Patents by Inventor Fu Tsai

Fu Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LED LIGHT STRING
    Publication number: 20130182439
    Abstract: A design of light string comprises a bulb socket, a pair of conductive wires, and LED electrically disposed onto the bulb socket. The LED is incorporated with a pair of legs which are alternatively in contact with the pair of conductive wires, and then are sandwiched between a pair of first and second casings which jointly configures the light bulb. This configuration simplifies the assembling of the conductive wires and LED such that no need of solder or glue or contacts.
    Type: Application
    Filed: March 19, 2012
    Publication date: July 18, 2013
    Inventor: Chang-Fu TSAI
  • Socket having symmetrically arranged first and second casings with interlocking arrangements to define a LED seat
    Patent number: 8485830
    Abstract: An socket for light string is provided to include a pair of symmetrically arranged first and second casings mated together. Each of the first and second casings is featured with a side opening, and a first and second end channels, interlocking arrangements provided at internal wall thereof so as to securely interlock the first and second casings to configure the socket with a LED seat formed by the openings to host an LED, and passages for securely receiving conductive wires configured by the first and second channels. A partition is provided under the LED seat so as to insulatively isolated the conductive wires. Inner surfaces of the channels are provided with teeth to firmly hold the conductive wires. The socket is preferable for the use of configuring a light string.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: July 16, 2013
    Inventor: Chang Fu Tsai
  • Video switching system and method
    Patent number: 8471891
    Abstract: A video switching system detects speaking information of at least one speaker in a video conference according to a reference time. One participant is regarded as one speaker if the one participant speaks longer than the reference time. The video switching system determines a main speaker of the at least one speaker according to the speaking information of the at least one speaker. The video switching system calculates an image switching frequency, and determines whether to switch to a video image of the main speaker according to the image switching frequency. The video switching system calculates a response time if determining to switch to the video image of the main speaker, and adjusts the reference time according to the image switching frequency and the response time.
    Type: Grant
    Filed: April 28, 2011
    Date of Patent: June 25, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Chih-Huang Wang, Hsieh-Fu Tsai
  • Electronic devices and methods
    Patent number: 8456222
    Abstract: The present invention relates to an electronic device, which comprises: a first module, comprising an I/O pad for being an interface between the electronic device and an external device, and receiving a first bias source; a second module, coupled to the first module, comprising a register, and receiving a second bias source; and a signal converter, coupled between the first module and the second module. Wherein when one of the first and second bias sources is stable and the other is unstable, the signal converter outputs a first predetermined bias value to the first or second modules receiving the unstable bias source.
    Type: Grant
    Filed: July 22, 2011
    Date of Patent: June 4, 2013
    Assignee: Realtek Semiconductor Corp.
    Inventors: Tay-Her Tsaur, Chih-Fu Tsai
  • Methods and Apparatus of Packaging Semiconductor Devices
    Publication number: 20130127052
    Abstract: Methods and apparatuses for wafer level packaging (WLP) semiconductor devices are disclosed. A redistribution layer (RDL) is formed on a first passivation layer in contact with a conductive pad over a surface of a die. The RDL layer is on top of a first region of the first passivation layer. A second passivation layer is formed on the RDL layer with an opening to expose the RDL layer, and over the first passivation layer. An under bump metallization (UBM) layer is formed over the second passivation layer in contact with the exposed RDL layer. A second region of the first passivation layer disjoint from the first region is determined by projecting an outer periphery of a solder ball or other connector onto the surface.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 23, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Wei Tu, Yian-Liang Kuo, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen
  • Bump-on-trace structures with wide and narrow portions
    Patent number: 8441127
    Abstract: A device includes a package component, and a metal trace on a surface of the package component. A first and a second dielectric mask cover a top surface and sidewalls of the metal trace, wherein a landing portion of the metal trace is located between the first and the second dielectric masks. The landing portion includes a first portion having a first width, and a second portion connected to an end of the first portion. The second portion has a second width greater than the first width, wherein the first and the second widths are measured in a direction perpendicular to a lengthwise direction of the metal trace.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: May 14, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fu-Tsai Hou, Liang-Chen Lin
  • Drive with heat dissipation and energy-saving function
    Patent number: 8427091
    Abstract: A drive with heat dissipation and energy-saving function for supplying power to drive a motor. The drive includes a driving circuit having a rectification section. The rectification section serves to receive AC current generated when the motor abruptly accelerates/decelerates and convert the AC current into DC current and output the DC current. The drive further includes a cooling module electrically connected to an output end of the rectification section. The cooling module is drivable by the DC current output from the rectification section to conduct out and dissipate heat.
    Type: Grant
    Filed: March 9, 2011
    Date of Patent: April 23, 2013
    Assignee: Hiwin Mikrosystem Corp.
    Inventors: Chi-Yuan Cheng, Ming Fu Tsai
  • Packaging Structures of Integrated Circuits
    Publication number: 20130087925
    Abstract: A chip includes a dummy connector disposed at a top surface of the chip. A seal ring encircles a region directly underlying the dummy connector, with the region overlapping the dummy connector.
    Type: Application
    Filed: October 5, 2011
    Publication date: April 11, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Chia-Wei Tu, Yian-Liang Kuo, Ru-Ying Huang
  • DISPLAY CONTROL APPARATUS AND DISPLAY CONTROL METHOD
    Publication number: 20130088428
    Abstract: A display control apparatus and a display control method are disclosed. The display control apparatus comprises a recognition circuit and a mapping circuit. The recognition circuit recognizes a head position and a control point position of an operator. The mapping circuit dynamically adjusts the operating boundary according to the head position, the control point position and a display boundary, and calculates the cursor position on a display according to the control point position, the operating boundary and the display boundary, wherein the cursor position remains on a imagine line passing through the head position and the control point position.
    Type: Application
    Filed: December 27, 2011
    Publication date: April 11, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Hung Ting, Chia-Chang Li, Chieh-Fu Tsai, Chien-Chun Kuo, Po-Lung Chen
  • METAL BUMP STRUCTURE
    Publication number: 20130026621
    Abstract: A semiconductor device comprises a substrate comprising a major surface and a plurality of metal bumps on the major surface. Each of the plurality of metal bumps comprises a metal via on the major surface and a metal pillar on the metal via having an overlay offset between the metal pillar and metal via. A first metal bump of the metal bumps has a first overlay offset and a second metal bump of the metal bumps farther than the first metal bump to a centroid of the substrate has a second overlay offset greater than the first overlay offset.
    Type: Application
    Filed: July 28, 2011
    Publication date: January 31, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Fu TSAI, Min-Feng KU, Yian-Liang KUO
  • Lens Film and Manufacturing Method Thereof
    Publication number: 20130003011
    Abstract: A lens film and a manufacturing method thereof are disclosed. The lens film manufacturing method includes the steps of: forming an alignment film on a glass substrate; rubbing the alignment film along a rubbing direction; dispersing a liquid crystal polymer (LCP) material between the alignment film of the glass substrate and a lens mold; rolling the lens mold along a rolling direction to make the LCP material to form a lens film. A plurality of liquid crystal molecules of the lens film is affected by the alignment film to align along the rubbing direction. The lens film and a base panel having a polarization direction are operated in a LCD apparatus. The angle between the rubbing direction and the polarization direction is less than 15°.
    Type: Application
    Filed: February 20, 2012
    Publication date: January 3, 2013
    Applicant: AU OPTRONICS CORPORATION
    Inventors: Tsai-Fu Tsai, Shih-Ming Chen, Yen-Hei Chiang, Chih-Ho Chiu, Hsi-Chien Lin
  • Bump-on-Trace Structures with Increased Current Entrance Areas
    Publication number: 20130001769
    Abstract: A device includes a package component, and a metal trace on a surface of the package component. A first and a second dielectric mask cover a top surface and sidewalls of the metal trace, wherein a landing portion of the metal trace is located between the first and the second dielectric masks. The landing portion includes a first portion having a first width, and a second portion connected to an end of the first portion. The second portion has a second width greater than the first width, wherein the first and the second widths are measured in a direction perpendicular to a lengthwise direction of the metal trace.
    Type: Application
    Filed: June 29, 2011
    Publication date: January 3, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fu-Tsai Hou, Liang-Chen Lin
  • Optoelectronic device and method for manufacturing the same
    Patent number: 8344409
    Abstract: An optoelectronic device comprising, a substrate and a first transition stack formed on the substrate comprising a first transition layer formed on the substrate having a hollow component formed inside the first transition layer, a second transition layer formed on the first transition layer, and a reflector rod formed inside the second transition layer.
    Type: Grant
    Filed: July 7, 2011
    Date of Patent: January 1, 2013
    Assignee: Epistar Corporation
    Inventors: Wei-Chih Peng, Ta-Cheng Hsu, Yu-Jiun Shen, Ching-Fu Tsai
  • Thermal gradient reflow for forming columnar grain structures for solder bumps
    Patent number: 8308052
    Abstract: A method includes heating a package structure including a first work piece and a second work piece to melt a plurality of solder bumps between the first and the second work pieces; and after the step of heating, allowing the plurality of solder bumps to solidify. During the step of solidifying, a first side of the package structure is maintained at a first temperature higher than a melting temperature of the plurality of solder bumps by using a heating source. During the step of solidifying, a second side of the package structure is maintained at a second temperature lower than the melting temperature by using a cooling source, wherein the second side is opposite the first side.
    Type: Grant
    Filed: November 24, 2010
    Date of Patent: November 13, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Horng Chang, Yian-Liang Kuo, Chih-Hang Tung, Tsung-Fu Tsai
  • Video decoding device and method
    Patent number: 8284840
    Abstract: A video decoding method includes receiving video data and transforming the video data from a Huffman tree to at least one full tree and at least one one-side tree. One microcode corresponding to the video coding standard that has encoded the received video data is read where a format of the read microcode is determined. The method further includes reading video data from the transformed video data according to the consuming length of the read microcode if the format of the read microcode is a leaf, and decoding the read video data according to the decoding field of the read microcode to output a decoding result.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: October 9, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsieh-Fu Tsai, Yi-Shin Li, Yi-Shin Tung, Sheng-Che Huang, Chun Hsu
  • DRIVE WITH HEAT DISSIPATION AND ENERGY-SAVING FUNCTION
    Publication number: 20120229059
    Abstract: A drive with heat dissipation and energy-saving function for supplying power to drive a motor. The drive includes a driving circuit having a rectification section. The rectification section serves to receive AC current generated when the motor abruptly accelerates/decelerates and convert the AC current into DC current and output the DC current. The drive further includes a cooling module electrically connected to an output end of the rectification section. The cooling module is drivable by the DC current output from the rectification section to conduct out and dissipate heat.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 13, 2012
    Inventors: Chi-Yuan Cheng, Ming Fu Tsai
  • SIGNAL COMPENSATION METHOD FOR MAGNETICALLY SENSITIVE POSITION FEEDBACK DEVICE
    Publication number: 20120229103
    Abstract: Signal compensation method for magnetically sensitive position feedback device in which the compensation for voltage offset is performed in accordance with the following formula (1), while the compensation for voltage amplitude is performed in accordance with the following formula (2): Voffset=(PreMaxV)/4+(NextMaxV)/4+(MaxV)/2,??formula (1) wherein: Voffset is the voltage offset of the half-wave of the current position, PreMaxV is the maximum positive (negative) voltage of the preceding half-wave to the half-wave of the current position, NextMaxV is the maximum positive (negative) voltage of the next half-wave from the half-wave of the current position, and MaxV is the maximum negative (positive) voltage of the half-wave of the current position.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 13, 2012
    Inventors: Ming-Fu TSAI, Cheng-Min LAI
  • MAGNETIC RING ENCODING DEVICE FOR COMPOSITE SIGNALS
    Publication number: 20120229123
    Abstract: A magnetic ring encoding device for composite signals, which is disposed at an end of a rotary shaft of a rotary motor. The magnetic ring encoding device includes: a magnetic ring having a ring-shaped body section synchronously rotatable with the rotary shaft of the rotary motor, multiple magnetic poles being arranged on the body section at equal intervals; multiple Hall elements located and arranged around the body section at intervals, the Hall elements serving to sense magnetic field change that takes place when the magnetic poles pass through the Hall elements and output sensed signals according to the magnetic field change; and an adder for performing addition operation for the sensed signals output from the Hall elements.
    Type: Application
    Filed: March 9, 2011
    Publication date: September 13, 2012
    Inventors: Chi-Yuan CHENG, Chih-Mao SHIAO, Ming Fu TSAI
  • VIDEO SWITCHING SYSTEM AND METHOD
    Publication number: 20120212571
    Abstract: A video switching system detects speaking information of at least one speaker in a video conference according to a reference time. One participant is regarded as one speaker if the one participant speaks longer than the reference time. The video switching system determines a main speaker of the at least one speaker according to the speaking information of the at least one speaker. The video switching system calculates an image switching frequency, and determines whether to switch to a video image of the main speaker according to the image switching frequency. The video switching system calculates a response time if determining to switch to the video image of the main speaker, and adjusts the reference time according to the image switching frequency and the response time.
    Type: Application
    Filed: April 28, 2011
    Publication date: August 23, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIH-HUANG WANG, HSIEH-FU TSAI
  • Entropy decoding method
    Patent number: 8243816
    Abstract: An entropy decoding method includes retrieving video data corresponding to an microcode, operating an entropy decoding operation on the video data to acquire a result, and retrieving video data corresponding to a subsequent microcode according to a MPS synchronously. The method further includes determining if the MPS matches the result, and operating an entropy decoding operation according to the subsequent microcode on the video data corresponding to the subsequent microcode if the MPS matches the result.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: August 14, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Yi-Shin Tung, Hsieh-Fu Tsai, Yi-Shin Li, Sheng-Che Huang