boot up of a BMC on a node of a networked multi-node system is disclosed. A host server stores a firmware image. A network is coupled to the host server. A first node is coupled to the network. The first node includes a first controller executing the firmware image. The host server boots-up the controller and sends the firmware image to the first controller to complete a boot-up of the controller.

Abstract: The sum of torques: the torque of the sun gear and the torque of the internal gear, and the ratio of the torques are controlled within predetermined ranges.

Abstract: The present disclosure provides a cooking utensil, comprising a blank of the cooking utensil, and a non-stick layer coated on the surface of the blank; the non-stick layer comprises a primer layer in contact with one side of the blank, and a sheet-like graphene, a sheet-like graphene derivative or a combination thereof uniformly distributed in the primer layer. The present disclosure also provides a method for manufacturing of the cooking utensil. The present disclosure fully realizes the heat conduction between the blank and the food through the sheet-like graphene, the sheet-like graphene derivative or the combination thereof, and effectively improves the heating speed and the heating uniformity.

Abstract: An integrated circuit (IC) configurable to perform adaptive thermal ceiling control in a per-functional-block manner, an associated main circuit, an associated electronic device and an associated thermal control method are provided. The IC may include a plurality of hardware circuits arranged to perform operations of a first functional block, and at least one thermal control circuit. At least one temperature sensor is coupled with the first functional block to detect temperature and to generate at least one temperature sensing result of the first functional block.

Abstract: An electrostatic discharge (ESD) protection circuit is coupled between first and second power supply buses. The ESD protection circuit includes a detection circuit; a pull-up circuit, coupled to the detection circuit, comprising at least a first n-type transistor; a pull-down circuit, coupled to the pull-up circuit, comprising at least a second n-type transistor; and a bypass circuit, coupled to the pull-up and pull-down circuits, wherein the detection circuit is configured to detect whether an ESD event is present on either the first or the second bus so as to cause the pull-up and pull-down circuits to selectively enable the bypass circuit for providing a discharging path between the first and second power supply buses.

Abstract: An electronic device and a manufacturing method thereof are provided. The method includes at least the following steps. An insulating encapsulant is formed to encapsulate a multi-layered structure and a semiconductor die, where the multi-layered structure includes a first conductor, a diffusion barrier layer on the first conductor, and a metallic layer on the diffusion barrier layer, and the insulating encapsulant at least exposes a portion of the semiconductor die and a portion of the first conductor. A redistribution structure is formed over the insulating encapsulant, the semiconductor die, and the first conductor. The metallic layer is removed to form a recess in the insulating encapsulant. A second conductor is formed in the recess over the diffusion barrier layer, where the first conductor, the diffusion barrier layer, and the second conductor form a conductive structure that is electrically coupled to the semiconductor die through the redistribution structure.

Abstract: A health care device includes a health care body for positioning a body part of a user, so as to maintain a first specific positional relationship with the body part, wherein the body part has an acupoint; an acupoint work piece for performing a health care work onto the use through the acupoint; and a work piece holder having a first end connected to the health care body and a second end for fixing the acupoint work piece, so that under the first specific positional relationship, the acupoint work piece performs the health care work under the condition that the acupoint work piece has a second specific positional relationship with the acupoint. A health care body, method and system are also provided.

Abstract: A health care device includes a health care body for positioning a body part of a user, so as to maintain a first specific positional relationship with the body part, wherein the body part has an acupoint; an acupoint work piece for performing a health care work onto the use through the acupoint; and a work piece holder having a first end connected to the health care body and a second end for fixing the acupoint work piece, so that under the first specific positional relationship, the acupoint work piece performs the health care work under the condition that the acupoint work piece has a second specific positional relationship with the acupoint. A health care body, method and system are also provided.

Abstract: An isolated switched-mode power converter converts power from an input source into power for an output load. A digital controller senses a secondary-side voltage, such as a rectified voltage, of the power converter. The secondary-side voltage is divided down using a high-impedance voltage divider. The resultant divided-down voltage is provided to a voltage sensor within the digital controller. The voltage sensor level shifts the provided voltage, and buffers the resulting level-shifted voltage. The buffered, level-shifted voltage is provided to a tracking analog-to-digital converter (ADC) for digitization. The buffered signal provided to the tracking ADC has a high current capability, such that the voltage input to the tracking ADC may quickly converge before the tracking ADC outputs a digital value for the sensed secondary-side voltage.

Abstract: A method for determining an initial rotor position of a permanent magnet synchronous motor (PMSM) includes: generating a plurality of transient currents by applying a plurality of voltages to each phase stator winding of a three phase stator winding of the PMSM; generating three phase current differences according to the plurality of transient currents; determining a first zone in which the initial rotor position of the PMSM is located according to the three phase current differences, wherein angles between 0-360 degrees are divided into a plurality of zones, and the first zone is selected from the plurality of zones; calculating three line current differences according to the three phase current differences; and determining the initial rotor position of the PMSM according to the first zone and the three line current differences.

Abstract: An ESD power clamp device includes an ESD detection circuit; a controlling circuit coupled with the ESD detection circuit; a field effect transistor (FET) coupled with the controlling circuit, and an impedance element coupled with the FET. The FET includes a drain terminal coupled with a first supply node; a gate terminal coupled with the controlling circuit; a source terminal coupled with a second supply node via the impedance element; and a bulk terminal coupled with second supply node.

Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.